JEDEC JESD9C-2017 Inspection Criteria for Microelectronic Packages and Covers.pdf

1、JEDEC STANDARD Inspection Criteria for Microelectronic Packages and Covers JESD9C (Revision of JESD9B, May 2011) MAY 2017 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Direct

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5、nd approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conform

6、ance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents fo

7、r alternative contact information. Published by JEDEC Solid State Technology Association 2017 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual

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9、on 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 9C -i- INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS Contents Page Foreword ii 1 Scope 1 2 Normative Reference 1 3 Terms and

10、Definitions 2 4 General Requirements 10 4.1 Quality System 10 4.2 Quality and Screening 10 4.3 Order of Precedence 10 4.4 Optical Inspection Magnification 10 4.5 Controlling Dimension 10 5 Insulator Criteria (Metal Packages: Glass-to-metal and Ceramic-to-metal Seals) 11 5.1 Insulator Bubbles 11 5.2

11、Insulator Cracks, Chip-outs, Crazing 13 5.3 Insulator Climb, Overflow, Splatter 17 5.4 Other Insulator Conditions 19 6 Braze Criteria (Metal Packages) 21 6.1 Undercut Braze, Non-continuous Braze, Misalignment 21 6.2 Porous and Peeling Braze 22 6.3 Braze Run-out 23 6.4 Braze Climb 24 7 Leads (Metal a

12、nd Ceramic Packages) 26 7.1 Lead Nicks, Pits, Voids, Indentations, Scratches, Over-etching, Protrusions 26 7.2 Lead Surface Finish 29 7.3 Off-center, Bent, Angled, or Broken Leads 31 8 General Package Criteria (Metal Packages) 34 8.1 Package Nicks, Pits, Voids, Indentations, Scratches, Protrusions,

13、Chip-outs 34 8.2 Package Surface Finish 40 9 General Cover Criteria (Metal Covers) 42 9.1 Cover Nicks, Pits, Voids, Indentations, Scratches, Protrusions, Chip-outs 42 9.2 Cover Surface Finish 45 10 General Package Criteria (Ceramic Packages: Non-metallized Areas) 46 10.1 Ceramic Chip-outs, Cracks, D

14、elamination, Separation, Voiding, Protrusions, Fins 46 11 Metallization Criteria (Ceramic Packages) 50 11.1 General 50 11.2 Contact Pad Metallization 50 11.3 Seal Area Metallization 53 11.4 Bonding Area Metallization 57 11.5 Die Attach Area 61 11.6 Braze Pad Metallization 64 11.7 Castellation Metall

15、ization 66 12 Lead Attachment (Ceramic Packages) 67 12.1 Lead to Braze Pad Attachment 67 12.2 Lead to Pad Misalignment 69 Annex A (informative) Index of Figures 70 Annex B (informative) Differences between revisions 73 JEDEC Standard No. 9C -ii- Foreword The purpose of this JEDEC standard is to veri

16、fy the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits / microcircuits (hereafter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the micro

17、circuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contra

18、dict, with MIL-STD-883, Test Method 2009: External Visual. This standard provides the package manufacturer, microcircuit manufacturer, and microcircuit customer a complete set of microelectronic package workmanship inspection requirements. JEDEC Standard No. 9C Page 1 INSPECTION CRITERIA FOR MICROEL

19、ECTRONIC PACKAGES AND COVERS (From JEDEC Board Ballot JCB-11-23 and JCb-17-05, formulated under the cognizance of the JC-13.5 Committee on Hybrid Microcircuit Technology) 1 Scope This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and

20、covers (lids). 2 Normative Reference The following normative documents contain provisions that, through reference in this text, constitute provisions of this standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreeme

21、nts based on this standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. MIL-PRF-38534, Hybrid Microcircuits, General Specificati

