ImageVerifierCode 换一换
格式:PDF , 页数:21 ,大小:146.11KB ,
资源ID:739363      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-739363.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(ETSI TS 102 671-2018 Smart Cards Machine to Machine UICC Physical and logical characteristics (V12 0 0 Release 12).pdf)为本站会员(花仙子)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ETSI TS 102 671-2018 Smart Cards Machine to Machine UICC Physical and logical characteristics (V12 0 0 Release 12).pdf

1、 ETSI TS 102 671 V12.0.0 (2018-07) Smart Cards; Machine to Machine UICC; Physical and logical characteristics (Release 12) TECHNICAL SPECIFICATION ETSI ETSI TS 102 671 V12.0.0 (2018-07)2Release 12Reference RTS/SCP-T090071vc00 Keywords M2M, MFF ETSI 650 Route des Lucioles F-06921 Sophia Antipolis Ced

2、ex - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Siret N 348 623 562 00017 - NAF 742 C Association but non lucratif enregistre la Sous-Prfecture de Grasse (06) N 7803/88 Important notice The present document can be downloaded from: http:/www.etsi.org/standards-search The present document m

3、ay be made available in electronic versions and/or in print. The content of any electronic and/or print versions of the present document shall not be modified without the prior written authorization of ETSI. In case of any existing or perceived difference in contents between such versions and/or in

4、print, the only prevailing document is the print of the Portable Document Format (PDF) version kept on a specific network drive within ETSI Secretariat. Users of the present document should be aware that the document may be subject to revision or change of status. Information on the current status o

5、f this and other ETSI documents is available at https:/portal.etsi.org/TB/ETSIDeliverableStatus.aspx If you find errors in the present document, please send your comment to one of the following services: https:/portal.etsi.org/People/CommiteeSupportStaff.aspx Copyright Notification No part may be re

6、produced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm except as authorized by written permission of ETSI. The content of the PDF version shall not be modified without the written authorization of ETSI. The copyright and the foregoing restric

7、tion extend to reproduction in all media. ETSI 2018. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTMand the ETSI logo are trademarks of ETSI registered for the benefit of its Members. 3GPPTM and LTETMare trademarks of ETSI registered for the benefit of its Members and of the 3GPP Organizational Par

8、tners. oneM2M logo is protected for the benefit of its Members. GSMand the GSM logo are trademarks registered and owned by the GSM Association. ETSI ETSI TS 102 671 V12.0.0 (2018-07)3Release 12Contents Intellectual Property Rights 5g3Foreword . 5g3Modal verbs terminology 5g31 Scope 6g32 References 6

9、g32.1 Normative references . 6g32.2 Informative references 7g33 Definitions and abbreviations . 7g33.1 Definitions 7g33.2 Abbreviations . 7g34 Overview 8g35 Definition of Environmental Classes 8g35.1 Environmental condition classification system 8g35.1.0 Environmental property indicators . 8g35.1.1

10、Storage of environmental properties . 8g35.1.2 EFENV-CLASSES9g35.2 Operational and Storage Temperature (TX) . 9g35.2.0 Overview 9g35.2.1 Temperature (TS) -25 C to +85 C 9g35.2.2 Temperature (TA) -40 C to +85 C . 9g35.2.3 Temperature (TB) -40 C to +105 C . 9g35.2.4 Temperature (TC) -40 C to +125 C .

11、9g35.3 Moisture/Reflow conditions (MX) . 10g35.3.0 Overview 10g35.3.1 Moisture/Reflow conditions (MA) . 10g35.4 Humidity (HX) . 10g35.4.0 Overview 10g35.4.1 Humidity (class HA) - High humidity 10g35.5 Corrosion (CX) . 10g35.5.0 Overview 10g35.5.1 Corrosion (CA to CD) - Salt atmosphere 10g35.6 Vibrat

12、ion (VX) . 11g35.6.0 Overview 11g35.6.1 Vibration (VA) - Automotive vibration 11g35.7 Void 11g35.8 Shock (SX) . 11g35.8.0 Overview 11g35.8.1 Shock (SA) - Automotive shock . 11g35.9 Data Retention Time (RX) . 11g35.9.0 Overview 11g35.9.1 Data Retention Time (RA) - 10 years . 11g35.9.2 Data Retention

13、Time (RB) - 12 years . 11g35.9.3 Data Retention Time (RC) - 15 years . 11g35.10 Minimum Updates (UX) 12g35.10.0 Overview 12g35.10.1 Minimum Updates (UA) - 100 000 . 12g35.10.2 Minimum Updates (UB) - 500 000 . 12g35.10.3 Minimum Updates (UC) - 1 000 000 12g36 M2M UICC - Physical Characteristics . 12g

