EN 62047-13-2012 en Semiconductor devices - Micro-electromechanical devices - Part 13 Bend- and shear - type test methods of measuring adhesive strength for MEMS structures《半导体器件 微.pdf

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor devices Micro-electromechanical devicesPart 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structuresBS EN 62047-13:2012National for

2、ewordThis British Standard is the UK implementation of EN 62047-13:2012. It isidentical to IEC 62047-13:2012.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secre

3、tary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. The British Standards Institution 2012Published by BSI Standards Limited 2012ISBN 978 0 580 69450 9ICS 31.080.99Compliance with a British Standard cannot co

4、nfer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 May 2012.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62047-13:2012EUROPEAN STANDARD EN 62047-13 NORME EUROPENNE EURO

5、PISCHE NORM April 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2012 CENELEC - All rights of exploitation in any form and by

6、any means reserved worldwide for CENELEC members. Ref. No. EN 62047-13:2012 E ICS 31.080.99 English version Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012) Dispositifs semicon

7、ducteurs - Dispositifs microlectromcaniques - Partie 13: Mthodes dessais de types courbure et cisaillement de mesure de la rsistance dadhrence pour les structures MEMS (CEI 62047-13:2012) Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprfverfahren zur Messung d

8、er Haftfestigkeit bei MEMS-Strukturen (IEC 62047-13:2012) This European Standard was approved by CENELEC on 2012-04-03. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard wit

9、hout any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any o

10、ther language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cy

11、prus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 62047-13:2012

12、EN 62047-13:2012 - 2 - Foreword The text of document 47F/109/FDIS, future edition 1 of IEC 62047-13, prepared by SC 47F, “Micro-electromechanical systems“, of IEC TC 47, “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-13:2012. The following

13、dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2013-01-03 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2015-04-03 Attention is

14、drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62047-13:2012 was approved by CENELEC

15、 as a European Standard without any modification. BS EN 62047-13:2012- 3 - EN 62047-13:2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document

16、 and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (

17、mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 62047-2 2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing methods of thin film materials EN 62047-2 2006 BS EN 62047-13:2012 2 62047-13 IEC:2012 CONTENTS 1 Scope . 5 2 Normative references .

18、5 3 Terms and definitions . 5 4 Test method . 6 4.1 General . 6 4.2 Data analysis 7 5 Test equipment . 8 5.1 General . 8 5.2 Actuator 8 5.3 Force measurement sensor . 8 5.4 Alignment system 8 5.5 Recorder . 8 6 Test pieces . 9 6.1 Design of test pieces . 9 6.2 Preparation of test pieces 9 7 Test con

19、ditions . 9 7.1 Method for gripping . 9 7.2 Speed of testing 9 7.3 Alignment of test piece 9 7.4 Test environment. 10 8 Test report 10 Annex A (informative) Technical background . 11 Bibliography 14 Figure 1 Columnar test pieces . 6 Figure 2 Adhesive strength test method . 7 Figure 3 Alignment betwe

20、en columnar test piece and loading tool 10 Figure A.1 Example of the RRT results (see 1) 11 Figure A.2 Effects of aspect ratio of columnar test piece on the stress condition in bend type test (see 2) . 12 Figure A.3 Effects of knife edge angle of loading tool and aspect ratio of columnar test piece

21、on the stress condition in bend test . 13 BS EN 62047-13:201262047-13 IEC:2012 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures 1 Scope This part of IEC 62047 specifies the adhesive testing method

22、 between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 m to 1 mm, respectively. Micro-sized elements of MEMS device

23、s are made up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operatio

24、n. Combination of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for micro-s

25、ized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing

26、machine for micro-sized materials has not been generalized. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the la

27、test edition of the referenced document (including any amendments) applies. IEC 62047-2:2006, Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials 3 Terms and definitions For the purposes of this document, the following terms and definitions app

28、ly. 3.1 adhesive bend strength nominal strength at failure on adhesive joint area by bending mode 3.2 adhesive shear strength nominal strength at failure on adhesive joint area by shear mode BS EN 62047-13:2012 6 62047-13 IEC:2012 DST312lc4342 1 IEC 192/12 Key Configurations or specimen Dimensions o

29、f specimen 1 Top view D diameter of columnar test piece 2 Side view lclength of columnar test piece 3 Column type test piece lc/D aspect ratio of columnar test piece 4 Substrate thickness of substrate S spacing between columnar test pieces Figure 1 Columnar test pieces 4 Test method 4.1 General This

30、 standard specifies the adhesive testing methods between a columnar test piece (see Figure 1) and substrate. Displacement or force is applied to a columnar test piece at a constant speed and the force at delamination is measured to analyze the adhesive strength between the columnar test piece and su

31、bstrate. A knife edge shape with tapered tip is utilized as the loading tool to apply the force to a columnar test piece. The angle of the knife edge is changed by loading types of measuring adhesive strength as follows. In case of measuring adhesive bend strength by applying bending force at the en