22、on for MIL-PRF-38535, Microcircuits, General Specification for MIL-STD-883, Test Method Standard, Microcircuits Military Standards are available in electronic format from: http:/quicksearch.dla.mil/. JEDEC Standard No. 9C Page 2 3 Terms and Definitions For the purpose of this standard, the terms, de

23、finitions, and symbols of MIL-PRF-38534, MIL-PRF-38535, and MIL-STD-883 and the following shall apply and shall be used in the applicable procurement documentation: 3.1 annular ring: The metallization pad area around the top or bottom of a castellation hole. 3.2 base: The bottom main support area of

24、 a package. 3.3 base metal: The unplated main metal material of which the metal package, lead, or braze is constructed. 3.4 blistering: Detachment of material from the surface creating a bubble-like shape. 3.5 bonding (critical) area: The surface on a lead or package to which wires will be bonded (i

25、.e., the wirebond area). NOTE 1 This term is not to be confused with the “die bond area” which is specified as the “die attach area” in this standard. NOTE 2 The critical wire bond area on a ceramic package is a metallization trace whose length is 0.015 inches (0.381 mm) and whose width is 80% of th

26、e width of the designed wirebond trace, as specified in the applicable procurement document. 3.6 bonding trace; wirebond trace: A metallized path on a package or substrate to which a bond wire is wirebonded. 3.7 braze: A metallic material used to join two metals or metallized components. 3.8 braze c

27、limb: The distance from the surface of the package to the top of the braze line on a lead, not including braze flash. 3.9 braze flash: The braze material that has flowed over or out of the designed contained braze area and is less than 0.001 inches (0.0254 mm) thick. 3.10 braze run-out: The braze ma

28、terial that has flowed over or out of the designed contained braze area, not including braze flash. 3.11 braze, undercut: The braze material recessed from the package surface at the interface of the package wall and the package base. 3.12 bubble, subsurface: A bubble in the glass-to-metal seal that

29、is below the top surface of the seal and is not open or can not be opened with a wood probe. JEDEC Standard No. 9C Page 3 3 Terms and Definitions (contd) 3.13 bubble, surface; open-surface bubble: A bubble in the glass-to-metal seal that is at the top surface of the seal and is either open or can be

30、 opened with a wood probe. 3.14 castellation: A semicircular or crown-shaped metallized surface. 3.15 chip-out: An area where a crack has allowed a portion of the insulator to break away leaving a void in the insulator at the metal interface. 3.16 concentric: Having a common center point. 3.17 corro

31、sion: The breaking down or destruction of a material, especially a metal, through a chemical reaction. NOTE The most common form of corrosion is rusting, which occurs when iron combines with oxygen and water. 3.18 cover: A lid that is soldered, seam-sealed, projection-welded, etc. to the package to

32、create a hermetically sealed microcircuit. 3.19 crack, circumferential: A crack that appears on the surface of an insulator and follows the shape of the package hole. 3.20 crack, meniscus: A crack confined to the meniscus area of the seal above the average low point of the insulator. 3.21 crack, rad

33、ial: A crack that appears on the surface of the insulator and either starts at the package and extends towards the lead or starts at the lead and extends towards the package propagating past the average low point of the insulator. 3.22 crazing: Multiple minute cracks that appear on the surface of th

34、e insulator. 3.23 delamination: The detachment of a sheet-like layer of material from a surface. JEDEC Standard No. 9C Page 4 3 Terms and Definitions (contd) 3.24 die (attach) area: An area of a package used for die placement and typically located on the bottom inside surface of the base of the pack

35、age. NOTE For ceramic package cavities, the die attach area is defined as the area that is within a 0.020-inch (0.508-mm) perimeter from the die attach cavity wall (Figure 3.24-1). Figure 3.24-1 Critical die attach area in a ceramic package cavity 3.25 eyelet: A ring of metal used as the outside mem

