EN 62739-1-2013 en Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1 Erosion test method for metal materials without surface processi.pdf

1、BSI Standards PublicationTest method for erosion of wave solering equipment bymolten lead free solder alloyPart 1: Erosion test method for the metalic material without surface treatmentBS EN 62739-1:2013osion of wave soldering equipment using molten lead-free solder alloyPart 1: Erosion test method

2、for metal materials without surface processingNational forewordThis British Standard is the UK implementation of EN 62739-1:2013. It isidentical to IEC 62739-1:2013.BSI, as a member of CENELEC, is obliged to publish EN 62739-1:2013 as aBritish Standard. However, attention is drawn to the fact that t

3、he UK committee has voted against its approval as a European Standard.The UK committee advises that it is current European practice for suppliersof lead-free wave soldering equipment to perform the relevant tests todemonstrate fitness of purpose.The UK participation in its preparation was entrusted

4、to TechnicalCommittee EPL/501, Electronic assembly technology 31.240Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 September 2013.Amendments issued since publi

5、cationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62739-1:2013EUROPEAN STANDARDEN 62739-1NORME EUROPENNEEUROPISCHE NORMAugust 2013CENELECEuropean Committee for Electrotechnical StandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische NormungCEN-CENE

6、LEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 62739-1:2013 EICS 31.190; 31.240English versionTest method for erosion of wave soldering equipment using molten lead-fr

7、ee solder alloy -Part 1: Erosion test method for metal materials without surface processing(IEC 62739-1:2013)Mthode dessai de lrosion delquipement de brasage la vague utilisant un alliage braser sans plomb fondu -Partie 1: Mthode dessai drosion des matriaux mtalliques sans traitement de surface(CEI

8、62739-1:2013)Verfahren zur Erosionsprfung fr Wellenltausrstungen bei Verwendung von geschmolzener, bleifreier Lotlegierung -Teil 1: Erosionsprfverfahren fr metallische Werkstoffe ohne Oberflchenbehandlung(IEC 62739-1:2013)This European Standard was approved by CENELEC on 2013-07-23. CENELEC members

9、are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to

10、 the CEN-CENELEC Management Centre or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Manag

11、ement Centre has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Irel

12、and, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.BS EN 62739-1:2013Amendments/corrigenda issued since publicationDate Text affectedEUROPEAN STANDARDEN 62739-1NORME EUROP

13、ENNEEUROPISCHE NORMAugust 2013CENELECEuropean Committee for Electrotechnical StandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische NormungCEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in a

14、ny form and by any means reserved worldwide for CENELEC members.Ref. No. EN 62739-1:2013 EICS 31.190; 31.240English versionTest method for erosion of wave soldering equipment using molten lead-free solder alloy -Part 1: Erosion test method for metal materials without surface processing(IEC 62739-1:2

15、013)Mthode dessai de lrosion delquipement de brasage la vague utilisant un alliage braser sans plomb fondu -Partie 1: Mthode dessai drosion des matriaux mtalliques sans traitement de surface(CEI 62739-1:2013)Verfahren zur Erosionsprfung fr Wellenltausrstungen bei Verwendung von geschmolzener, bleifr

16、eier Lotlegierung -Teil 1: Erosionsprfverfahren fr metallische Werkstoffe ohne Oberflchenbehandlung(IEC 62739-1:2013)This European Standard was approved by CENELEC on 2013-07-23. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving t

17、his European Standard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.This European Standard exists in three offici

18、al versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.CENELEC members are the national electrotechnic

19、al committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slo

20、vakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.BS EN 62739-1:2013EN 62739-1:2013 - 2 -ForewordThe text of document 91/1092/FDIS, future edition 1 of IEC 62739-1, prepared by IEC TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and app

21、roved by CENELEC as EN 62739-1:2013.The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 2014-04-23 latest date by which the national standards conflicting with the document ha

22、ve to be withdrawn(dow) 2016-07-23Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights.Endorsement noticeThe text of the International Stand

23、ard IEC 62739-1:2013 was approved by CENELEC as a European Standard without any modification.In the official version, for Bibliography, the following note has to be added for the standard indicated:IEC 60194:2006 NOTE Harmonized as EN 60194:2006.BS EN 62739-1:2013- 3 - EN 62739-1:2013Annex ZA (norma

24、tive)Normative references to international publicationswith their corresponding European publicationsThe following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated

25、references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD YearIEC 60068-2-20 2008 Environmental testing -

26、Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leadsEN 60068-2-20 2008IEC 61190-1-3 Attachment materials for electronic assembly -Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electron

27、ic soldering applicationsEN 61190-1-3BS EN 62739-1:2013EN 62739-1:2013 - 2 -ForewordThe text of document 91/1092/FDIS, future edition 1 of IEC 62739-1, prepared by IEC TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62739-1:2013.Th

28、e following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 2014-04-23 latest date by which the national standards conflicting with the document have to be withdrawn(dow) 2016-07-23Atte

29、ntion is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights.Endorsement noticeThe text of the International Standard IEC 62739-1:2013 was approved by C

30、ENELEC as a European Standard without any modification.In the official version, for Bibliography, the following note has to be added for the standard indicated:IEC 60194:2006 NOTE Harmonized as EN 60194:2006.BS EN 62739-1:2013- 3 - EN 62739-1:2013Annex ZA (normative)Normative references to internati

31、onal publicationswith their corresponding European publicationsThe following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the

