JEDEC JESD22-B105D-2011 Lead Integrity.pdf

1、 JEDEC STANDARD Lead Integrity JESD22-B105D (Revision of JESD22-B105C, May 2003, Reaffirmed June 2006) JULY 2011 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level

2、 and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the pu

3、rchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve pate

4、nts or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approa

5、ch to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with

6、 this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents for alterna

7、tive contact information. Published by JEDEC Solid State Technology Association 2011 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees no

8、t to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copi

9、es through entering into a license agreement. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards and Documents for alternative contact information. JEDEC Standard No. 22-B105D Pa

10、ge 1 Test Method B105D (Revision of Test Method B105C) TEST METHOD B105D LEAD INTEGRITY (From JEDEC Board Ballot JCB-11-44, formulated under the cognizance of JC-14.1 Committee on Reliability Test Methods for Packaged Devices.) 1 Scope This test method provides various tests for determining the inte

11、grity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly. For hermetic packages, it is recommended that this test be followed by hermeticity tests in accordance with JESD22A109 (Test Method A109) to determin

12、e if there are any adverse effects from the stresses applied to the seals as well as to the leads. These tests, including each of its test conditions, are considered destructive and are only recommended for qualification testing. This test is applicable to all through-hole devices and surface-mount

13、devices requiring lead forming by the user. The following is a summary of the test conditions in this standard; a) Test Condition A - Tension This test condition provides for the application of straight tensile loading. See clause 6. b) Test Condition B - Bending Stress This test condition provides

14、for the application of bending stresses to determine the integrity of leads, seals and lead plating. See clause 7. c) Test Condition C - Lead Fatigue This test condition provides for the application of bending stresses primarily to determine the resistance of the leads to metal fatigue under repeate

15、d bending. See clause 8. d) Test Condition D - Lead Torque This test condition provides for the application of stresses to the leads to determine the resistance of seals and leads to twisting motions. See clause 9. e) Test Condition E - Stud Torque This test condition provides for the application of

16、 stresses on a threaded mounting stud caused by tightening the device during mounting. See clause 10. 2 Normative reference JESD22-A109, Hermeticity. JEDEC Standard No. 22-B105D Page 2 Test Method B105D (Revision of Test Method B105C) 3 Apparatus See applicable test condition. 4 General procedure ap

17、plicable to all test conditions The device shall be subjected to the stress described in the specified test condition and the specified end point measurements and inspections shall be made except for initial conditioning unless otherwise specified. When possible, the stress shall be applied to rando

18、mly selected leads from each device. The same leads shall not be used for more than one test condition. 5 General summary The following details, and those required by the specific test condition, shall be specified in the applicable procurement document: a) Test Condition Letter b) Sample size (comb

19、inations of number of leads per device and number of devices) and quality level. The sample size shall not consist of less than 3 devices 6 Test Condition A - Tension 6.1 Purpose This test is designed to check the capabilities of the device, leads, welds, and seals to withstand a straight pull. 6.2

20、Apparatus The tension test requires suitable clamps and fixtures for securing the device and attaching the specified weight without lead restriction. Equivalent linear pull test equipment may be used. 6.3 Procedure A tension of 8.0 + 0.5 oz (227 + 14 gram) shall be applied without shock to each lead

21、 to be tested in a direction parallel to the axis of the lead or terminal and the tension shall be maintained for 30 seconds minimum. The tension shall be applied as close to the end of the lead as practicable. JEDEC Standard No. 22-B105D Page 3 Test Method B105D (Revision of Test Method B105C) 6.3

22、Procedure (contd) 6.3.1 Measurements Hermeticity test on hermetically sealed packages, visual examination, and electrical measurements that consist of parametric and functional tests, shall be taken as specified in the applicable procurement document. 6.3.2 Failure criteria After the removal of the

