GOST IEC 61188-1-1-2013 Printed boards and printed board assemblies Design and use Part 1-1 Generic requirements Flatness considerations for electronic assemblies《印制板和印制板组件 设计和使用 第.pdf

1、 , () INTERSTATE COUNCIL FOR STANDARDIZATION, METROLOGY AND CERTIFICATION (ISC) IEC 61188-1-1 2013 1-1 (IEC 61188-1-1:1997, IDT) IEC 61188-1-12013 II , 1.092 . 1.22009 . , . , , , 1 ( ) , 5 , / 91 2 420 , , 3 , ( 14 2013 . 44) : ( 3166) 00497 ( 3166) 00497 BY KG RU 4 16 2014 1104- IEC 61188-1-12013

2、1 2015 5 IEC 61188-1-1:1997 Printed boards and printed board assemblies Design and use Part 1-1: Generic requirements Flatness considerations for electronic assemblies( . . 1-1. . ). (en). IEC/ 91 (IEC). 1.5 ( 3.5). , , , , . . (IDT). 6 IEC 61188-1-12013 III , . () . , , 2014 , IEC 61188-1-12013 IV

3、 . , , , , . , . IEC 61189-2. IEC 61189-2 201 202 201 204 IEC 61188-1-12013 1 1-1 . Printed boards and printed board assemblies. Design and use. Part 1-1. Generic requirements. Flatness considerations for electronic assemblies 20150301 1 , . , , , , . : - (. 3); - (. 4); - (. 5); - (. 6). 2 . . IEC

4、 61189-2:1997 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures ( , . . 2. ) 3 3.1 . , , . , , . , , . . , , , . 3.2 . 3.3 , . 3.4 . IEC 61188-1-12013 2 4 . 4.1 , . 4.1.1 . . 4.1

5、2 , , . 4.1.3 B () , , B (). . : - , ( ); - ; - () . 4.1.4 . , X Y, . . , . , , . 4.1.5 , . . 4.2 , , 4.1. . . , ( ) . Tg , () () . ; . , , , . 120 C 135 C, 105 C. . , . , . , , , , . , , . , . 4.3 IEC 61189-2. IEC , . IEC 61188-1-12013 3 5 5.1 , . 5.1.1 5.1.1.1 . 5.1.1.2 , , . , , . 5.1.1.3 . , . , , , , . , , . , 4 5 , . 5.1.2 5.1.2.1 ( ) ( ) ( , . .). 5.1.2.2 . . 5.1.2.3 , (. 4.1.3). , . 5.1.2.4 - , , . , , , . . 5.1.2.5 . . , , . , , . 5.1.2.6 , , . 5.2 () 5.2.1 a) . b) . c) . , . IEC 61188-1-12013 4 , , . , 5.1.1.2,