JEDEC J-STD-033C-1-2014 Handling Packing Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices.pdf

1、JOINTINDUSTRYSTANDARDHandling, Packing,Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesIPC/JEDEC J-STD-033C-1August 2014Supersedes IPC/JEDEC J-STD-033CFebruary 2012Notice JEDEC and IPC Standards and Publications are designed to serve the publicinterest through eliminating misundersta

2、ndings between manufacturers andpurchasers, facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need. Existence of such Standards andPublications shall not in any respect preclude a

3、ny member or nonmemberof JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications, nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than JEDECand IPC members, whether the standard is to be used either do

4、mesticallyor internationally.Recommended Standards and Publications are adopted by JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials, or processes. By such action, JEDEC and IPC do not assume anyliability to any patent owner, nor do they assume any oblig

5、ation whateverto parties adopting the Recommended Standard or Publication. Users are alsowholly responsible for protecting themselves against all claims of liabilitiesfor patent infringement.The material in this joint standard was developed by the JEDEC JC-14.1Committee on Reliability Test Methods f

6、or Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group (B-10a)For Technical Information Contact:JEDECSolid State Technology Association3103 North 10th Street, Suite 240-SArlington, VA 22201-2107Tel 703 907.0026Fax 703 907.7501IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60

7、015-1249Tel 847 615.7100Fax 847 615.7105Please use the Standard Improvement Form shown at the end of thisdocument.Copyright 2014. JEDEC Solid State Technology Association, Arlington, Virginia, and IPC, Bannockburn, Illinois, USA. All rights reservedunder both international and Pan-American copyright

8、 conventions. Any copying, scanning or other reproduction of these materials withoutthe prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the UnitedStates.IPC/JEDEC J-STD-033C-1Handling, Packing,Shipping and Use ofMoisture/Re

9、flowSensitive SurfaceMount DevicesA joint standard developed by the JEDEC JC-14.1 Committee onReliability Test Methods for Packaged Devices and the B-10a PlasticChip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in thedevelopment of future revisions.Contact:J

10、EDECSolid State Technology Association3103 North 10th Street, Suite 240-SArlington, VA 22201-2107Tel 703 907.0026Fax 703 907.7501IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1249Tel 847 615.7100Fax 847 615.7105Supersedes:IPC/JEDEC J-STD-033C -February 2012IPC/JEDEC J-STD-033B.1includ

11、es Amendment 1 -January 2007IPC/JEDEC J-STD-033B -October 2005IPC/JEDEC J-STD-033A -July 2002IPC/JEDEC J-STD-033 -April 1999JEDEC JEP124IPC-SM-786A - January 1995IPC-SM-786 - December 1990This Page Intentionally Left BlankAcknowledgmentMembers of the Joint IPC/JEDEC Moisture Classification Task Grou

12、p have worked to develop this document. We wouldlike to thank them for their dedication to this effort. Any standard involving a complex technology draws material from avast number of sources. While the principal members of the Joint Moisture Classification Working Group are shown below,it is not po

13、ssible to include all of those who assisted in the evolution of this Standard. To each of them, the members of theJEDEC and IPC extend their gratitude.IPC Plastic Chip CarrierCracking Task Group, B-10aChairmanSteven MartellSonoscan, Inc.JEDEC JC 14.1CommitteeChairmanJack McCullenIntel CorporationJED

14、EC JC 14ChairmanNick LycoudesFreescale SemiconductorJoint Working Group MembersDoug Derry, AccuAssemblyRanjit Gannamani, Advanced MicroDevicesJoseph Smetana, Alcatel-LucentRussell Nowland, Alcatel-LucentBradley Smith, Allegro MicroSystemsInc.Maurice Brodeur, Analog DevicesInc.Bill Strachan, ASTA - P

15、ortsmouthUniversityLyle Burhenn, BAE SystemsPlatform SolutionsMary Bellon, Boeing Research the replacement of an attached compo-nent; or the heating and repositioning of a previously attached component.1.5.12 Shelf Life The minimum time that a dry-packed, moisture-sensitive device can be stored in a

16、n unopened moisturebarrier bag (MBB) such that a specified interior bag ambient humidity is not exceeded.1.5.13 SMD Surface mount device.Note: For the purpose of this standard, SMD is restricted to include only plastic-encapsulated SMDs and other packagesmade with moisture-permeable materials.1.5.14

17、 Solder Reflow A solder attachment process in which previously applied solder or solder paste is melted to attacha component to a printed circuit board.IPC/JEDEC J-STD-033C-1 August 201421.5.15 Water Vapor Transmission Rate (WVTR) A measure of the permeability of plastic film or metallized plastic f

18、ilmmaterial to moisture.2 APPLICABLE DOCUMENTS (Normative)2.1 American Society for Testing and Materials (ASTM)1ASTM F 1249 Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modu-lated Infrared Sensor.ASTM F 392 Standard Test Method for Flex Durability

