JEDEC JESD51-50-2012 Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs).pdf

1、 JEDEC STANDARD Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs) JESD51-50 APRIL 2012 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, r

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10、 alternative contact information. JEDEC Standard No. 51-50 -i- OVERVIEW OF METHODOLOGIES FOR THE THERMAL MEASUREMENT OF SINGLE- AND MULTI-CHIP, SINGLE- AND MULTI-PN-JUNCTION LIGHT-EMITTING DIODES (LEDS) CONTENTS Foreword.ii 1 Scope1 2 Rationale 2 3 Purpose.2 4 Data presentation3 JEDEC Standard No. 5

11、1-50 -ii- Foreword This document provides an overview of the methodology necessary for making meaningful thermal measurements on high-power light-emitting diodes (LEDs) built on single or multiple chips with one or more pn-junctions per chip. The actual methodology components are contained in separa

12、te detailed documents. JEDEC Standard No. 51-50 Page 1 OVERVIEW OF METHODOLOGIES FOR THE THERMAL MEASUREMENT OF SINGLE- AND MULTI-CHIP, SINGLE- AND MULTI-PN-JUNCTION LIGHT-EMITTING DIODES (LEDS) (From JEDEC Board Ballot JCB-12-07, formulated under the cognizance of the JC-15 Committee on Thermal Cha

13、racterization.) 1 Scope The measurement methodology described herein is distributed among several documents so that the appropriate combination of documents can be selected to meet specific thermal measurement requirements. This document provides the OVERVIEW; the rest of the documents are grouped a

14、s shown below: Each group will have one or more applicable documents to reflect different thermal measurement requirements. Because environmental conditions, component mounting approaches and device construction techniques and processes will change as technology changes, additional documents will be

15、 added to these groups as the needs arise and standards established. As appropriate, each of these documents will contain terminology and symbolic definitions that are specific to the material covered by the individual document; this information will also be included in a single document to make for

16、 easy access. LED thermal testing standards OVERVIEW Measurement of AC LEDs Measurement of Rthduring IESNA LM80 tests THERMAL MEASUREMENT THERMAL ENVIRONMENT COMPONENT MOUNTINGCOMPONENTCONSTRUCTIONAPPLICATION GUIDELINES Electrical Test Method for DC driven LEDs, static test method Guideline for Esti

17、mation Measurements (as proposed by NIST) ?MODELINGModel validation procedures Guidelines for combining CIE 127-2007 measurements with thermal measurements Natural Convection Heat Sink Forced Convection Heat Sink MountingThermal Test BoardTest LuminairesSingle Light Source LED Multi-Light Source LED

18、 ? ?Terms, Definitions TJis the change of junction temperature as a response to the change in the dissipated power oC. Under carefully defined conditions for a specific environment, the change in junction temperature can be determined as follows: TJ= PH RJX+ TX (2) resulting in TJX= TJ TX= PH RJX= P

19、H JX(3) where PHis the dissipated power in the device (measured in W); RJXis the thermal resistance from the device junction to the specific environment X (measured in K/W). In the case of LEDs in which a significant portion of the applied electrical power is converted to optical power output, the p

20、ower dissipation is defined as PH= Pel Popt= IF VF Popt(4) where Pelis the applied electrical power to the device W (calculated as the product of the forward current and the forward voltage); Poptis the devices emitted optical power W (also known as e, the total radiant flux) when IF, forward curren

21、t, is applied when the device is in an environment at a reference temperature of TX. JEDEC Standard No. 51-50 Page 3 3 Purpose (contd) The thermal resistance term (RJX) is highly dependent on the environment surrounding the device. The two most common environments, infinite heat sink and natural con

22、vection, usually define the practical limits of thermal resistance, but may not represent typical component environments. The Environmental and Component Mounting documents that accompany this document provide alternatives that approach to those found in actual semiconductor applications. The therma

23、l resistance symbol (either RJX, RthJXor JX) is only applicable when the thermal measurements are performed in a manner that strictly conforms to the standards that define and control the heat flow from the junction to the thermal test environment. For those situations that have non-standard heat fl

24、ow environments in which there is only a partial heat flow towards environment X, a thermal characterization parameter (JX) is the appropriate choice for specifying thermal performance. 4 Data presentation Thermal data are not meaningful unless all the pertinent test condition information is provide

25、d with the actual thermal data. Because the test conditions and data will vary with the type of thermal test being performed, the documents for each of the measurement areas listed below in Table 1 state the thermal information necessary for a complete description of the data. Table 1 Thermal measur

26、ement test condition and data parameter summary Measurement Area Condition Parameter(s) Data Parameter(s) Thermal Measurement Refer to appropriate document Refer to appropriate document Environmental Refer to appropriate document Refer to appropriate document Component Mounting Refer to appropriate

27、document Refer to appropriate document Device Construction Refer to appropriate document Refer to appropriate document Environmental conditions, component mounting approaches and device construction techniques and processes will change as technology and applications change, thus necessitating contin

28、ual additions to each of the measurement area groups listed in Table 1. JEDEC Standard No. 51-50 Page 4 Rev. 7/08 Standard Improvement Form JEDEC JESD51-50 The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry regarding usage of the subject standard. I

29、ndividuals or companies are invited to submit comments to JEDEC. All comments will be collected and dispersed to the appropriate committee(s). If you can provide input, please complete this form and return to: JEDEC Attn: Publications Department 3103 North 10thStreet Suite 240 South Arlington, VA 22

30、201-2107 Fax: 703.907.7583 1. I recommend changes to the following: Requirement, clause number Test method number Clause number The referenced clause number has proven to be: Unclear Too Rigid In Error Other 2. Recommendations for correction: 3. Other suggestions for document improvement: Submitted by Name: Phone: Company: E-mail: Address: City/State/Zip: Date: