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本文(FORD WSS-M11A32-A4-2012 SOLDER PASTE 10 SN 88 PB 2 AG LOW VISCOSITY TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSS-M11A32-A3).pdf)为本站会员(towelfact221)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

FORD WSS-M11A32-A4-2012 SOLDER PASTE 10 SN 88 PB 2 AG LOW VISCOSITY TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSS-M11A32-A3).pdf

1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2012 07 25 N-Status No replacement A. Wedepohl, NA 2005 02 07 Revised Inserted 3.0; Deleted 3.1, 3.2, 3.7, 3.8, 4 1995 08 30 Activated A3 and A4. Activated A6 on 1996 01 10 L. Merala Controlled document at www.MATS Copyright 2012, Ford Global

2、 Technologies, LLC Page 1 of 3 SOLDER PASTE, 10 SN/88 PB/2 AG NOT FOR NEW DESIGN WSS-M11A32-A3 SOLDER PASTE, 10 SN/88 PB/2 AG, LOW VISCOSITY NOT FOR NEW DESIGN WSS-M11A32-A4 SOLDER PASTE, 10 SN/88 PB/2 AG, HIGH VISCOSITY NOT FOR NEW DESIGN WSS-M11A32-A6 1. SCOPE The materials defined by these specif

3、ications are 10 Sn/88 Pb/2 Ag solder pastes with mildly activated rosin flux used for either screen printing, stencil printing or syringe dispensing applications. These solder pastes are homogeneous suspensions of prealloyed solder powder in specially formulated screening and fluxing vehicle systems

4、. 2. APPLICATION These specifications were released originally as conductive materials used as printable solder for surface mount connections and other applications. These solder pastes were designed to be screen printed, stencil printed or syringe dispensed onto ceramic substrates and reflowed usin

5、g either convection or infrared soldering. 3. REQUIREMENTS These solder pastes are homogeneous suspensions of prealloyed solder powder in specially formulated fluxing vehicle. All qualification testing shall be done at 25 +/- 2 C and 50 +/- 3% relative humidity, unless otherwise specified. 3.0 STAND

6、ARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.3 COMPOSITION (IPC-SP-819, Section 4.4, 50 gram sample required) A3 A4 A6 Solder Metal, weight % 89.2 - 90.2 87.0 - 89.0 89.

7、7 - 90.7 Vehicle Balance Balance Balance 3.3.1 Solder Metal Composition, atomic percent (QQ-S-571F, Class 1 Impurity Levels) Tin 9.5 - 10.5 Silver 1.8 - 2.2 Zinc 0.005 max. Antimony 0.50 max. Bismuth 0.10 max. Copper 0.08 max. Iron 0.02 max. ENGINEERING MATERIAL SPECIFICATION WSS-M11A32-A3/A4/A6 Cop

8、yright 2012, Ford Global Technologies, LLC Page 2 of 3 Aluminum 0.005 max. Cadmium 0.005 max. Lead Remainder 3.4 INDIVIDUAL COMPONENT PROPERTIES 3.4.1 Solder Powder (Powder sample prior to mixing) 3.4.1.1 Particle Size (IPC-SP-819, Section 3.2.2) % of Sample by Weight - Nominal Sizes Less than 1% la

9、rger than 45 microns Remainder between 45 - 25 microns 10% - 20% less than 25 microns 3.4.1.2 Particle Shape Spherical; (IPC-SP-819, Ratio = 1 - 1.5 Section 3.2.3) 3.5 VISCOSITY, poise (IPC-TM-650, Section 2.4.34.3, spiral pump viscometer, 25 +/- 0.25 C) A3 A4 A6 5 RPM (5 minutes) 905 - 1965 538 - 1

10、622 1500 - 2100 30 RPM (1 minute) 385 - 835 175 - 505 400 - 800 3.6 SHELF LIFE, min 6 months Store an unopened container of solder paste at 2 +/- 2 C (35 +/- 4 F) for the specified shelf life time period. The solder paste shall meet the viscosity requirements per Section 3.5 of this specification. S

11、helf life is based on date of manufacture. The solder paste is to be delivered within two months of the date of manufacture. 4. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of these specifications. Contact for questions con

12、cerning Engineering Material Specifications. 4.1 If the material contains a rosin based flux, GC spectra of the extracted flux are required. 4.1.1 Extraction Method (a) Extract 2.0 g of paste with 3.0 mL of 50% isopropanol/50% toluene solution. (b) Mix well and then use centrifuge to separate the me

13、tal particles from the liquid portion. (c) Collect liquid portion with pipette and save for GC sample preparation. ENGINEERING MATERIAL SPECIFICATION WSS-M11A32-A3/A4/A6 Copyright 2012, Ford Global Technologies, LLC Page 3 of 3 4.1.2 GC Sample Preparation (a) Pipet 50 microliters of the extracted fl

14、ux mixture and dispense into a GC sample vial. (b) To the sample vial, add 1 ampule Sylon BFT.* *The full name of Sylon BFT is Bis(trimethylsilyl) trifluoroacetamide (BSTFA)/ trimethylchlorosilane (TMCS). Sylon BFT must be stored in a refrigerator (shelf life - 1 year). It may be obtained in ampule

15、form from: Supelco, Inc. Supelco Park Bellefonte, PA 16823-0048 (c) Allow the mixture to stand for 5 minutes, then add 1.0 mL pyridine, and seal the vial. The mixture is ready to be injected into the gas chromatograph. 4.1.3 Equipment Parameters for Gas Chromatograph Column: DB-5 column, 0.25 mm ID,

16、 0.25 um Film, 30 m long Column Flow Rate: 1 mL/minute, 1:80 split ratio Sample Injection Quantity: 1.0 microliter Injector Temperature: 260 C Detector (FID) Temperature: 260 C Air Flow Rate: 400 mL/minute H2 Flow Rate: 32 mL/minute He Makeup Flow Rate: 30 mL/minute Temperature Profile: Hold the tem

17、perature at 70 C for 4 minutes, ramp to 260 C at 10 C/minute, and hold on 260 C for 17 minutes. Total run time is 40 minutes. 4.2 If the material contains a polymer based flux, IR spectra of the extracted flux are required. Extract the paste with acetone and collect the liquid portion. The extracted flux is to be applied directly to the KBr window. 4.3 Physical Properties 4.3.1 Melting and Cooling Peaks (ASTM E 793, heating/cooling rates 5 C/minute; melting and cooling peaks are last peak on heating and first peak on cooling, respectively) Melting Peak 290 +/- 2 C Cooling Peak 283 +/- 5 C

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