EN 62047-12-2011 en Semiconductor devices - Micro-electromechanical devices - Part 12 Bending fatigue testing method of thin film materials using resonant vibration of MEMS structu.pdf

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor devices Micro-electromechanical devicesPart 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structuresBS EN 62047-12:2011

2、National forewordThis British Standard is the UK implementation of EN 62047-12:2011. It isidentical to IEC 62047-12:2011.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest

3、to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580 76301 4ICS 31.080.99 Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standar

4、d was published under the authority of the StandardsPolicy and Strategy Committee on 30 November 2011.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62047-12:2011EUROPEAN STANDARD EN 62047-12 NORME EUROPENNE EUROPISCHE NORM October 2011 CENELEC European Committee

5、 for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

6、 Ref. No. EN 62047-12:2011 E ICS 31.080.99 English version Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011) Dispositifs semiconducteurs - Dispositifs microlectromca

7、niques - Partie 12: Mthode dessai de fatigue en flexion des matriaux en couche mince utilisant les vibrations la rsonance des structures systmes microlectromcaniques (MEMS) (CEI 62047-12:2011) Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prfung der Biege-Ermdun

8、gsfestigkeit von Dnnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen (IEC 62047-12:2011) This European Standard was approved by CENELEC on 2011-10-18. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for givi

9、ng this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three

10、official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electro

11、technical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden,

12、Switzerland and the United Kingdom. BS EN 62047-12:2011EN 62047-12:2011 - 2 - Foreword The text of document 47F/80/FDIS, future edition 1 of IEC 62047-12, prepared by SC 47F, “Micro-electromechanical systems“, of IEC TC 47, “Semiconductor device“, was submitted to the IEC-CENELEC parallel vote and a

13、pproved by CENELEC as EN 62047-12:2011. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-07-18 latest date by which the national standards conflicting with the docume

14、nt have to be withdrawn (dow) 2014-10-18 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the Internatio

15、nal Standard IEC 62047-12:2011 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 62047-2:2006 NOTE Harmonized as EN 62047-2:2006 (not modified). BS EN 62047-12:2011- 3

16、 - EN 62047-12:2011 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated refe

17、rences, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 62047-3 2006 Semiconductor devices - Micro

18、-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing EN 62047-3 2006 ISO 12107 - Metallic materials - Fatigue testing - Statistical planning and analysis of data - - BS EN 62047-12:2011 2 62047-12 IEC:2011 CONTENTS 1 Scope . 6 2 Normative references . 6 3 Terms and

19、definitions . 6 4 Test equipment . 7 4.1 General . 7 4.2 Actuator 8 4.3 Sensor 8 4.4 Controller 8 4.5 Recorder . 9 4.6 Parallel testing 9 5 Specimen . 9 5.1 General . 9 5.2 Resonant properties 9 5.3 Test part 9 5.4 Specimen fabrication . 9 6 Test conditions . 9 6.1 Test amplitude. 9 6.2 Load ratio 1

20、0 6.3 Vibration frequency . 10 6.4 Waveform 10 6.5 Test time . 10 6.6 Test environment. 10 7 Initial measurement 10 7.1 Reference strength measurement 10 7.2 Frequency response test . 11 8 Test 11 8.1 General . 11 8.2 Initial load application 11 8.3 Monitoring . 12 8.4 Counting the number of cycles

21、12 8.5 End of the test . 12 8.6 Recorded data . 12 9 Test report 12 Annex A (informative) Example of testing using an electrostatic device with an integrated actuation component and displacement detection component . 14 Annex B (informative) Example of testing using an external drive and a device wi

22、th an integrated strain gauge for detecting displacement . 17 Annex C (informative) Example of electromagnetic drive out-of-plane vibration test (external drive vibration test) 20 Annex D (informative) Theoretical expression on fatigue life of brittle materials based on Paris law and Weibull distrib

23、ution 23 Annex E (informative) Analysis examples. 27 Bibliography 29 BS EN 62047-12:201162047-12 IEC:2011 3 Figure 1 Block diagram of the test method . 7 Figure A.1 Microscope image of the specimen . 14 Figure A.2 Block diagram of test equipment . 15 Figure B.1 The specimens structure 17 Figure B.2

24、Block diagram of test equipment . 18 Figure C.1 Specimen for out-of-plane vibration testing . 20 Figure C.2 Block diagram of test equipment . 21 Figure E.1 Example of fatigue test results for silicon materials . 27 Figure E.2 Static strength and fatigue life of polysilicon plotted in 3D . 28 BS EN 6

25、2047-12:2011 6 62047-12 IEC:2011 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures 1 Scope This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of

26、microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 m to 1 000 m in the plane direction and from 1 m to 100 m in thickness, and test materials measuring under 1 mm in length, under 1 mm in

27、 width, and between 0,1 m and 10 m in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithogra

28、phy. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is

29、 to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated

30、references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-3:2006, Semiconductor devices Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing ISO 12107, Metallic