23、stress, examine the device using a magnification between 10X and 20X. Any evidence of breakage, loosening, or relative motion between the lead and the device body shall be considered a device failure. When hermeticity tests are conducted (in accordance with Test Method A109) as a post measurement, m

24、eniscus cracks shall not be a cause for rejection of the devices, which have passed the tests. Failure of any specified post electrical measurement shall be considered a cause for failure. 6.4 Summary The following details shall be specified in the applicable procurement documents: a) Weight to be a

25、ttached to lead, if other than 8.0 + 0.5 oz (227 + 14 gram). b) Length of time weight is to be attached, if other than 30 seconds. c) Failure criteria, if other than specified. 7 Test Condition B - Bending Stress 7.1 Purpose This test is designed to check the capability of the leads, lead finish, le

26、ad welds and seals of the devices to withstand stresses to the leads and seals which might reasonably be expected to occur from actual handling and assembly of the devices in application. 7.2 Apparatus The bending test requires attaching devices, clamps, supports or other suitable hardware, necessar

27、y to apply the bending stress through the specified bend angle. JEDEC Standard No. 22-B105D Page 4 Test Method B105D (Revision of Test Method B105C) 7.3 Procedure Each lead of the sample shall be subjected to a force sufficient to bend the lead as specified in paragraphs 7.3.1 through 7.3.6, as appl

28、icable. Any number, or all of the leads of the test device, may be bent simultaneously. Rows of leads may be bent one row at a time. Each lead shall be bent through one cycle as follows: Bend through the specified arc in one direction and return to the original position. All arcs shall be made in th

29、e same plane, without lead restriction. 7.3.1 Direction of bends Test leads shall be bent in the least rigid direction. If there is no least rigid direction, the leads may be bent in any direction. No lead shall be bent so as to interfere with another lead. If interference is unavoidable, the test l

30、ead shall be bent in the opposite direction to the angle specified and returned to its normal position. 7.3.2 Procedure for initial conditioning for environmental test When normally straight leads are supplied in a formed condition (including the staggered lead dual-in-line configuration), the lead

31、forming operation shall be considered acceptable initial conditioning in place of that specified, providing the lead forming has been performed after lead plating and the forming is at least as severe in permanent lead deformation as the specified bending. 7.3.3 Procedure for flat-packs and axial le

32、ad metal-can devices (e.g., flexible and semi-flexible leads) 7.3.3.1 Flexible leads A lead shall be considered flexible if its section modulus (in the least rigid direction) is less than or equal to that of a rectangular lead with a cross section of 0.006 x 0.020 inch (0.15 x 0.51 mm). Round leads

33、less than or equal to 0.020 inch (0.51 mm) in diameter shall be considered flexible. Flexible leads shall be bent through an arc of at least 45o (see Figure 1), measured at a distance 0.12 + 0.03 inch (3.05 + 0.76 mm) along the lead from the seal unless otherwise specified. Figure 1 Flexible lead be

34、nd 45JEDEC Standard No. 22-B105D Page 5 Test Method B105D (Revision of Test Method B105C) 7.3.3 Procedure for flat-packs and axial lead metal-can devices (e.g., flexible and semi-flexible leads) (contd) 7.3.3.2 Semi-flexible leads Semi-flexible leads are those leads with a section modulus (in the le

35、ast rigid direction) greater than that of a rectangular lead with a cross section of 0.006 x 0.020 inch (0.15 x 0.51 mm), which is intended to be bent during insertion or other application. Round leads greater than 0.020 inch (0.51 mm) in diameter shall be considered semi-flexible. Semi-flexible lea

36、ds shall be bent through an arc of a least 30o (see Figure 2), measured at the lead extremities, unless otherwise specified. Figure 2 Semi-flexible lead bend 7.3.4 Procedure for dual-in-line through hole package leads Dual-in-line package leads are leads with more than one section modulus, and with

