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本文(GEIA-STD-4899A-2007 Standard for Preparing an Electronic Components Management Plan《电子元器件管理计划筹备标准》.pdf)为本站会员(ownview251)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

GEIA-STD-4899A-2007 Standard for Preparing an Electronic Components Management Plan《电子元器件管理计划筹备标准》.pdf

1、 GEIA STANDARD EIA-STD-4899-A Standard for Preparing an Electronic Components Management Plan EIA-STD-4899-A November 2007 GOVERNMENT ELECTRONICS AND INFORMATION TECHNOLOGY ASSOCIATION A Sector of the Electronic Industries Alliance Copyright Government Electronics it does not require specific tasks

2、to be performed, specific data to be collected, or reports to be issued. Those who prepare Plans in compliance with this document are encouraged to document processes that are the most effective and efficient for them in accomplishing the objectives of this document. In order to allow flexibility in

3、 implementing and updating the documented processes, Plan authors are encouraged to refer to their own internal process documents instead of including detailed process documentation within their Plans. This component management document is intended for aerospace users of electronic components. This

4、standard is not intended for use by the manufacturers of electronic components. Components selected and managed according to the requirements of a Plan compliant to this document may be approved by the concerned parties for the proposed application, and for other applications with equal or less seve

5、re requirements. Organizations that prepare such Plans may prepare a single Plan, and use it for all relevant products supplied by the organization, or may prepare a separate Plan for each relevant product or customer. This publication is not intended to preclude or discourage other approaches that

6、similarly represent good engineering practice, or that may be acceptable to, or have been accepted by, appropriate bodies. Parties who wish to bring other approaches to the attention of the formulating committee to be considered for inclusion in future revisions of this publication are encouraged to

7、 do so. It is the intention of the formulating committee to revise and update this publication from time to time as may be occasioned by changes in technology, industry practice, or government regulations, or for other appropriate reasons. iii Copyright Government Electronics and that the Technical

8、Requirements detailed in clause 5.0 are accomplished. In general the owners of a complete Electronic Components Management Plan are avionics equipment manufacturers. 2 Normative References The following normative documents contain provisions that, through reference in this text, constitute provision

9、s of this standard. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC TR 62240, Use of Semiconductor Devices Outside Manufacturers Specified Temperature Ranges IEC TS 62396-1, Process ma

10、nagement for avionics Atmospheric radiation effect ; Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment JEP149, JEDEC Publication, JEDEC Standard Application Thermal Derating Methodologies JESD47, Stress-Test-Driven Qualification of Integrate

11、d Circuits JESD94, Application Specific Qualification Using Knowledge Based Test Methodology MIL-HDBK-263, Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, assemblies and Equipment IEC 61340-5-1 (1998), Electrostatics Part 5-1: Protection of Electronic Devi

12、ces from Electrostatic Phenomena General Requirements IEC 61340-5-2 (1999), Electrostatics Part 5-1: Protection of Electronic Devices from Electrostatic Phenomena User Guide 3 Informative References The following is a listing of informative references. AS 9000 Revised 1998, Aerospace Basic Quality S

13、ystem Standard, Appendix 1, Society of Automotive Engineers CDF-AEC Q100, Stress Test Qualification for Automotive-Grade Integrated Circuits, Chrysler-Delco-Ford Automotive Electronics Council 1 Copyright Government Electronics How compliance to the Plan is demonstrated; and The evidence that is ava

14、ilable to show that the requirements have been accomplished. The Plan shall document the processes used to address each of the technical requirements of this clause. Where specific requirements do not apply, the Plan owner may, with appropriate justification, amend the list of requirements by adding

15、, deleting or modifying them. If this is done, the Plan shall be assessed according to the amended list of requirements as stated in the Plan. The only type of amendment permitted is to add or delete entire requirements (those designated and described in the technical requirements list above). Modif

16、ications of any of the requirements listed above and described in this clause are not permitted. All the requirements in this clause apply to deliverable flight equipment or subassemblies for the Avionics industry as stated in clause 6.6. The Original Equipment Manufacturer (OEM Plan owner) has the

17、responsibility of satisfying the technical requirements given in clause 5. These requirements may be accomplished by either the OEM or may be subcontracted. In either case, the OEM has the responsibility for ensuring all requirements are met. NOTE Ground support Test Equipment, Flight Demonstrator A

18、ssemblies, and Prototypes are typically exempt from these requirements, unless the Plan owner states otherwise in their Plan, see clause 6.6. The plan must satisfy the requirements of this Clause, regardless of the source from which the plan owner obtains components. 6 Copyright Government Electroni

19、cs - Components be selected from those readily available and produced in large volume; - Components be selected from those in a preferred stage of their lifecycle. The conditions for use of the component shall be adequately identified, from the component specification based on the component manufact

20、urers data sheet and any additional requirements to ensure suitability in the end application. Availability and level of obsolescence risk shall be considered as major component selection criteria. If additional performance is required (e.g., upscreening, uprating, additional parameters defined), th

21、en the component shall be considered as a specific one and shall be uniquely identified. Each selected component shall be comprehensively identified within the selection process. For off-the-shelf components, as a minimum, the component manufacturer data sheet, component manufacturer technical and a

22、pplication notes, packaging, reliability and availability data, producability data (including storage, soldering conditions etc.) should be identified. For components specified by the Equipment Manufacturer, the specific documentation (including specification, manufacturer data and process, reliabil

23、ity, specific tests and screening, and associated in-house continuous monitoring) should be identified. 5.2 Component Application Listed here are some categories of component application processes that may be documented in a Plan. Not all of the categories listed below are relevant to every componen

24、t application; therefore, the requirements listed below are applicable only if relevant to the given application. The plan shall document the processes that are expected to be applicable to the majority of the plan owners products, with the 7 Copyright Government Electronics Accommodation of atmosph

25、eric radiation effects via single event effects within the avionics electronic equipment. 5.3 Qualification Requirements 9 Copyright Government Electronics in which case the requirements of 5.3.1, 5.3.1.1 and 5.3.1.2 shall apply. In cases where the component manufacturer is not qualified, the requir

26、ements of 5.3.3.2.5 shall apply. 5.3.1 Component Manufacturer Quality Management The Plan owner shall verify that the component manufacturer has a documented quality management system. 5.3.1.1 The component manufacturer shall have a quality system assessed to the relevant parts of the ISO 9000 famil

27、y or equivalent. 5.3.1.2 Where the component manufacturer is not assessed in accordance with 5.3.1.1 above, then the Plan owner shall demonstrate how the quality management system of the component manufacturer will be maintained. Where the Plan owner conducts or enables an audit on the component man

28、ufacturing facility, then the audit shall be conducted in accordance with the relevant standards of the ISO 9000 family or equivalent system. Suitably trained auditors shall conduct that audit. 5.3.2 Component Manufacturer Process Management Approval The Plan owner shall verify that the component ma

29、nufacturer has a manufacturing process capability utilizing manufacturing technologies with demonstrable repeatability. This may be satisfied by one of the following: 5.3.2.1 Manufacturing approval of the component technologies by a third party (e.g., DSCC, IECQ, STACK) or within an international se

30、cond party system. 5.3.2.2 Where the component manufacturer is not assessed as in 5.3.2.1 above, then the Plan owner shall demonstrate how the process management capability of the component manufacturer is ensured. Where the Plan owner conducts or enables an audit on the component manufacturing faci

31、lity then suitably trained and accredited auditors shall conduct the audit in accordance with one of the above systems (as in 5.3.2.1). 5.3.2.3 Manufacturers who do not have an appropriate internal quality management system may be used when their products are fully qualified by the plan owner in acc

32、ordance with 5.3.3.2. 5.3.3 Demonstration of Component Qualification The Plan owner shall document the component qualification process for each component. The qualification plan and test procedures, sampling and criteria of acceptance (with the defined margins) shall be described. The approach to qu

