EN 62779-1-2016 en Semiconductor devices - Semiconductor interface for human body communication - Part 1 General requirements.pdf

1、Semiconductor devices Semiconductor interface forhuman body communicationPart 1: General requirementsBS EN 62779-1:2016BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of EN 62779-1:2016. It isidentical t

2、o IEC 62779-1:2016.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contrac

3、t. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 77912 1ICS 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authori

4、ty of theStandards Policy and Strategy Committee on 30 June 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62779-1:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62779-1 June 2016 ICS 31.080.01 English Version Semiconductor devices - Semiconducto

5、r interface for human body communication - Part 1: General requirements (IEC 62779-1:2016) Dispositifs semiconducteurs - Interface semiconducteurs pour les communications via le corps humain - Partie 1: Exigences gnrales (IEC 62779-1:2016) Halbleiterbauelemente - Halbleiterschnittstelle zur Kommunik

6、ation ber den menschlichen Krper - Teil 1: Allgemeine Anforderungen (IEC 62779-1:2016) This European Standard was approved by CENELEC on 2016-03-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the stat

7、us of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French

8、, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, B

9、elgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Swe

10、den, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploi

11、tation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62779-1:2016 E BS EN 62779-1:2016EN 62779-1:2016 2 European foreword The text of document 47/2267/FDIS, future edition 1 of IEC 62779-1, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENE

12、LEC parallel vote and approved by CENELEC as EN 62779-1:2016. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-12-24 latest date by which the national standards confl

13、icting with the document have to be withdrawn (dow) 2019-03-24 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The

14、text of the International Standard IEC 62779-1:2016 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated : IEC 62779 NOTE Harmonized in EN 62779 series. BS EN 62779-1:2016 2 I

15、EC 62779-1:2016 IEC 2016 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references. 6 3 Terms, definitions and letter symbols . 6 3.1 General terms . 6 3.2 Rating and characteristics . 7 3.2.1 Input characteristics . 7 3.2.2 Transfer characteristics 7 3.3 Letter symbols 9 4 General req

16、uirements for HBC semiconductor interface 9 4.1 General specifications . 9 4.1.1 General . 9 4.1.2 Function 9 4.1.3 Implementation types . 10 4.2 Constructional specifications . 10 4.3 Electrical specifications . 11 4.3.1 General . 11 4.3.2 Power supply characteristics 11 4.3.3 Power supply type 11

17、4.3.4 Dynamic characteristics of analog front end 11 4.3.5 CDR circuit interface 11 4.3.6 Modem interface 12 4.3.7 Limiting values . 12 4.3.8 Temperatures 12 4.4 Operating specifications 12 4.4.1 Application . 12 4.4.2 Grounding condition . 13 4.4.3 Contact condition . 13 Annex A (informative) Gener

18、al description of HBC 14 Annex B (informative) Generation of powerline noise signal in HBC 15 Annex C (informative) Calculation of sensitivity level 16 Bibliography . 17 Figure 1 Definition of cut-off frequency and bandwidth 8 Figure 2 Block diagram (example) 10 Figure A.1 HBC applications 14 Figure

19、 B.1 Coupling of electromagnetic fields and the human body . 15 Table 1 Letter symbols . 9 BS EN 62779-1:2016IEC 62779-1:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION Part 1: General requirements FOREWORD 1) The

20、 International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and

21、 electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical com

22、mittees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization f

23、or Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committe

24、e has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is ac

25、curate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regi

26、onal publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in

27、 some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agen

28、ts including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of,

29、or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some o

30、f the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62779-1 has been prepared by IEC technical committee 47:Semiconductor devices. The text of this standard is based on

31、 the following documents: FDIS Report on voting 47/2267/FDIS 47/2277/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 6277

32、9-1:2016 4 IEC 62779-1:2016 IEC 2016 A list of all parts in the IEC 62779 series, published under the general title Semiconductor devices Semiconductor interface for human body communication, can be found on the IEC website. The committee has decided that the contents of this publication will remain