19、of Flexible Barrier Materials2.2 Electronic Industries Alliance (EIA, JEDEC)2EIA-541 Packaging Material Standards for ESD Sensitive ItemsJESD625 Requirements for Handling Electrostatic Discharge Sensitive Devices (ESDS)JEP113 Symbol and Labels for Moisture Sensitive DevicesJESD22-A113 Preconditionin

20、g of Non-hermetic Surface Mount Components Prior to Reliability TestingJESD22-A120 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used inIntegrated Circuits2.3 IPC Standards3IPC-7711 Rework of Electronic AssembliesIPC-7721 Repair and Modification of

21、 Printed Boards and Electronic Assemblies2.4 Joint Industry Standards4J-STD-020 Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount DevicesJ-STD-075 Classification of Non-IC Electronic Components for Assembly Processes2.5 Department of Defense5MIL-PRF-81705 Type I -

22、 Barrier Materials Flexible, Electrostatic-free, Heat SealableMIL-D-3464 Type II - Desiccant, Activated, Bagged, Packaging Use and Static Dehumidification3 DRY PACKING3.1 Requirements Dry-packing requirements for the various moisture sensitivity levels are shown in Table 3-1. The lev-els are determi

23、ned per J-STD-020, J-STD-075, and/or per JESD22-A113 plus environmental reliability testing. As a mini-mum, all materials used in dry packing should conform to EIA-541.3.2 Drying of SMD Packages and Carrier Materials Before Being Sealed in MBBs3.2.1 Drying Requirements - Levels 2a - 5a SMD packages

24、classified at Levels 2a through 5a must be dried (see Clause4) prior to being sealed in MBBs. The period between drying and sealing must not exceed the MET less the time allowedfor distributors to open the bags and repack parts. If the suppliers actual MET is more than the default 24 hours, then the

25、1. www.astm.org2. www.eia.org; www.jedec.org3. www.ipc.org4. www.eia.org; www.jedec.org; www.ipc.org5. http:/astimage.daps.dla.mil/quicksearch/August 2014 IPC/JEDEC J-STD-033C-13actual MET must be used. If the distributor practice is to repack the MBBs with active desiccant, then this time does notn

26、eed to be subtracted from the MET.3.2.2 Drying Requirements for Carrier Materials Carrier materials, such as trays, tubes, reels, etc., that are placed in theMBB can affect the moisture level within the MBB. Therefore, the effect of these materials must be compensated for bybaking or, if required, a

27、dding additional desiccant in the MBB to ensure the shelf life of the SMD packages.3.2.3 Drying Requirements Suppliers may use the drying effect of normal in-line processes such as post mold cure,marking cure, and burn-in to reduce the bake time. An equivalency evaluation is recommended to ensure th

28、at high tem-perature processing maintains moisture weight gain to an acceptable level. The total weight gain for the SMD package atthe time it is sealed in the MBB must not exceed the moisture gain of that package starting dry and then being exposed to30 C/60% RH for MET hours (less the time for dis

29、tributors).3.2.4 Excess Time Between Bake and Bag If the allowable time between bake and bag is exceeded, the SMD packagesmust be dried again per Clause 4.3.3 Dry Pack3.3.1 Description Dry pack consists of desiccant materialand a humidity indicator card (HIC) sealed with the SMDpackages inside a moi

30、sture barrier bag (MBB). A representa-tive dry-pack configuration is shown in Figure 3-1.3.3.2 Materials3.3.2.1 Moisture Barrier Bag (MBB) The moisture barrierbag shall meet MIL-PRF-81705, Type I requirementsfor flexibility, ESD protection, mechanical strength, and punc-ture resistance. The bags sha

31、ll be heat sealable. The WaterVapor Transmission Rate (WVTR) shall be 0.0310 g/m2(0.002 g/100 in2) in 24 hrs at 40 C after flex testing per con-dition EASTM F 392. The WVTR is measured usingASTM F 1249.3.3.2.2 Desiccant The desiccant material shall meet MIL-D-3464, Type II. Desiccant shall be dustle

32、ss, non-corrosive,and absorbent to amounts specified in the standard. Desiccanthas a very limited floor life and should be stored and handledper the manufacturers recommendation prior to insertion inthe MBB. The desiccant material shall be packaged in moisture permeable bags or pouches. The amount o

33、f desiccant used,per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidityin the MBB, at the end of the calculated shelf life, to less than 10% at 25 C.For comparison between various desiccant types, military specifications adopted the

34、 UNIT as the basic unit of measure ofquantity for desiccant material. A UNIT of desiccant is defined as the amount that will absorb a minimum of 2.85 g of watervapor at 20% RH and 25 C.Table 3-1 Dry Packing RequirementsLevel Dry Before Bag MBB With HIC Desiccant MSID Label Caution Label1 Optional Op

35、tional Optional Not RequiredNot Required if classified at220 - 225 C 428 - 437 FRequired* if classified atother than 220 - 225 C 428 - 437 F2 Optional Required Required Required Required2a-5a Required Required Required Required Required6 Optional Optional Optional Required Required*A Caution label i

