1、JEDEC STANDARD Semiconductor Power Control Modules JESDl4 r DVEA BER 1986 (Reaffirmec JUNE 1992, APRIL 1999, APRIL 2002) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directo
2、rs level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandmgs between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting
3、 the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may invol
4、ve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound
5、 approach to product specification and application, principally from the solid state device manufacturer viewpoint. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of th
6、is JEDEC standard or publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or www.jedec.org Published by OJEDEC Solid State Technology Association 2002 2500 Wilson Boulevard Arlingtn, VA 22201-3834 This document may be downloaded free of charge; however JEDEC retains
7、the copyright on this material. By downloadmg this file the individual agrees not to charge for or resell the resulting material. PRICE: Please refer to the current Catalog of JEDEC Engineering Standards and Publications or call Global Engineering Documents, USA and Canada 1-800-854-7179, Internatio
8、nal (303) 397-7956 Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering int a license agreement. For inf
9、ormatioq contact: JEDEC Solid State Technology Association 2500 Wilson Boulevard Arlingtoq Virginia 22201-3834 or call (703) 907-7559 Paragraph INTRODUCTION 1.0 2.0 3. O 4.0 5.0 6.0 JEDEC Standard No. 14 SEMICONDUCTOR POWER CONTROL MODULES TABLE OF CONTENTS Paqe 1 SCOPE 1 CLASSES OF SEMICONDUCTOR PO
10、WER CONTROL MODULES (SPCM) 1 2.1 Thyristor SPCM 2.2 Transistor SPCM 2.3 ThyristorlDiode SPCM 2.4 Trancistor/Diode SPCM 2.5 Controlled SPCM 2.6 Miscellaneous SPCM COMMON FUNCTIONS OF INDMDUAL OR COMBINATIONS OF CEMICONDUCTOR POWER CONTROL MODULES 3.1 AC Controller 3.2 DC Controller 3.3 3.4 Single-Pha
11、se Bridge Converter 3.5 Three-phase Bridge Converter 3.6 Single-phase Inverter 3.7 Three-phase Inverter Single-Phase Center Tap (Bi-Phase) Converter COMMON CPCM CIRCUITS 4.1 Thyrsistor SPCM Circuits 4.2 Transistor SPCM PHYSICAL STRUCTURE 5.1 AC Terminals 5.2 OC Terminals 5.3 Control Terminals 5.4 Au
12、xiliary Terminals RATINGS AND CHARACTERISTICS 6;l Voltage Inputs 6.2 Input Current 6.3 Output Voltage 6.4 Output Current 6.5 Voltage Difference 1 1 1 2 2 2 2 2 2 2 2 2 2 2 3 3 7 a 8 B 8 8 B 8 0 8 8 8 JEDEC Standard No. 14 SEMICONDUCTOR POWER CONTROL MODULES TABLE OF CONTENTS (continued) Paraqraph 6.
13、6 Control Voltage 6.7 Control Current 6.8 Thermal Resistance 6.9 12t 6.10 Isolation Voltage 6.11 Creepage Distance 6.12 Strike Distance 6.13 Isolation Withstand Voltage TABLE 1 - SPCM LETTER SYMBOLS Paqe 10 JEDEC Standard No. 14 Page 1 SEMICONDUCTOR POWER CONTROL MODULES (From JEDEC Council Ballot J
14、CB-84-41, fwmulated under the cognizance of Committees JC- 22.1 on Rectifier Diodes and Thyristors and JC-22.2 on Rectifier Diodes.) INTRODUCTION This JEDEC Standard is intended to supplement discrete Standards in those situations where the subassemblies or chips within the module are supplied in co
15、mbinations consistent with the Scope outlined in paragraph 1.0. This Standard addresses only those additional specifications required as a result of the combining of the devices. 1.0 SCOPE Semiconductor Power Control Modules (SPCM) are modules consisting of Thyristors or Transistors, or both, as the
16、 primary controlling elements. Other semiconductor elements such as Rectifier Diodes, Integrated Circuits and Transient Voltage Suppressors as well as complementary passive components may be included for rectification, auxiliary cuntrol and protection. Methods of manufacture of semiconductor power c
17、ontrol modules include the assembling of individual components and the use of semiconductor hybrids or monolithic processing technologies, or both. Semiconductor Power Control Modules are proportional control assemblies and should not be confused with the solid state relay which is a non-proportiona
18、l controller. It is not necessary that the input be electrically isolated from the output. These modules are designed and manufactured with the intent that they will not be disassembled for repair. 2.0 CLASSES OF SEMICONDUCTOR POWER CONTROL MODULES (SPCM) 2.1 2.2 2.3 Thyristor SPCM A control module
19、consisting of all thyristors with the control siqnal(s) supplied from an external source. Transistor CPCM A control module consisting of all transistors with the control signal(s) supplied from an external source. Thyristor/Diode SPCM A control module consisting of thyristors and rectifier diodes wi
20、th the control cignalk) supplied from an external source. JEDEC Standard No. 14 Page 2 2.0 CLASSES OF SEMICONDUCTOR POWER CONTROL MODULES (continued) 2.4 TransistorlDiode SPCM A control module consisting of transistors and rectifier diodes with the controi signal(s) supplied from an external source.
21、 2.5 ControIled SPCM A control module consisting of any of the above-mentioned combinations of de- vices, with internal contral-signai processing circuitry which may have provisions for external adjustment. 2.6 Miscellaneous SPCM NOTE: All other combinations of the SPCM will be considered for regist
22、ration. 3.0 COMMON FUNCTIONS OF INDIVIDUAL OR COMBINA J1ONS OF SEMICONDUCTOR POWER CONTROL MODULES 3.1 AC Controller A proportional ac output is produced from an ac input. 3.2 DC Controller A proportional dc output is produced from a dc input. 3.3 Single-phase Center Tap (Bi-Phase) Converter A varia
23、ble dc output is produced from a single-phase ac input and a transformer with a center tap connection. 3.4 Single-Phase Bridge Converter A variable dc output is produced from a single-phase ac input by means of a bridge circuit. 3.5 Three-phase Bridge Converter A variable c output is produced from a
24、 three-phase ac input by means of a bridge circuit. 3.6 Cingle-Phase Inverter A single-phase ac output is produced from a dc input. 3.7 Three-phase Inverter A three-phase ac output is produced from a dc input. JEDEC Standard No. 14 Page 3 4.0 COMMON SPCM CIRCUITS 4.1 Thyristor SPCM Circuits 1 AC1 Fu
25、ll- Wave F ul-Controlled Bridge AC1 1 AC2 full- Wave Half-Con trolled Bridge JEDEC Standard No. 14 Page 4 AC 1 AC2 Full-Wave Half-Controlled Bridge, Common SCR Cathodes AC1 1 AC2 Full-Wave Half-Controlled Bridge, Common SCR Anodes JEDEC Standard No. 14 Page 5 + Full-Wave Center Tap, Common SCR Catho
26、de (Common SCR Anode also possible.) G1 AC Proportional Controller, inverse Parallel JEDEC Standard No. 14 Page 6 2 AC I Two Series-Connected SCRs (Doubler) 3 G Series-Connected Diode and SCR (Doubler) (SCR Cathode to Diode - Anode- also possible.) AC AC AC + Three-phase Half- Wave Common Cathodes J
27、EDEC Standard No. 14 Page 7 4.2 Transistor SPCM In circuits shown in paragraph 4.2, the SCRs may be replaced in whole or in part, with transistors. AO AU AC Three-phase Half- Wave, Common Anodes Three -Phase Fu 11- Wave Fu Il- Controlled Bridge (Half-Controlled Common SCR Anode and Half-Controlled C
28、ommon SCR Cathjode are also possible.) JEDEC Standard No. 14 Page 8 5.0 PHYSICAL STRUCTURE 5.1 5.2 5.3 5.4 AC Terminals The terminals which are to be connected to the ac circuit. DC Terminals The terminals which are to be connected to the dc circuit. NOTE: Control Terminals The terminals to which th
29、e external control signal is applied. Auxiliary Terminals The terminals other than those specified above that may be provided for specified purposes. The dc and ac terminals can function as either input or output terminals. 6.0 RATINGS AND CHARACTERISTICS NOTE: These ratinqs apply only to those func
30、tional characteristics of the device combinations as defined in the Introductory statement and in paraqraph 1.0, Scope. Wherever it is possible to test discrete elements of the SPCM in isolation from combinational electrical effects, these elements should be tested in accordance with exsicting devic
31、e type Standards such as EIA Recorrirriended Standards RS-282 “Standards for Silicon Rectifier Diodes and Stacks“, RS-397 “Recommended Standards for Thyristors“ and JEDEC Standard No. 10 “Law Frequency Power Transistors“. 6.1 Input Voltage The voltage at the input terminais. 6.2 Input Current The cu
32、rrent at the input terminals. 6.3 Output Voltage The voltage at the output terminals. 6.4 Output Current The current at the output terminals. 6.5 Voltage Difference The voltaye between specified terminals. JEDEC Standard No. 14 Page 9 6.0 RATINGS AND CHARACTERISTICS (continued) 6.6 Control Voltaye T
33、he voltage at the control terminals. 6.7 Control Current Current at the control terminals. 6.8 Thermal Resistance The resistance ta heat transfer between each junction and specified reference point(s) on the case. The product of t.he square of the rrns current and the time for an on-state (or forwar
34、d) non-repetitive surge current nf time duration not exceeding 10 ms for a single discrete element. 6.10 Isolation Voltage The rms ac or dc voltage which may be applied continuously between the mounting surface und all of the terminals and also between terminals of isolated circuits. 6.11 Creepage D
35、iet ., once The shortest distance over the surface between specified terminals ar a mounting surf ace. 6-12 Strike Distance The shortest distance in air between specified terminals or between a specified terminal and a mounting surface. 6.13 Isolation Withstand Voltage The rmc uc or dc voltage used for short-time testing of the insulation between the mounting surface and all of the terminals and also between terminals of isolated circuits. JEDEC Standard No. 14 Page 10 / o n I p1 u C m 4 m I- crl U I I I I I 1 I I I I I QI u C m U v) .- n a L u Y m a, .- u
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