31、materials Fatigue testing Statistical planning and analysis of data 3 Terms and definitions For the purposes of this document the following terms and definitions apply 3.1 amplitude one-half the algebraic difference between the maximum value and minimum value in a loading cycle 3.2 load ratio algebr

32、aic ratio of the maximum value and minimum value of the load of a cycle 3.3 S-N curve plot of stress or strain (S) against the number of cycles (N) to failure BS EN 62047-12:201162047-12 IEC:2011 7 3.4 reference strength: static strength or instantaneous failure strength 3.5 instantaneous failure st

33、rength failure strength of quasi-static test or resonant vibration test at rapid amplitude growth Key 1 Specimen 2 Test part 3 Actuator 4 Sensor 5 Controller 6 Recorder 7 Force 8 Displacement or strain 9 Amplitude and frequency Figure 1 Block diagram of the test method 4 Test equipment 4.1 General T

34、he test equipment shall be capable of generating resonant vibration with constant amplitude and stable frequency to the test structure. A block diagram of the test equipment is shown in Figure 1. The test equipment consists of an actuator for oscillation, a sensor for amplitude detection, a controll

35、er for maintaining the resonant vibration at a constant amplitude, and a recorder for monitoring. The amplitude control method is classified as follows. a) Constant strain control Applied strain in the test part is maintained at constant. It can be applied for elastic or inductile materials. 3 1 2 8

36、 7 4 5 6 9 IEC 2064/11 BS EN 62047-12:2011 8 62047-12 IEC:2011 b) Constant stress control Applied stress in the test part is maintained at constant. Load monitoring and closed loop control is crucial for the method. 4.2 Actuator The actuator shall be capable of applying oscillation force of the nece

37、ssary amplitude and frequencies along the required direction. Various kind of actuators can be used, e.g., electrostatic, piezoelectric, thermal, and electromagnetic actuators. The actuator may be installed in the test structure, as discussed in 5.1. 4.3 Sensor The sensor shall be capable of measuri

38、ng the movement of the specimen to determine the stress amplitude (for constant stress amplitude testing) or the strain amplitude (for constant strain amplitude testing) to the test part of the specimen. The sensor and its associated electronics shall be accurate to within 1 % of the range of the st

39、ress or strain amplitude. The sensor should measure the movement continuously, in order to maintain a constant vibration and detect failure effectively. If the specimen is an elastic material and will not show the change in the vibrating properties, however, it is permissible to measure the movement

40、 at regular time intervals. The movement is detected by measuring displacement of the test structure or the stress or strain in the test structure. Clause A.2 shows a method for detecting rotational displacement of the mass from changes in capacitance. Clause B.2 shows a method using a strain gauge

41、integrated in the specimen. Clause C.2 shows a method for detecting displacement of the mass using a non-contact displacement gauge. 4.4 Controller The controller shall be capable of generating the oscillation signal to the actuator from the movement signal from the sensor, in order to maintain the

42、required resonant vibration. During testing, the amplitude and frequency of the specimen shall be maintained at a constant level. One of the following methods should be applied for the specimen, depending on the vibration characteristics. a) Closed loop method The frequency and amplitude of the osci

43、llation signal applied to the specimen shall be controlled to follow changes in the resonant frequency. In most cases, the signal applied to the actuator is generated from the movement signal of the specimen. A self-excited oscillation circuit or phase-locked loop circuit can be used as a means for

44、maintaining the resonant frequency. An automatic gain control circuit (AGC) can also be used to maintain a constant amplitude by changing the amplitude of the oscillation signal based on the detected amplitude. b) Open loop method Elastic or inductile materials that show a linear response but no pla

45、stic deformation may be tested using an open loop method. This test may be performed by stopping at regular intervals and measuring the resonant characteristics, or by actuating the test structure from the start to the end of testing at a predetermined resonance frequency and oscillation signal ampl

46、itude. The stability of the frequency and amplitude shall be maintained throughout the test to within 3 % of the desired value. BS EN 62047-12:201162047-12 IEC:2011 9 4.5 Recorder The test equipment shall include a recorder for collecting the “record data” indicated in 8.6. 4.6 Parallel testing The

47、test may be conducted in parallel with a number of equipment units. In this case, steps should be taken to eliminate mutual electrical or mechanical interference among the equipment units. 5 Specimen 5.1 General The specimen shall be capable of applying a constant and high-load amplitude to the test

48、 part via resonant vibration. Examples of specific structures are shown in the Clauses A.1, B.1, and C.1. It is permissible to integrate a mechanism in the specimen for actuating or for sensing the movement of the specimen. An example of a structure integrating mechanisms for actuation and detecting

49、 amplitude is shown in Annex A.1. An example of a structure integrating a mechanism for detecting amplitude only is shown in Annex B.1. 5.2 Resonant properties The specimen shall have resonance characteristics that enable the application of the required deformation (mode of vibration) in the specific frequency (resonance frequency) of the specimen. The resonant frequency should preferably be more than 1 000 Hz, in order to obtain a large number of the cycles in a