FORD WSF-M2G385-A1-2015 ADHESIVE TWO COMPONENT SILICONE THERMALLY CONDUCTIVE HIGH DIELECTRIC STRENGTH TO BE USED WITH FORD WSS-M99P1111-A .pdf

1、ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions2003 01 16 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.8, 3.9, 4 deleted 1994 10 31 NGA1E10370437010 Released Gordon Printed copies are uncontrolled Page 1 of 3 Copyright 2002, Ford Global Technologies,

2、Inc. ADHESIVE, TWO COMPONENT SILICONE, THERMALLY WSF-M2G385-A1 CONDUCTIVE, HIGH DIELECTRIC STRENGTH 1. SCOPEThe material defined by this specification is a two component, primerless, thermal curing, solventfree, thermally conductive adhesive. This material shall consist of vinyl terminated polydimet

3、hylsiloxane, platinum catalyst, adhesion promoters and alumina powder.2. APPLICATIONThis specification was originally released as an adhesive to bond a Next Generation SpeedControl circuit board to an aluminum base plate housing assembly. The material is intended tofunction as an dielectric adhesive

4、 as well as a thermal transfer compound.3. REQUIREMENTS3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 CONSTITUENT MATERIALS 3.4.1 Adhesive type Addition Cured P

5、olydimethylsioxane 3.4.2 Alumina Particle Size (ASTM C925) Weight percent less than 11 m 99 % Average Particle Size 2.0 - 2.4 m 3.4.3 Specific Gravity, range (ASTM D 792, Method A) Part A 2.12 - 2.22 kg/L Part B 2.00 - 2.10 kg/L NOT TO BE USED FOR NEW DESIGN2015 02 03 N Status No replacement named L

6、. Sinclair, NAENGINEERING MATERIAL SPECIFICATION WSF-M2G385-A1 Page 2 of 3 Copyright 2002, Ford Global Technologies, Inc. 3.4.4 Viscosity, mPa-s, range (ISO 2555, Brookfield RVF, # 7 spindle) Part A (20 rpm) 4,000 - 14,000 MPa.s Part B (20 rpm) 2,000 - 10,000 MPa.s Mixed 1:1 (20 rpm) 4,000 - 12,000

7、MPa.s 3.5 CURED ADHESIVE PHYSICAL PROPERTIES 3.5.1 Sample Preparation A cured sheet of silicone adhesive shall be prepared by curing a 1:1 ratio of parts A and B in a ASTM flat sheet mold (127 x 127 x 1.90 mm). The silicone shall be cured at 150 C for 30 minutes. 3.52 Colr Grey 3.5.3 Specific Gravit

8、y, range 2.10 - 2.20 (ASTM D 792, Method A) 3.5.4 Non-Volatile, min 99 % (ASTM D2369) 3.5.5 Silicone Volatiles, max 0.7 % (FLTM AV 102-01, report D4 through D10 and L4 through L10) 3.5.6 Ash, max 95.8 weight % (ISO 3491, Method A, 760 +/- 30 C) 3.5.7 Odor Meets Requirements The adhesive shall be fre

9、e from objectionable or irritating odors, both as received and at application temperatures. 3.6 CURED ADHESIVE PERFORMANCE REQUIREMENTS 3.6.1 Adhesion, min 1.9 MPa (ISO 4587/ASTM D 1002) Test Method: Prepare lap shear samples using 1.62 mm thick, coversion coated 5052-H32 aluminum as the substrates.

10、 Cure adhesive for 30 minutes at 150 C. Adhesive bondline to be 0.08 to 0.15 mm thick. 3.6.2 Thermal Conductivity, min 0.7 W/m C (ASTM F 433, 40 to 150 C, use a 0.15 mm thick sample) 3.6.3 Volume Resistivity, min 1x10E13 ohm-cm (ASTM D 257/IEC 93) ENGINEERING MATERIAL SPECIFICATION WSF-M2G385-A1 Pag

11、e 3 of 3 Copyright 2002, Ford Global Technologies, Inc. 3.6.4 Dielectric Strength, min 15.7 kV/mm (ASTMD149) 3.6.5 Dielectric Constant, range 4.6 - 4.7 (ASTM D 150, 10 MHz) 3.6.6 Hardness, Durometer A, range 60 - 90 (ISO 868/ASTM D 2240) 3.7 SHELF LIFE, min 6 months Manufacturer shall certify that t

12、he material will meet the specification when stored in the original sealed container at 35 C for the specified period. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 RECOMMENDED CURE SCHEDULES 100 C for 120 minutes 120 C for 60 minutes 150 C for 30 minutes