14、36.0 Basic requirements . 12g36.1 General M2M UICC physical characteristics . 12g36.1.0 Introduction. 12g36.1.1 Contacts 12g3ETSI ETSI TS 102 671 V12.0.0 (2018-07)4Release 126.2 Specific MFF physical characteristics 12g36.2.0 Introduction. 12g36.2.1 MFF1 13g36.2.1.0 Dimensions 13g36.2.1.1 Orientatio

15、n mark for the bottom of the package . 14g36.2.1.2 Orientation mark for top of package . 14g36.2.2 MFF2 15g36.2.2.1 Dimensions 15g36.2.2.2 Orientation mark for the bottom of the package . 16g36.2.2.3 Orientation mark for top of package . 16g37 Electrical and Logical specifications of the MFF UICC -

16、Terminal interface . 16g37.0 Requirements 16g37.1 Voltage Class support . 16g38 Device Pairing Mechanism 16g38.0 Introduction 16g38.1 Secure Channel Pairing 16g38.2 CAT application pairing . 17g3Annex A (informative): PCB layout for the MFF 18g3Annex B (informative): Change history . 20g3History 21g

17、3ETSI ETSI TS 102 671 V12.0.0 (2018-07)5Release 12Intellectual Property Rights Essential patents IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The information pertaining to these essential IPRs, if any, is publicly available for ETSI members and no

18、n-members, and can be found in ETSI SR 000 314: “Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in respect of ETSI standards“, which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web server (https:/ipr.etsi.org/). Pu

19、rsuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web server) which are, or may be, or may become, essential to the present d

20、ocument. Trademarks The present document may include trademarks and/or tradenames which are asserted and/or registered by their owners. ETSI claims no ownership of these except for any which are indicated as being the property of ETSI, and conveys no right to use or reproduce any trademark and/or tr

21、adename. Mention of those trademarks in the present document does not constitute an endorsement by ETSI of products, services or organizations associated with those trademarks. Foreword This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP). The con

22、tents of the present document are subject to continuing work within TC SCP and may change following formal TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with an identifying change of release date and an increase in version number as fol

23、lows: Version x.y.z where: x the first digit: 0 early working draft; 1 presented to TC SCP for information; 2 presented to TC SCP for approval; 3 or greater indicates TC SCP approved document under change control. y the second digit is incremented for all changes of substance, i.e. technical enhance

24、ments, corrections, updates, etc. z the third digit is incremented when editorial only changes have been incorporated in the document. Modal verbs terminology In the present document “shall“, “shall not“, “should“, “should not“, “may“, “need not“, “will“, “will not“, “can“ and “cannot“ are to be int

25、erpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of provisions). “must“ and “must not“ are NOT allowed in ETSI deliverables except when used in direct citation. ETSI ETSI TS 102 671 V12.0.0 (2018-07)6Release 121 Scope The present document details the te

26、chnical specifications for M2M UICCs. Specifically, the present document specifies: Physical, logical and electrical specifications for additional machine to machine form factors for the M2M UICC. Environmental specifications of the M2M UICC dedicated to M2M applications for all specified UICC form

27、factors. Device pairing mechanisms that allow the M2M UICC to verify the terminal with which it is operating. 2 References 2.1 Normative references References are either specific (identified by date of publication and/or edition number or version number) or non-specific. For specific references, onl

28、y the cited version applies. For non-specific references, the latest version of the referenced document (including any amendments) applies. In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version of that document in the same Release as the pr

29、esent document. Referenced documents which are not found to be publicly available in the expected location might be found at https:/docbox.etsi.org/Reference. NOTE: While any hyperlinks included in this clause were valid at the time of publication ETSI cannot guarantee their long term validity. The

30、following referenced documents are necessary for the application of the present document. 1 ETSI TS 102 221: “Smart Cards; UICC-Terminal interface; Physical and logical characteristics“. 2 ETSI TS 102 412: “Smart Cards; Smart Card Platform Requirements Stage 1“. 3 ETSI TS 102 613: “Smart Cards; UICC

31、 - Contactless Front-end (CLF) Interface; Part 1: Physical and data link layer characteristics“. 4 ETSI TS 102 600: “Smart Cards; UICC-Terminal interface; Characteristics of the USB interface“. 5 ETSI TS 102 484: “Smart Cards; Secure channel between a UICC and an end-point terminal“. 6 ETSI TS 102 2

32、23: “Smart Cards; Card Application Toolkit (CAT)“. 7 IPC/JEDEC J-STD-020D.1: “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices“. 8 JEDEC JESD22-A104D: “Temperature Cycling“. 9 JEDEC JESD22-B103B: “Vibration, Variable Frequency“. 10 JEDEC JESD22-B104C: “Mec

33、hanical Shock“. 11 JEDEC JESD22-A107B: “Salt Atmosphere“. NOTE: For JEDEC documents see http:/jedec.org/download/. ETSI ETSI TS 102 671 V12.0.0 (2018-07)7Release 122.2 Informative references References are either specific (identified by date of publication and/or edition number or version number) or

34、 non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the referenced document (including any amendments) applies. In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version of

35、that document in the same Release as the present document. NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee their long term validity. The following referenced documents are not necessary for the application of the present document but th

36、ey assist the user with regard to a particular subject area. Not applicable. 3 Definitions and abbreviations 3.1 Definitions For the purposes of the present document, the following terms and definitions apply: M2M communication module: electronics system including all necessary components to establi

37、sh wireless communications between machines NOTE: M2M communication modules are usually integrated directly into target devices, such as Automated Meter Readers (AMRs), vending machines, alarm systems, automotive equipment or others. M2M UICC: UICC with specific properties for use in M2M environment

38、s, this includes existing form factors and the new form factors MFF1 and MFF2 Machine to Machine (communication): communication between remotely deployed devices with specific responsibilities and requiring little or no human intervention, which are all connected to an application server via the mob

39、ile network data communications MFF (M2M Form Factor): new form factor dedicated to M2M applications 3.2 Abbreviations For the purposes of the present document, the following abbreviations apply: ASCII American Standard Code for Information Interchange CAT Card Application Toolkit ESN Electronic Ser

40、ial Number IMEI International Mobile Equipment Identity IMEISV International Mobile Equipment Identity and Software Version M2M Machine to Machine (communication) MEID Mobile Equipment IDentifier MFF Machine to Machine Form Factor PCB Printed Circuit Board ETSI ETSI TS 102 671 V12.0.0 (2018-07)8Rele

41、ase 124 Overview The present document details: The environmental specification of the M2M UICC both for the existing form factors and for the optional form factor MFF. The definition of the environmental classes for the M2M UICC. The physical characteristics of the M2M UICC. The electrical specifica

42、tions of the M2M UICC. The logical characteristics of the M2M UICC. The definition of device pairing mechanisms between the M2M UICC and the terminal. The requirements and several use cases for the M2M UICC are detailed in ETSI TS 102 412 2. 5 Definition of Environmental Classes 5.1 Environmental co

43、ndition classification system 5.1.0 Environmental property indicators The following classification system allows the easy identification of the M2M UICCs environmental performance. The M2M UICC shall be classified with a string representing its environmental performance. This string has two characte

44、rs for each environmental property and is separated from each condition by a “-“ (e.g. TA-FA-RA). The first letter defines the environmental property as detailed in table 5.1 and the second letter is the level of support for this property as defined in each clause. If a M2M UICC does not meet any le

45、vel specified in the present document for a particular environmental property then this property shall not be present in the string representing its environmental performance. There is no defined order for the environmental properties. Table 5.1: Description of the environmental property indicators

46、Environmental property letter Description of environmental property Property details in clause T Operational and storage temperature 5.2 M Moisture/Reflow conditions 5.3H Humidity 5.4C Corrosion 5.5V Vibration 5.6S Shock 5.8 R Data Retention time 5.9 U Minimum Updates 5.105.1.1 Storage of environmen

47、tal properties The M2M UICCs environmental properties shall be stored in an Elementary File under the Master File according to the classification system defined in clause 5.1.0. ETSI ETSI TS 102 671 V12.0.0 (2018-07)9Release 125.1.2 EFENV-CLASSESEFENV-CLASSESis a transparent file under the MF and is

48、 under the responsibility of the issuer. It provides information about the UICC capabilities to external entities. Table 5.1a: EFENV-CLASSESat MF-level Identifier: 2Fxx Structure: Transparent Mandatory SFI: Optional File size: X bytes Update activity: low Access Conditions: READ ALW UPDATE ADM DEACT

49、IVATE ADM ACTIVATE ADM Bytes Description M/O Length 1 to X Environmental property classes M X bytes The EF stores the environmental property classes supported by the M2M UICC as defined for the classification system in clauses 5.1 to 5.10. The coding shall be as for an alpha identifier using SMS default 7-bit coding with bit 8 set to 0 (see ETSI TS 102 223 6), e.g. “TA-H54412D4841. 5.2 Operational and Storage Temperature (TX) 5.2.0 Overview The TX property defines the M2M UICC performance for operational and stora

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1