37、leads normally aligned in parallel at 90oangle from the bottom of the package during insertion. Dual-in-line package leads shall be bent inward through an angle sufficient to cause the lead to retain a permanent bend (i.e., after stress removal) of at least 15o, measured at the lead extremities abou

38、t the first bend. For packages that have the shoulder restrained (see configuration 1-3 of Figure 3), the angle of the bend shall be measured from the seating plane to the lead extremities. At the completion of the initial bend, the leads shall be returned to their approximate original position. 30

39、JEDEC Standard No. 22-B105D Page 6 Test Method B105D (Revision of Test Method B105C) 7.3.4 Procedure for dual-in-line through hole package leads (contd) Figure 3 Package configurations JEDEC Standard No. 22-B105D Page 7 Test Method B105D (Revision of Test Method B105C) 7.3.5 Procedure for small outl

40、ines (SO) and quad fine pitch (QFP) gull wing formed packages 7.3.5.1 Small outline (SO) and quad fine pitch (QFP) packages Small Outline (SO) Packages shall have leads bent outward at 15o, then inward 30o, then returned to the original position (see Figure 4). Figure 4 SO and QFP lead bend 7.3.6 Pr

41、ocedure for “J“ leaded SO and chip carrier (LCC) packages 7.3.6.1 Leads The leads to be tested shall be selected at random from each package in the test sample. Leads from two adjacent sides shall be sampled from each part. Prepare and test only one row of leads at a time. 7.3.6.2 Straightening “J“

42、leads 1) Mount the device in a fixture equivalent to Figure 6. 2) Use suitable tweezers to straighten the lead below the lead shoulder and transition region (see Figure 5). 3) Carefully straighten the “J“ bend portion of the LCC package leads to position approximately perpendicular to the widest dim

43、ension. 4) Great care must be taken to prevent damage to the lead, such as nicks, kinks, or deep scratches. Figure 5 “J” Lead Contour JEDEC Standard No. 22-B105D Page 8 Test Method B105D (Revision of Test Method B105C) 7.3.6 Procedure for “J“ leaded SO and chip carrier (LCC) packages (contd) 7.3.6.3

44、 Lead inspection Inspect each lead before and after straightening using a low power optical microscope between 10X and 20X magnification. Do not test any leads damaged by the straightening operation. 7.3.6.4 Mounting LCC package Mount the LCC package in a lead bend test fixture using necessary space

45、rs, with the leads to be tested pointing straight down, i.e., at a 90oangle or normal to the bottom of the package. 7.3.6.5 Test Test in accordance with 7.3.4 except that the direction of bend shall be outward from the package (see Figure 6). Figure 6 Holding fixture for straightening and lead bend

46、for “J” lead configurations JEDEC Standard No. 22-B105D Page 9 Test Method B105D (Revision of Test Method B105C) 7.3.6 Procedure for “J“ leaded SO and chip carrier (LCC) packages (contd) 7.3.6.6 Rotating package body Select another untested lead and attach a 16 + 0.5 oz (454 + 14 gram) weight below

47、the standoff (neck down) portion of the straightened lead. Care should be taken to not twist or otherwise bend the lead under test or adjacent leads. Rotate the package body through a 30oarc and return to its original position. This completes one cycle and should take 2 - 5 seconds. The rotation of

48、the part must be done so as to avoid swinging or twisting motions of the weight. 7.3.7 Measurements Hermeticity tests on hermetically sealed packages, visual examination and electrical measurements shall be taken as specified in the applicable procurement document. 7.3.8 Failure criteria After remov

49、al of the stress, examine the device using magnification between 10X and 20X. Any evidence of breakage, loosening or relative motion between the terminal lead and the device body shall be considered a device failure. Devices that failed at post test measurement, when specified, shall also be considered to have failed. 7.3.8.1 LCC and SO package bend For the LCC package bend, failure criteria over the entire lead is applicable to paragraph 7.3.6.5 and restricted to maximum width region for the conditions described in paragraph 7.3.6.6. 7.4 Summary The following details sha