36、s not required if level and reflow temperature are given, in human readable form, on the barcode label attached to the lowest level shippingcontainer.2341IPC-033c-3-1Figure 3-1 Typical Dry-Pack Configuration for Moisture-Sensitive SMD Packages in Shipping Tubes1. MBB2. Desiccant Pouches3. HIC4. Foam

37、 End CapIPC/JEDEC J-STD-033C-1 August 201443.3.2.2.1 Desiccant Quantity Calculation When the desiccant capacity at 10% RH and 25 C is known, the followingequation should be used:U = (0.304*M*WVTR*A)/DWhere:U = Amount of desiccant in UNITSM = Shelf life desired in months (see Clause 3.3.6 for shelf l

38、ife)WVTR = Water vapor transmission rate in grams/m2in 24 hrs.A = Total exposed surface area of the MBB in square decimetersD = The amount of water in grams, that a UNIT of desiccant will absorb at 10% RH and 25 CWhen the desiccant capacity at 10% RH and 25 C is not known a conservative value of D =

39、 1.40 can be used.Note 1: If it is desired to minimize the amount of desiccant used for dry-packing level 2 components, a value of D basedon the amount of water in grams, that a UNIT of desiccant will absorb at 60% RH and 25 C must be used in the formula.This value should to be obtained from the des

40、iccant manufacturer. When this option is used, it must be verified that whenthe component was classified per J-STD-020 it must have achieved full saturation during moisture soak.Note 2: No moisture-absorbing material (e.g., trays, tubes, reels, foam end caps) should be placed in the dry bag withoutb

41、aking. Any such material that is included increases the amount of desiccant needed to meet the calculated shelf life (seeClause 5.3.1) by an amount based on the moisture content of the material. This can be determined by weighing a represen-tative quantity of material known to be at equilibrium with

42、 the manufacturing environment, baking to a new constant weight,and subtracting the final from the initial weight.Additional UNIT(s) of desiccant, based on 10% RH at 25 C, must be added to absorb the amount of water, in grams,egressed from the packing materials (dunnage) after baking.3.3.2.2.2 Desic

43、cant Handling and Storage Desiccant capacity decreases rapidly when exposed to 30 C/60% RH. There-fore the desiccant should remain in the manufacturers container or stored in a dry cabinet at 10% for level 2a - 5adevices or 60% for level 2 devices when read at 23 5Cb) 3a or 3b are not met5. If bakin

44、g is required, refer to IPC/JEDEC J-STD-033 forbake procedureBag Seal Date: _If blank, see adjacent bar code labelNote: Level and body temperature defined by IPC/JEDEC J-STD-020This bag containsMOISTURE-SENSITIVE DEVICESLEVELIf blank, see adjacentbar code label_IPC-033c-3-4Figure 3-4 Moisture-Sensit

45、ive Caution Label (Example)IPC/JEDEC J-STD-033C-1 August 201463.3.5.2 HIC Reuse3.3.5.2.1 HIC with 10% RH Indicated HIC cards where the 10% spot indicates wet shall not be used/reused if the bagwill be opened and the HIC card inspected within 48 hours.3.3.5.2.2 HIC with 60% RH Indicated HIC shall be

46、discarded if the 60% spot has indicated wet. HICs that have beenexposed to 60% or greater RH will no longer be accurate.3.3.5.3 Moisture Barrier Bag Sealing In actual practice airevacuation is not required (Figure 3-5). Light air evacuationmay be used to reduce the packaging bulk and enhance cartonp

47、acking (Figure 3-6). Full evacuation shall not be used as itwill impede desiccant and HIC performance and possibly leadto MBB puncture (Figure 3-7).3.3.6 Shelf Life The calculated shelf life for dry-packedSMD packages shall be a minimum of 12 months from thebag seal date, when stored in a non-conden

48、sing atmosphericenvironment of 72 hExceedingFloor Lifeby 72 hExceedingFloor Lifeby 72 hExceedingFloor Lifeby 72 hExceedingFloor Lifeby 72 hExceedingFloor Lifeby 72 hThickness1.4 mm2 5 hours 3 hours 17 hours 11 hours 8 days 5 days2a 7 hours 5 hours 23 hours 13 hours 9 days 7 days3 9 hours 7 hours 33

49、hours 23 hours 13 days 9 days4 11 hours 7 hours 37 hours 23 hours 15 days 9 days5 12 hours 7 hours 41 hours 24 hours 17 days 10 days5a 16 hours 10 hours 54 hours 24 hours 22 days 10 daysThickness1.4 mm2.0 mm2 18 hours 15 hours 63 hours 2 days 25days 20 days2a 21 hours 16 hours 3 days 2 days 29 days 22 days3 27 hours 17 hours 4 days 2 days 37 days 23 days4 34 hours 20 hours 5 days 3 days 47 days 28 days5 40 hours 25 hours 6 days 4 days 57 days 35 days5a 48 hours 40 hours 8 days 6 days 79 days 56 daysThickness2.0 mm4.5