32、d of a columnar test piece (bend type test), the knife edge of loading tool is used by slanting its apex in the upper direction against the test piece as shown in Figure 2 a). In such a case, it is easier to align the loading tool and a test piece since point load is applied at the end of the column

33、ar test piece. Attention should be drawn to the fact that the bend type test is not pure bending, which includes compression component to the columnar root. The compression component increases by increasing the contact angle of the knife edge. In order to minimize the effect of compression component

34、, the contact angle of the knife edge (b) should be within a range of from 10 to 20. BS EN 62047-13:201262047-13 IEC:2012 7 In case of measuring adhesive shear strength by applying shear force on the lateral face of a columnar test piece (shear type test), line load is applied to the test piece usin

35、g a loading tool which is parallel to the lateral face of the cylinder as shown in Figure 2 b). In such a case, the test apparatus should have a precise alignment system, which can align the knife edge parallel to the lateral face of the cylinder. Or alternatively, the knife edge of loading tool is

36、used by slanting its apex in lower direction against the test piece as shown in Figure 2 b) to minimize the effects of bend stress (see Clause A.2).The angle error (s) should be within a range of from 0 to 15. It should be noted that the test results from the bend type test are affected by the aspec

37、t ratio (lc/D), when the aspect ratio is less than 1,2. See Clause A.2. In addition, the columnar test piece with the aspect ratio of less than 0,5 should not be applied in the bend type test; because the effects of the aspect ratio on the shear and the compression stress on the adhesive joint area

38、significantly increase when the aspect ratio decreases. See Clause A.2 and Clause A.3. 123FbRcltlp12s3 ltRclpF F 1 F ltclplp1 IEC 193/12 IEC 194/12 Figure 2a Bend type test Figure 2b Shear type test NOTE This figure illustrates two types of the test method for measuring adhesive strength between a c

39、olumnar test piece and substrate. Key Configurations or specimen Supply and dimensions of specimen 1 Columnar test piece F loading force supplied by a kind of actuator 2 Substrate lpdistance between the loading position and substrate 3 Knife edge of loading tool ltdistance between the tip of the loa

40、ding tool and substrate bangle between the lateral face of a columnar test piece and contact face of knife edge for bend type test sangle between the lateral face of a columnar test piece and contact face of knife edge for shear type test Figure 2 Adhesive strength test method 4.2 Data analysis In a

41、dhesive strength test by bend loading, adhesive bend strength is calculated by the following Equation (1). 3max3max3232DlFDlFZMcpaapp = (1) where BS EN 62047-13:2012 8 62047-13 IEC:2012 ais the adhesive bend strength; Z is the section modulus of a columnar test piece; Mais the bend moment at delamin

42、ation; Fmaxis the maximum load at delamination; lpis the loading point from the root of a columnar test piece. In adhesive strength test by shear loading, adhesive shear strength is calculated by the following Equation (2). 2maxmax4DFAFap = (2) where ais the adhesive bend strength; A is the adhesive

43、 joint area between a columnar test piece and substrate; Fmaxis the maximum load at delamination. In the bend type test, it is required to be attentive to the possibility of exfoliation due to shear force if the aspect ratio (lc/D) of the columnar test piece is less than 1,2. See 4.1 and Clause A.2.

44、 5 Test equipment 5.1 General The test equipment shall be capable of applying microscopic displacement or micro-level force to the test piece. The test equipment consists of an actuator for applying displacement, a sensor for force measurement, a controller applying displacement or force at a consta

45、nt speed, an alignment system between the test piece and the loading tool, and a recorder for detecting the load at delamination. 5.2 Actuator Displacement or force should be linearly applied along the loading axis of the test piece at a constant speed. Thus, the actuator shall be capable of linearl

46、y applying displacement or force at a constant speed. 5.3 Force measurement sensor Load cell with enough resolution, which guarantees 5 % accuracy of the measured adhesive strength shall be used for the force measurement. The force sensor shall be set to measure the force to the loading direction. T

47、he knife edge of the loading tool shall be located within the effective measuring area of the force sensor. See Figure 3. 5.4 Alignment system The alignment system shall be capable of aligning the test piece and loading tool in the proper position to apply displacement or force in the correct direct

48、ion (see 7.3). 5.5 Recorder The test equipment shall include a recorder for detecting the force at delamination. BS EN 62047-13:201262047-13 IEC:2012 9 6 Test pieces 6.1 Design of test pieces The test piece should satisfy the following two items: a) It is recommended that the dimensions of a test pi

49、ece, such as the columnar diameter and length, are in the same order as the size of parts of a device to be evaluated; b) Every gap between the test pieces (S) should provide more than twice compared with both the diameter of columnar test piece (D) and the length of test piece (lc) to prevent each piece from having an influence on the test of adjacent test piece (see Figure 1). In addition, the gap (S) should be sufficiently larg