36、ber of a hermetic lead seal to hold a feed-through in place, typically soldered into the package. 3.26 fin: A fine feather edge protrusion occurring at an edge. 3.27 fin, hanging: A fin that can be moved with a probe but is still connected to the surface. 3.28 flaking: The detachment of a sheet-like

37、 layer of material from a surface. 3.29 foreign material: Any adhering material or residue not intentionally added or included in the piece part composition by design. 3.30 heat sink: A heat exchange material, typically metal or ceramic, designed to absorb and dissipate excess heat from one or more

38、devices in a circuit. 3.31 indentation: A notch or deep recess in a surface. 3.32 insulator: A lead seal material (typically matched glass, compression glass, or brazed ceramic) that electrically isolates a lead from the package and creates a hermetic seal. 3.33 insulator climb: The amount of insula

39、tor measured from the surface of the package to the top of the insulator line on the lead. JEDEC Standard No. 9C Page 5 3 Terms and Definitions (contd) 3.34 insulator overflow: The insulator that flows over or out of the designed contained insulator area, typically the package hole. 3.35 insulator s

40、platter: Small particles of the insulator that adhere to the surfaces of the package or lead during fusing and remain attached after cleaning or plating or both. 3.36 insulator webbing: The joining of overflow between adjacent seals. 3.37 lead: The flexible, semi-flexible, or solid/rigid conductor l

41、eading out from the microcircuit and used for electrical and mechanical connections. NOTE 1 Leads may be classified as round (pin, nail-head pin, terminal, etc.) and flat (etched or stamped planar, etc.). NOTE 2 Leads are typically surrounded by an insulator for electrical connections isolated from

42、the metal package or brazed directly to the metal package for electrical (ground) connections to the package. They are typically brazed directly to the braze pad for electrical connections to a ceramic package. NOTE 3 Leads projecting to the exterior of the package are called “outside” leads. Leads

43、projecting into this area are called “inside” leads. 3.38 lead head: On a ceramic package, the portion of the lead meant to be brazed to the braze pad. 3.39 meniscus: The area of the insulator that wicks / wets up the lead above the average low point of the seal at the lead and package (on both side

44、s of the seal) at the lead and/or package interface (Figure 3.39-1). Figure 3.39-1 Meniscus JEDEC Standard No. 9C Page 6 3 Terms and Definitions (contd) 3.40 mounting surface; seating plane: The external area of the package on which the package will mount to the end application PCB, heat sink, etc.

45、NOTE This is typically the base on the external, opposite side of the package cavity die attach or substrate attach area. 3.41 nick: A small notch, groove, chip, dent, etc. cut into or existing in a surface and typically due to mechanical damage. 3.42 package: The body of the device, case, header, h

46、ousing, etc. 3.43 package exterior: The exterior of the package that will be exposed to the usage and storage environment. 3.44 package hole: A hole in the package intended by design, typically an external mounting hole or feed-through hole filled with a glass or ceramic seal. 3.45 package interior;

47、 package cavity: The interior of the package that will become the sealed cavity containing and protecting the product circuitry connected to the leads extending to the interior of the package. 3.46 pad, braze: A metallized pad on the ceramic microcircuit package used to braze a lead for electrical a

48、nd mechanical connections. 3.47 pad, contact: A metallized pad on the outer edge of the ceramic microcircuit package used for electrical and mechanical connections, typically a castellation. 3.48 peeling: The detachment of a sheet-like layer of material from a surface. 3.49 pit: A hollow or indentat

49、ion in a surface, typically caused by a chemical attack. 3.50 plating: A thin coating of metal applied to the base metal or another plating layer by mechanical, chemical, or electrochemical means. 3.51 polymer: Any of various chemical compounds made of smaller, identical molecules (called monomers) linked together, typically used as adhesives for microelectronics assembly. 3.52 protrusion: A raised portion that protrudes or projects from a surface, typically indigenous with the surface material. 3.53 protrusion, hanging: A protrusion that can be moved with a probe but is still conne