JEDEC JESD213-2010 Common Test Method for Detecting Component Surface Finish Materials.pdf

1、JEDEC STANDARD Common Test Method for Detecting Component Surface Finish Materials JESD213 MARCH 2010 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subseq

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5、ct specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with this stand

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9、nse agreement. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or call (703) 907-7559 JEDEC Standard No. 213 -i- Common Test Method for Detecting Component Surface Finish Materials Contents PageForeword ii1 Scope 12 N

10、ormative references 13 Terms and definitions 14 Apparatus 25 Procedure 3Tables 1 Matching XRF Instrument Beam Size to Sample Size 3Figures 1 Example Measurement Zone on Surface Mounted Devices 4JEDEC Standard No. 213 -ii- Foreword This document is intended to be used by Original Component Manufactur

11、ers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended to be applied prior to delivery by the OCMs and may be used by OEM system engineers and procuring activities as well as U.S Government Department of Defense system engin

12、eers, procuring activities and repair centers. This document was drafted in cooperation between JEDEC JC-13 and TechAmerica G-12 committees. This document does not cancel or replace in whole or in part any other standard but was released with the intention that the initially released document and su

13、bsequent revisions be referenced by MIL-STD-202, MIL-STD-750 and MIL-STD-883. Release and publication of this document constitutes approval by the JEDEC Board of Directors. JEDEC Standard No. 213 Page 1 Common Test Method for Detecting Component Surface Finish Materials (From JEDEC Board Ballot JCB-

14、10-17, formulated under the cognizance of the JC-13 Committee, Government Liaison.) 1 Scope This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn / Pb) alloys and electroplated finishes containing at least

15、3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment. 2 Normative references The following normative documents contain provisions that, through reference in this text, constitute provisions of this standard. For dated references, subsequent amendments to, or revisions of, any of

16、 these publications do not apply. However, parties to agreements based on this standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to appl

17、ies. MIL-STD-1916, Department of Defense Test Method Standard DoD Preferred Method for Acceptance of a Product. 3 Terms and definitions For the purposes of this standard, the following terms and definitions apply. alignment: The adjustment of an object in relation with other objects, or a static ori

18、entation of some object or set of objects in relation to others. focusing: The action of directing rays toward a point where the rays converge. Beam Collimation: The process of restricting and confining an x-ray beam to a given area. Scanning Electron Microscopy-Energy Dispersive Spectroscopy (SEM-E

19、DS): Measures the number of x-rays produced by a solid sample when irradiated by electrons versus the energy of these x-rays. NOTE The EDS technique identifies and quantifies the element constituents of the sample when performed using appropriate standards. Spatial Resolution: The minimum distance b

20、etween two adjacent features or the minimum size of a feature, that can be detected by a remote sensing system. X-Ray Fluorescence (XRF): The process of emissions of characteristic x-rays. NOTE Analysis using x-ray fluorescence is called “X-ray Fluorescence Spectroscopy.“ JEDEC Standard No. 213 Page

21、 2 4 Apparatus 4.1 XRF Instrumentation The XRF instrument shall be capable of qualitatively identifying the metals present in a complex sample and providing quantitative accuracy sufficient to insure at least 3 wt% Lead (Pb). 4.2 X-Ray Detector The detector resolution shall be sufficient to quantify

22、 lead (Pb) with +/- 2 wt% accuracy, in the range from 0 to 10 wt%, in combination with interfering energy lines from elements such as bismuth (Bi). Note, proportional counter detectors may not be able to meet this requirement, a peltier cooled pin diode detector or detector providing increased resol

23、ution may be required to achieve this. The excitation voltage for the X-rays shall be a minimum of 40 KeV to support detection of higher energy lines. 4.3 Alignment, Focusing System, and Scanning Capability XRF systems shall have an alignment and focusing system. The alignment and focusing system mu

24、st provide visual identification of the desired surface being analyzed. A surface scanning capability may be necessary, depending on component size, X-ray beam size, and presence of surface composition irregularities, to achieve average quantitative composition during scanning of very small surfaces

25、. When scanning capability is not utilized or available, the mean value of at least 5 measurements, using randomly selected locations, where sigma is the standard deviation of those 5 measurements, shall be evaluated using the acceptance criteria in 5.5. 4.4 Spatial Resolution The spatial resolution

26、 of the instrument must be sufficient to identify the material composition of the area under analysis, excluding adjacent materials. The spatial resolution of the instrument shall be verified on a periodic basis. This requires an X-ray beam size smaller than the surface analyzed, or a technique that

27、 proves materials surrounding the surface under test do not contain the Prohibited Materials. Table I provides the typical instrument capabilities and sample types appropriate for each. 4.5 Measurement Area Scanning or other averaging to 15 square mil area, or the maximum available area if less than

28、 15 square mils, shall be performed when using the capillary optic collimated XRF instruments. 4.6 Positioning Fixtures Positioning fixtures or sample trays shall be made of materials that do not interfere with the accuracy of the analysis, e.g., commercially pure aluminum. 4.7 Verification Standard

29、s For tin lead (Sn / Pb) alloys, a tin-lead composition standard with a lead content of 3.0 wt% is required. This Sn / Pb standard shall be a cast alloy sample made from high purity tin and lead. The values for the standards shall be traceable to values provided by the National Institute of Standard

30、s and Technology (NIST). If surface finish thickness is a concern, a foil standard of 99.9 wt% tin of a specified thickness consistent with component design is required. NOTE For guidance on traceability to values for NIST Standard Reference Materials or other certified reference materials, refer to

31、 the NIST Policy on Traceability at http:/ts.nist.gov/traceability/. JEDEC Standard No. 213 Page 3 4 Apparatus (contd) Table 1 Matching XRF Instrument Beam Size to Sample Size 5 Procedure 5.1 Verification The equipment calibration shall be verified at the beginning of each work shift by measuring th

32、e Tin Lead (Sn / Pb) reference material. If surface finish thickness is a concern, the foil reference materials shall be read over a substrate similar to the sample. The result must agree with the assigned value for the reference material after taking into account the uncertainty of the assigned val

33、ue and the laboratorys uncertainty. (i.e., if a 3.0 wt% Lead (Pb) standard has a tolerance of 10%, the allowable range would be 2.7 to 3.3 wt % Lead (Pb).) It may be useful to implement a control chart to monitor this comparison. 5.2 Scanning Each visually identifiable component metal surface requir

34、es a separate scan; for example, metal device leads, cans, and lids all require individual scans. 5.3 Sampling Plans Sample size shall be a minimum of five (5) components per plating lot, or as specified in a statistically based sampling plan derived from MIL-STD-1916. If visual inspection of the an

35、alysis surface at 30X can provide evidence of material homogeneity, one spot per sample may be analyzed. If the sample surface is visually heterogeneous at 30X magnification or less, each visually distinct surface requires a separate scan on each sample. The testing facility shall determine the numb

36、er of spot location measurements required per sample to ensure a high level of confidence is obtained. This determination shall be based upon the equipment used for testing, manufacturing processes, materials used and geometry of the component being tested (see 4.3.) Beam Collimation X-ray Beam Size

37、 Sample Area Typical Samples Exclusions Capillary Optic (SEM Mounted X-ray detector) 2 mil (50 m) (see note *) 6 sq. mil (0.004 sq. mm) to 50 sq. mil (0.032 sq. mm) Chip components, fine wire, round leaded devices Rounded or irregular surfaces that change height more than 10 mils (250 m) relative to

38、 a line tangent to the highest point Capillary Optic (Benchtop XRF) 3 mil (80 m) 15 sq. mil (0.009 sq. mm) to 200 sq. mil (0.13 sq. mm) Chip components, fine wire, round leaded devices Rounded or irregular surfaces that change height more than 10 mils (250 m) relative to a line tangent to the highes

39、t point Mechanical Slot (Benchtop XRF) 8 mil (203 m) 128 sq. mil (0.083 sq. mm) to 0.25 sq. inch (1.6 sq. cm) SMT diodes, Ribbon leaded components, wire and cable, hardware Size limited Mechanical Slot (Handheld XRF) About 400 mil (1 mm to 10 mm) As small as 0.25 sq. inch (1.6 sq. cm.) Fasteners and

40、 hardware Size limited *In this case, the primary beam is an electron beam, not an X-ray beam. JEDEC Standard No. 213 Page 4 5 Procedure (contd) 5.4 Measurements Each sample shall be measured independently. Scanning multiple samples under the X-ray beam at one time is not acceptable. The samples sho

41、uld be measured on a flat surface, when possible. For non-flat or rounded surfaces, the sample must be measured at the center to prevent extending beyond the sample edge. Caution should be exercised to prevent X-ray beam scatter by measuring on non-flat surfaces. 5.4.1 Leaded devices shall be measur

42、ed as closely as practical to the device body, with care to exclude the body material. A second location away from the device body shall also be measured. 5.4.2 Devices with varied geometry shall be measured at each different plane. In all cases, the X-ray spot or beam size shall be small enough to

43、remain within the area under test with a guard band area approximating the beam diameter. Large pad devices shall be scanned in one location with adequate scan size to meet accuracy and reproducibility requirements, rather than scanning the entire surface (see Figure 1). Figure 1 Example Measurement

44、 Zone on Surface Mounted Devices 5.5 Acceptance Criteria For Tin (Sn) and Lead (Pb) containing samples the lot shall pass if each of the measured readings are 3.0 wt% Lead (Pb) unless otherwise specified in the contract or acquisition document. These minimums shall be adjusted to account for the equ

45、ipment accuracy established per a Gauge Reproducibility and Repeatability study (i.e., if the equipment has an established accuracy of 20%, the required minimum is 3.6 wt% Lead (Pb).) One rejected sample shall be cause of rejection for the entire sample lot. A failed lot shall remain rejected, or be

46、 reworked, or be evaluated per 5.6. 5.6 Alternate Acceptance Method If the lot is not rejected or reworked, alternate acceptance of the XRF materials analysis shall be conducted when the Pb content fails minimum requirements by XRF analysis per 5.5 or segregation of the Lead (Pb) and Tin (Sn) is sus

47、pected. 5.6.1 The composition shall be confirmed by cross-section and SEM-EDS measurements. Because SEM-EDS does not penetrate as deeply as XRF, measurements shall be taken at the solder surface, in the middle of the cross-section, and at the interface with the substrate. Samples confirmed by SEM-ED

48、S to have 3.0 wt% Pb (Lead) at any scan location shall be considered rejections.Rev. 7/08 Standard Improvement Form JEDEC The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry regarding usage of the subject standard. Individuals or companies are invite

49、d to submit comments to JEDEC. All comments will be collected and dispersed to the appropriate committee(s). If you can provide input, please complete this form and return to: JEDEC Attn: Publications Department 3103 North 10thStreet Suite 240 South Arlington, VA 22201-2107 Fax: 703.907.7583 1. I recommend changes to the following: Requirement, clause number Test method number Clause number The referenced clause number has proven to be: Unclear Too Rigid In Error Other 2. Recommendations for correction: 3. Other suggestions for document improve