33、ality and reliability required in the application shall be outlined. This can be demonstrated by any of the following, but the choice shall be justified: 10 Copyright Government Electronics lot to lot assembly handling variations, etc., are minimized and controlled. This will assure that the deliver

34、ed components conform to the delivered equipment requirements. 5.4.2 On-going Component Quality Assurance One or more of the following methods shall be used to assure component manufacturer quality: 12 Copyright Government Electronics examples of international standards are IECQ, and STACK Internati

35、onal. 5.4.2.2 Component Quality Assurance Data Where the requirement of 5.4.2.1 is not met, the Plan owner shall have a process to assure that compliance to the component specification is maintained, either by component manufacturer test or Plan owner test. A component manufacturer assessment shall

36、include component test processes, ongoing component qualification test plans, and acceptance criteria. The method by which this information is obtained shall be documented. NOTE 1 Typical quality assurance processes include statistical process control, periodic qualification testing, component testi

37、ng and screening, etc. Plan owner performs process control tests and has documented quality acceptance criteria. NOTE 2 The following recommendations apply if component level screening is done: - The components are subjected to screening conditions of sufficient rigor and duration to detect defects.

38、 - A process for screening sampling rates may be proposed by the plan owner, provided that sufficient data is available, and the reject rate is low enough. A process for screening sampling rates may be proposed by the plan owner to reduce from 100%, provided that sufficient data is available, and th

39、e reject rate is acceptable for the application. 5.4.3 Plan Owner In-house Continuous Monitoring The Plan owner shall have a process to assure the required performance of components prior to delivery of the equipment. This process includes various levels of processing, assembly, and test of the equi

40、pment. A process for identification, recovery, and recording of component removals or replacements during in-house processing and test shall be documented. Significant component replacement trends, equipment repair actions or a pattern of component replacements that are indicative of a potential com

41、ponent problem shall be investigated to determine root cause. Appropriate corrective actions shall be conducted. 5.4.4 Component Design and Manufacturing Process Change Monitoring The process of tracking (or detecting) and monitoring component design and manufacturing process change data shall be do

42、cumented. The effects of these changes on equipment performance shall be reviewed and assessed. This process could include: direct information from 13 Copyright Government Electronics and the Plan shall describe how their impact on components is identified, documented, and controlled. NOTE Of partic

43、ular concern is the method of storing plastic-encapsulated microcircuits to assure that moisture ingress does not cause popcorning during assembly. Characterization by component manufacturers of component moisture sensitivity rating in accordance with JESD22-A112 and J-STD-020A will assist in contro

44、lling this feature. 5.7 Component Data The documented processes shall include a system for collection, storage, retrieval, analysis and reporting of all relevant data from the component, equipment design, equipment manufacturing and equipment use in service; and for keeping the data per customer or

45、regulatory requirements. NOTE 1 The data need not reside within the data system described. A relational approach may be used wherein the data system provides access to the data. For example, if the component qualification data is collected and stored by the component manufacturer, the equipment manu

46、facturers data system could consist of a process, software, and hardware to access that data through the component manufacturers web page or other source, provided the access is available when needed. As another example, any data that is specific to a program, such as functional simulation results o

47、r thermal analysis data, could be accessible via a path through the program data. The Plan owner may wish to identify processes that were 16 Copyright Government Electronics e.g., “This Plan applies to all equipment manufactured for aerospace applications.” It also may include an effectivity date; e

48、.g., “This Plan applies to all new equipment, and to components substituted into existing equipment.” The range of equipment also may be limited or required by certain contractual agreements. 6.7 Plan Implementation The Plan owner shall implement and follow the processes documented in the Plan, with

49、in its range of applicability. Components selected and managed according to the Plan requirements are called ECMP-compliant or Plan-compliant components. 6.8 Plan Acceptance The Plan shall be accepted when the Plan owner and the customer agree that the Plan is acceptable to both parties. Certification by an assessment body, such as IECQ, may be used as evidence that the Plan satisfies the requirements of this document. 20 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or netwo

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