33、 unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page

34、 of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS EN 62779-1:2016IEC 62779-1:2016 IEC 2016 5 INTRODUCTION The IEC 62779 series is composed of t

35、hree parts as follow: IEC 62779-1 defines general requirements of a semiconductor interface for human body communication. It includes general and functional specifications of the interface. IEC 62779-2 defines a measurement method on electrical performances of an electrode that constructs a semicond

36、uctor interface for human body communication. IEC 62779-31defines functional type of a semiconductor interface for human body communication, and operational conditions of the interface. IEC 60748-4 gives requirements on interface integrated circuits for semiconductor devices. Especially, Chapter III

37、, Section 7 in this standard is applied to interface circuits for a communication network using a general channel, such as wire or wireless. However, a channel for HBC is the human body whose channel properties, such as signal loss and delay profile, are different from the general channel, so Chapte

38、r III, Section 7 cant be applied to an interface for HBC. Furthermore, a standard on a communication protocol for body area network (BAN) IEEE 802.15.6, which includes a communication protocol for HBC was published in 2012. A common interface for HBC should be defined to secure communication compati

39、bility between various devices that are implemented on/inside the human body or embedded in peripheral equipments. _ 1To be published. BS EN 62779-1:2016 6 IEC 62779-1:2016 IEC 2016 SEMICONDUCTOR DEVICES SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION Part 1: General requirements 1 Scope This p

40、art of IEC 62779 defines general requirements for a semiconductor interface used in human body communication (HBC). It includes general and functional specifications of the interface, as well as limiting values and its operating conditions. NOTE Additional information on HBC is provided in Annex A.

41、2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amend

42、ments) applies. None. 3 Terms, definitions and letter symbols For the purposes of this document, the following terms and definitions apply. 3.1 General terms 3.1.1 HBC semiconductor interface semiconductor interface to process an electrical signal that is transmitted to the human body or received fr

43、om the human body while located between the human body and HBC modem; implemented on/inside the human body and embedded in peripheral equipment Note 1 to entry: HBC semiconductor interface consists of an electrode and analog front end. The HBC modem converts data into an electrical signal and sends

44、it to the electrode, or receives an electrical signal from the analog front end and converts it into data. Note 2 to entry: This note applies to the French language only. 3.1.2 electrode physical structure to transmit an electrical signal between an analog front end and the human body while attached

45、 to or located near the human body Note 1 to entry: An electrode transfers an electrical signal to be transmitted to a non-metallic transmission channel, the human body. It also transfers an electrical signal received from the human body to the analog front end. 3.1.3 analog front end semiconductor

46、integrated circuit to recover original data from a receiving signal transmitted through the human body Note 1 to entry: Analog front end includes a powerline noise reduction filter, a signal amplifier, a high-pass filter, a comparator and a clock and data recovery (CDR) circuit to recover original d

47、ata transmitted through a non-BS EN 62779-1:2016IEC 62779-1:2016 IEC 2016 7 metallic transmission channel. Also, it generates control signals to control operations of each component in the analog front end. 3.1.4 powerline noise reduction filter circuit component in an analog front end to remove a p

48、owerline noise signal included in a receiving signal by an antenna function of the human body Note 1 to entry: Additional information on generation of a powerline noise signal is provided in Annex B. 3.1.5 comparator circuit component in an analog front end to compare two signals and switch its outp

49、ut signal to indicate which is larger 3.1.6 CDR circuit circuit component in an analog front end to generate a clock from a receiving signal and align phase of the receiving signal to the generated clock 3.2 Rating and characteristics 3.2.1 Input characteristics 3.2.1.1 supply voltage VSsupply voltage to operate a HBC semiconductor interface 3.2.1.2 normal mode supply current IStotal supply current during normal mode of a HBC semiconductor interface 3.2.1.3 disa