32、referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD YearIEC 60068-2-20 2008 Environmental testing -Part 2-20: Tests - Test T: Test method

33、s for solderability and resistance to soldering heat of devices with leadsEN 60068-2-20 2008IEC 61190-1-3 Attachment materials for electronic assembly -Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applicationsEN 61190-1-3B

34、S EN 62739-1:2013 2 62739-1 IEC:2013 CONTENTS 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Test 6 4.1 Overview . 6 4.2 Test equipment . 6 4.2.1 Test equipment description 6 4.2.2 Configuration example of test equipment 6 4.3 Specimen 7 4.4 Test conditions 9 4.5 Test method 9

35、4.5.1 Test procedure 9 4.5.2 Dross removal procedure . 10 5 Method of erosion depth measurement (focal depth method with optical microscope) 10 5.1 General . 10 5.2 Preparation of the specimen 10 5.3 Measurement equipment . 10 5.4 Measurement procedure 11 6 Items to be recorded in test report 12 Ann

36、ex A (normative) Specifications of test equipment b) test and measuring equipment manufacturer and equipment number; c) specimen: 1) material and number; 2) thermal refining; 3) processing conducted (e.g. cutting, grinding); 4) surface condition; d) solder material; e) test conditions: 1) temperatur

37、e of molten solder; 2) rotation speed; f) presence/absence of erosion, depth of erosion; g) condition of erosion (details of the erosions condition; photographs that indicate the location of the erosion). BS EN 62739-1:201362739-1 IEC:2013 13 Annex A (normative) Specifications of test equipment is t

38、he position parameter; is the scale parameter. b) Define y of Gumbel probability paper. y is the standardization variable of the double exponential distribution (Gumbel distribution) and is given by Equation (B.2) if combined with Equation (B.1). In this case, y presents the vertical axis of the pro

39、bability paper. y = lnlnF(x) = (1/) x (/) (B.2) c) If plotted on a Gumbel probability paper (with the vertical axis y and the horizontal axis x), the data give a straight line as shown in Figure B.2. x is when y = 0. 1/ is given by the slope of the line y /x. d) How to obtain the maximum erosion dep

40、th. The return period T is defined by dividing the total area by the area of the sample section. Here, the maximum value of x, xmax, can be obtained from Equation (B.3) as a function of T, , and . xmax+lnln(11/T) +lnT (B.3) The maximum erosion depth can be finally estimated following this procedure.

41、 BS EN 62739-1:201362739-1 IEC:2013 17 5 4 3 2 1 0 1 2 0 0,01 0,02 0,03 0,04 0,05 0,06 x (mm) (T = 10) x y=InInF(x)y IEC 1433/13 Key y standardization variable x erosion depth F(x) cumulative distribution Figure B.2 Estimated maximum erosion depth for N = 8 BS EN 62739-1:2013BS EN 62739-1:2013IEC 62

42、739-1:2013 16 62739-1 IEC:2013 B.3.3 Measurement of erosion depth The measurement of the erosion depth is not explicitly specified herein. To obtain accurate data, however, it is preferable to perform acid pickling to remove the solder and X-ray CT scanning to measure the depth. As for the measureme

43、nt precision of the measurement equipment, the tolerance shall be 5 m from actual erosion depth. B.3.4 Data arranging method Data arrangement is carried out following the steps outlined below. a) Define a Gumbel distribution. The Gumbels maximum value distribution F(x) is obtained by Equation (B.1).

44、 F(x) = expexp (x)/ (B.1) where x is the maximum erosion depth in the section; is the position parameter; is the scale parameter. b) Define y of Gumbel probability paper. y is the standardization variable of the double exponential distribution (Gumbel distribution) and is given by Equation (B.2) if

45、combined with Equation (B.1). In this case, y presents the vertical axis of the probability paper. y = lnlnF(x) = (1/) x (/) (B.2) c) If plotted on a Gumbel probability paper (with the vertical axis y and the horizontal axis x), the data give a straight line as shown in Figure B.2. x is when y = 0.

46、1/ is given by the slope of the line y /x. d) How to obtain the maximum erosion depth. The return period T is defined by dividing the total area by the area of the sample section. Here, the maximum value of x, xmax, can be obtained from Equation (B.3) as a function of T, , and . xmax+lnln(11/T) +lnT

47、 (B.3) The maximum erosion depth can be finally estimated following this procedure. BS EN 62739-1:201362739-1 IEC:2013 17 5 4 3 2 1 0 1 2 0 0,01 0,02 0,03 0,04 0,05 0,06 x (mm) (T = 10) x y=InInF(x)y IEC 1433/13 Key y standardization variable x erosion depth F(x) cumulative distribution Figure B.2 E

48、stimated maximum erosion depth for N = 8 BS EN 62739-1:2013BS EN 62739-1:2013IEC 62739-1:2013 18 62739-1 IEC:2013 Bibliography IEC 60194:2006, Printed board design, manufacture and assembly Terms and definitions ISO 16143-1:2004, Stainless steels for general purposes Part 1: Flat products ISO 16143-

49、2:2004, Stainless steels for general purposes Part 2: Semi-finished products, bars, rods and sections ISO 16143-3:2005, Stainless steels for general purposes Part 3: Wire _ BS EN 62739-1:2013BS EN 62739-1:2013IEC 62739-1:2013This page deliberately left blankBSI is the national body responsible for preparing British Standards and other standards-related p