EN 62228-2-2017 en Integrated circuits - EMC evaluation of transceivers - Part 2 LIN transceivers.pdf

1、Integrated circuits EMC evaluation of transceiversPart 2: LIN transceiversBS EN 62228-2:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of EN 62228-2:2017. It is identical to IEC 62228-2:2016. The UK

2、 participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible

3、for its correct application. The British Standards Institution 2017.Published by BSI Standards Limited 2017ISBN 978 0 580 87526 7ICS 31.200Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy an

4、d Strategy Committee on 28 February 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62228-2:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62228-2 February 2017 ICS 31.200 English Version Integrated circuits - EMC evaluation of transceivers - Part

5、 2: LIN transceivers (IEC 62228-2:2016) Circuits intgrs - valuation de la CEM des metteurs-rcepteurs - Partie 2: metteurs-rcepteurs LIN (IEC 62228-2:2016) Integrierte Schaltungen - Bewertung der elektromagnetischen Vertrglichkeit von Sende-Empfangsgerten - Teil 2: LIN-Sende-Empfangsgerte (IEC 62228-

6、2:2016) This European Standard was approved by CENELEC on 2016-12-23. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliogr

7、aphical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the respon

8、sibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finlan

9、d, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for

10、 Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Memb

11、ers. Ref. No. EN 62228-2:2017 E BS EN 62228-2:2017EN 62228-2:2017 2 European foreword The text of document 47A/994/FDIS, future edition 1 of IEC 62228-2, prepared by SC 47A “Integrated circuits“ of IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENEL

12、EC as EN 62228-2:2017. The following dates are fixed: latest date by which the document has to beimplemented at national level bypublication of an identical nationalstandard or by endorsement(dop) 2017-09-23 latest date by which the nationalstandards conflicting with thedocument have to be withdrawn

13、(dow) 2019-12-23 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62228-2

14、:2016 was approved by CENELEC as a European Standard without any modification. BS EN 62228-2:2017EN 62228-2:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively refe

15、renced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modi

16、fications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 61967-1 - Integrated circuits - Measurement of electromagnetic emissi

17、ons, 150 kHz to 1 GHz - Part 1: General conditions and definitions EN 61967-1 - IEC 61967-4 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method EN 61967-4 - IEC 62132-1 - Integrated cir

18、cuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions EN 62132-1 - IEC 62132-4 - Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 4: Direct RF power injection method EN 62132-4 - IEC 62215-3 - Integrated circuits - Measurem

19、ent of impulse immunity - Part 3: Non-synchronous transient injection method EN 62215-3 - ISO 7637-2 - Road vehicles - Electrical disturbances from conduction and coupling - Part-2: Electrical transient conduction along supply lines only - - ISO 10605 - Road vehicles - Test methods for electrical di

20、sturbances from electrostatic discharge - - ISO 17987-6 - Road vehicles - Local Interconnect Network (LIN) - Part 6: Protocol conformance test specification - - BS EN 62228-2:2017 2 IEC 62228-2:2016 IEC 2016 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references 7 3 Terms, definitions and abbreviati

21、ons . 8 3.1 Terms and definitions 8 3.2 Abbreviations 8 4 General . 8 5 Test and operating conditions 9 5.1 Supply and ambient conditions 9 5.2 Test operation modes . 10 5.3 Test configuration . 10 5.3.1 General test configuration for functional test 10 5.3.2 General test configuration for unpowered

22、 ESD test 11 5.3.3 Coupling ports and coupling networks for functional tests 11 5.3.4 Coupling ports and coupling networks for unpowered ESD tests 12 5.4 Test signals 13 5.4.1 General . 13 5.4.2 Test signals for normal operation mode . 13 5.4.3 Test signal for wake-up from sleep mode . 14 5.5 Evalua

23、tion criteria . 14 5.5.1 General . 14 5.5.2 Evaluation criteria in functional operation modes during exposure to disturbances 15 5.5.3 Evaluation criteria in unpowered condition after exposure to disturbances 16 5.5.4 Status classes . 17 6 Test and measurement 17 6.1 Emission of RF disturbances . 17

24、 6.1.1 Test method 17 6.1.2 Test setup . 17 6.1.3 Test procedure and parameters . 18 6.2 Immunity to RF disturbances . 19 6.2.1 Test method 19 6.2.2 Test setup . 19 6.2.3 Test procedure and parameters . 20 6.3 Immunity to impulses 22 6.3.1 Test method 22 6.3.2 Test setup . 23 6.3.3 Test procedure an

25、d parameters . 23 6.4 Electrostatic Discharge (ESD) . 26 6.4.1 Test method 26 6.4.2 Test setup . 26 6.4.3 Test procedure and parameters . 28 7 Test report . 28 Annex A (normative) LIN test circuits . 29 A.1 General . 29 BS EN 62228-2:2017IEC 62228-2:2016 IEC 2016 3 A.2 LIN test circuit for standard

26、LIN transceiver ICs for functional tests . 29 A.3 LIN test circuit for IC with embedded LIN transceiver for functional tests 31 A.4 LIN test circuit for LIN transceiver ICs for unpowered ESD test . 32 Annex B (normative) Test circuit boards. 33 B.1 Test circuit board for functional tests 33 B.2 ESD

