JEDEC JEP130B-2016 Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes Trays and Tape and Reel).pdf

1、JEDEC PUBLICATION Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel) JEP130B (Revision of JEP130A, February 2006) NOVEMBER 2016 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that h

2、as been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers

3、, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and public

4、ations are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The

5、 information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further pr

6、ocessed and ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the

7、 address below, or refer to www.jedec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2016 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retain

8、s the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without pe

9、rmission. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Publication No. 130B -i- GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIR

10、CUITS IN UNIT CONTAINER PACKING (TUBES, TRAYS, AND TAPE AND REEL) Contents 1 Scope 12 Terms and definitions 13 Reference documents 24 Agreement 25 Guidelines 35.1 Unit pack container packing 35.2 Intermediate packing 35.3 Date codes - for Distributors only 35.4 Intermediate container Tube, Tray, or

11、Tape and Reel). Date code: Marking on device package that usually indicates device final seal or encapsulation date. PDIP: Plastic Dual-in-line package PLCC: Plastic Leaded Chip Carrier PLCCR: Rectangular PLCC QFN (MLF): Plastic Quad Flat No-lead package (Plastic Micro Lead Frame Package) SON: Plast

12、ic Dual Flat No-lead package (Plastic Dual Micro Lead Frame Package) SOIC: Plastic Small Outline Package SSOP: Plastic Shrink Small Outline Package PSOP: Power Small Outline Plastic Package TSSOP: Plastic Thin Small Outline Package MSOP: Plastic Mini Small Outline Package QSOP: Plastic Quad Small Ou

13、tline Package PQCC: Plastic Leadless Package PQFP: Plastic Quad Flat pack Package PBGA: Plastic Ball grid Array Package JEDEC Publication No. 130B Page 2 2 Terms and definitions (contd) CDIP: Ceramic Dual-In-Line (Metal Seal) Package GDIP: Ceramic Dual-In-line (Glass Seal Package) CPGA: Ceramic Pin

14、Grid Array Package CLCC: Ceramic Leadless Chip Carrier 3 Reference documents The following documents are related reference sources. CEA 556, Outer Shipping Container Bar Code Label Standard EIA 541, Packaging Material Standards for ESD Sensitive Items CEA 624, Product Package Bar Code label Standard

15、 for Non-Retail Applications JEP95, JEDEC Registered And Standard Outlines For Solid State And Related Products JESD30, Descriptive Designation System for Semiconductor-Device Packages 4 Special Formal Agreement The formal legal agreement between the Manufacturer and the Distributor may delete, chan

16、ge, or add to the criteria defined by this publication. However these deletions, changes, or additions shall not impact the quality, reliability, or traceability of the product. JEDEC Publication No. 130B Page 3 5 Guidelines 5.1 Unit pack container packing a) Unit Pack Container configurations shoul

17、d be in accordance with existing industry practices; however, the specification for overall tube length should be 22 inches (56 cm.) maximum, excluding toppers or other cushioning materials inserted in the tube. b) Components should be oriented in the same direction, in all Unit Pack Containers. c)

18、When distributors return parts, those same parts that were originally shipped in full Unit Pack Container quantities should be in full quantities. Quality defects may be excluded. d) Unit Pack Containers are not required to be barcode labeled (as an industry practice or guideline), provided they are

19、 contained inside of a barcode labeled intermediate product package (bag, box, or reel). 5.2 Intermediate packing a) Intermediate container packing process should be designed to eliminate the presence of partial quantities. b) Intermediate packing, which includes boxes, bags, reels, or other interme

20、diate containers, should have an overall length (outer dimensions) of 23.5 inches (60 cm.) maximum. (Tube Bags may be longer than 23.5 inches but must be folded to fit.) 5.3 Date codes - for distributors only a) All products shipped, shall meet product specifications and be in accordance with suppli

21、ers full warranty. For moisture sensitive parts, packing should follow requirements in IPC/JEDEC J-STD-033 b) As a preferred methodology, there should be no more than one date code per unit pack container. If this is not possible, then there should be no more than two (2) date codes in one unit pack

22、 container per intermediate packing container. If two (2) date codes are used, the unit pack container should be clearly identified as having mixed date codes. c) If possible, there should be no more than three date codes per sealed intermediate container. The label on the intermediate container sho

23、uld list all date codes. JEDEC Publication No. 130B Page 4 5 Guidelines (contd) 5.4 Intermediate container and shipping labels This standard reflects current EIA industry bar code specifications (Ref.: CEA 556, CEA 624), and should be used as an example when designing a 1-Dimensional bar code or 2-D

24、imensional label. Intermediate Container Label Mandatory Fields: The following data fields constitute a minimum requirement for bar coding applications. a) Part Number (Customer) I. Data Identifier: P II. Fixed Length? No III. Ex: P1234567 b) Date code I. Data Identifier: 9D II. Fixed Length? Yes (4

25、 characters) III. Ex: 9D9340 c) Quantity I. Data Identifier: Q II. Fixed Length? No III. Ex: Q2000 Optional Fields: Inclusion of optional data fields should be agreed upon between trading partners. (Example: traceability codes). d) Traceability Codes (optional) I. Data Identifier: IT II. Fixed Lengt

26、h? No III. Ex: 1TMA12345678 JEDEC Publication No. 130B Page 5 5.4 Intermediate container and shipping labels (contd) 3S Shipping Label Mandatory Fields: The following data fields constitute a minimum requirement for bar coding applications. a). Package ID I. Data identifier: 3S II Fixed Length? No I

27、II Make up is UCC Vendor ID QFN, SON, SSOP, PSOP, TSSOP, MSOP, QSOP, PQCC, PQFP, PBGA, GDIP, CPGA, CLCC. 2 Redefined “intermediate container” and changed term to “intermediate package container”. 2 Redefined “unit container” and changed term to “unit package container”. 2 Removed term and definition

28、 for “rail” 3 Added reference documents, JEP95 and JESD30 4 Subclause 4.4 was removed. 4 Subclause 4.6 was removed. 4 Added new clause 4 “Agreement” 4/5 Changed clause 4 to clause 5 and renumbered accordingly. 5 Generally, in the new clause 5, the term “Tube” was changed to “Unit Pack”. 7 Table 1 wa

29、s deleted. Standard Improvement Form JEDEC The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry regarding usage of the subject standard. Individuals or companies are invited to submit comments to JEDEC. All comments will be collected and dispersed to

30、the appropriate committee(s). If you can provide input, please complete this form and return to: JEDEC Attn: Publications Department 3103 North 10thStreet Suite 240 South Arlington, VA 22201-2107 Fax: 703.907.7583 1. I recommend changes to the following: Requirement, clause number Test method number Clause number The referenced clause number has proven to be: Unclear Too Rigid In Error Other 2. Recommendations for correction: 3. Other suggestions for document improvement: Submitted by Name: Phone: Company: E-mail: Address: City/State/Zip: Date: