GMKOREA EDS-T-5717-2008 TEST SPECIFICATION FOR A STAMPED METAL W ROUTED WIRE TYPE JUNCTION BOX (BUSSED ELECTRICAL CENTER).pdf

1、GM DAEWOO Auto 1 gs peak, 40 millisecond duration 20 gs peak, 11millisecond duration 50 gs peak, 11 millisecond duration 50 gs peak, 20 millisecond duration EDS-T-5717TEST SPECIFICATION FOR A STAMPED METAL W/ROUTED WIRE TYPE JUNCTION BOX (BUSSED ELECTRICAL CENTER) PAGE: 8/33 ISSUED DATE: 2005. 03. 1

2、0 REVISED DATE: 2008. 10. 21 VERSION: 2 GM DAEWOO Auto you shall inspect defects of each test sample with oil tubes before conditioning. The Notes shall include ID Number of test samples and defect description. If corrosion, discoloration, physical damage or deformation happens after conditioning, y

3、ou shall take re-inspection on test samples. 4-2) Attach voltage sense lead to the terminal of test samples in front of Core Crimp. 4-3) When evaluating crimps, attach sense lead to cable 751mm away the from Rear Edge of the Core Crimp. 4-4) Connect terminals of test samples to available connectors

4、4-5) Connect test samples to the series circuit. 4-6) Attach test samples to terminal test board with a single terminal (Min. 38mm) and a multi-groove connector (Min. 125mm) 4-7) Connect the series test circuit to the power supply with the current meter, the current shunt, and the timer. 4-8) The mi

5、nimum conditioning time is 192 hours, and the test current cycling is 452-minute ON, and 152-minute OFF. 4-9) Unless otherwise specified, the test current is as follows: EDS-T-5717TEST SPECIFICATION FOR A STAMPED METAL W/ROUTED WIRE TYPE JUNCTION BOX (BUSSED ELECTRICAL CENTER) PAGE: 14/33 ISSUED DAT

6、E: 2005. 03. 10 REVISED DATE: 2008. 10. 21 VERSION: 2 GM DAEWOO Auto 125 thermal shock Cycle (based on 5.2.6.1) 30minutes -40 30minutes 125 After the thermal shock Test, you shall perform the inspection by naked eyes and measurement inspection (The results of the inspections shall exist in the range

7、 stipulated on the drawing). 7.2.8. Thermal Cycling (which is applied to only the PCB Junction Box) This Thermal Cycling Test is applied to the PCB (Printed Circuit Board) of the junction box. The purpose of this test is to evaluate the fatigue destruction on the soldered points caused by Creep (hea

8、t deformation). At least 4 test samples shall be provided (4 assemblies of the perfect junction box, including the equipment, the connecting terminal, and the electric cord). Test samples shall go through the 1000 cycle test based on the following Thermal Profile: 20minutes 125 (85 in case of a passenger room) 10 minutes -40 Change by 10per 1 minute at the extreme temperature. After the 1000 Thermal Cycle is completed, you shall dissemble test samples and inspect soldered points by naked eyes.