27、test . 33 Annex C (informative) Examples for test limits for LIN transceiver in automotive application 35 C.1 General . 35 C.2 Emission of RF disturbances . 35 C.3 Immunity to RF disturbances . 36 C.4 Immunity to impulses 37 C.5 Electrostatic Discharge (ESD) . 37 Annex D (informative) Test of indire

28、ct ESD discharge 38 D.1 General . 38 D.2 Test setup . 38 D.3 Typical current wave form for indirect ESD test . 39 D.4 Test procedure and parameters 39 Figure 1 General test configuration for tests in functional operation modes 10 Figure 2 General test configuration for unpowered ESD test 11 Figure 3

29、 Coupling ports and networks for functional tests 11 Figure 4 Coupling ports and networks for unpowered ESD tests 12 Figure 5 Principal drawing of the maximum deviation on an I-V characteristic 16 Figure 6 Test setup for measurement of RF disturbances 18 Figure 7 Test setup for DPI tests 19 Figure 8

30、 Test setup for impulse immunity tests 23 Figure 9 Test setup for direct ESD tests . 27 Figure A.1 General drawing of the circuit diagram of test network for standard LIN transceiver ICs for functional test 30 Figure A.2 General drawing of the circuit diagram of the test network for ICs with embedde

31、d LIN transceiver for functional test 32 Figure A.3 General drawing of the circuit diagram for direct ESD tests of LIN transceiver ICs in unpowered mode 32 Figure B.1 Example of IC interconnections of LIN signal 33 Figure B.2 Example of ESD test board for LIN transceiver ICs . 34 Figure C.1 Example

32、of limits for RF emission . 36 Figure C.2 Example of limits for RF immunity for functional status class AIC. 36 Figure C.3 Example of limits for RF immunity for functional status class CICor DIC37 Figure D.1 Test setup for indirect ESD tests 38 Figure D.2 Example of ESD current wave form for indirec

33、t ESD test at VESD= -8 kV . 39 Table 1 Overview of required measurements and tests 9 Table 2 Supply and ambient conditions for functional operation . 10 Table 3 Definition of coupling ports and coupling network component values for functional tests . 12 BS EN 62228-2:2017 4 IEC 62228-2:2016 IEC 2016

34、 Table 4 Definitions of coupling ports for unpowered ESD tests . 13 Table 5 Communication test signal TX1 . 13 Table 6 Communication test signal TX2 . 14 Table 7 Wake-up test signal TX3 . 14 Table 8 Evaluation criteria for Standard LIN transceiver IC in functional operation modes . 15 Table 9 Evalua

35、tion criteria for ICs with embedded LIN transceiver in functional operation modes . 16 Table 10 Definition of functional status classes 17 Table 11 Parameters for emission measurements 18 Table 12 Settings of the RF measurement equipment 19 Table 13 Specifications for DPI tests . 20 Table 14 Require

36、d DPI tests for functional status class AICevaluation of standard LIN transceiver ICs . 21 Table 15 Required DPI tests for functional status class AICevaluation of ICs with embedded LIN transceiver 22 Table 16 Required DPI tests for functional status class CICor DICevaluation of standard LIN transce

37、iver ICs and ICs with embedded LIN transceiver . 22 Table 17 Specifications for impulse immunity tests 24 Table 18 Parameters for impulse immunity test 24 Table 19 Required impulse immunity tests for functional status class AICevaluation of standard LIN transceiver ICs . 25 Table 20 Required impulse

38、 immunity tests for functional status class AICevaluation of ICs with embedded LIN transceiver . 25 Table 21 Required impulse immunity tests for functional status class CICor DICevaluation of standard LIN transceiver ICs and ICs with embedded LIN transceiver 26 Table 22 Recommendations for direct ES

39、D tests 28 Table B.1 Parameter ESD test circuit board . 34 Table C.1 Example of limits for impulse immunity for functional status class CICor DIC37 Table D.1 Specifications for indirect ESD tests 40 BS EN 62228-2:2017IEC 62228-2:2016 IEC 2016 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED

40、CIRCUITS EMC EVALUATION OF TRANSCEIVERS Part 2: LIN transceivers FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of IEC is to promoteinternational

41、co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, IEC publishes International Standards, Technical Specifications,Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred

42、to as “IECPublication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interestedin the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this p

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44、nsus of opinion on the relevant subjects since each technical committee has representation from allinterested IEC National Committees.3) IEC Publications have the form of recommendations for international use and are accepted by IEC NationalCommittees in that sense. While all reasonable efforts are

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46、ently to the maximum extent possible in their national and regional publications. Any divergencebetween any IEC Publication and the corresponding national or regional publication shall be clearly indicated inthe latter.5) IEC itself does not provide any attestation of conformity. Independent certifi

47、cation bodies provide conformityassessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for anyservices carried out by independent certification bodies.6) All users should ensure that they have the latest edition of this publication.7) No liability shall att

48、ach to IEC or its directors, employees, servants or agents including individual experts andmembers of its technical committees and IEC National Committees for any personal injury, property damage orother damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees)

49、 andexpenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IECPublications.8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications isindispensable for the correct application of this publication.9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject ofpatent rights. IEC shall not