KS C IEC 60749-31-2006 Semiconductor devices－Mechanical and climatic test methods－Part 31：Flammability of plastic-encapsulated devices(internally induced)《半导体器件 机械和气候试验方法 第31部分 塑料密.pdf

1、 KSKSKSKS SKSKSKS KSKSKS SKSKS KSKS SKS KS 2006 11 30 http:/www.kats.go.krKS C IEC 6074931 31： ( )KS C IEC 60749 31： 2006 (2011 )C IEC 60749 31： 2006 : ( ) ( ) ( ) ( ) : (http:/www.standard.go.kr) ： ： 2006 11 30 ： 2011 12 13 2011-0563 ： ： ( 02-509-7294) (http:/www.kats.go.kr). 10 5 , . ICS 31.080.01

2、 KS C IEC 31： ( ) 60749 31： 2006(2011 ) Semiconductor devices Mechanical and climatic test methods Part 31： Flammability of plastic-encapsulated devices(internally induced) 2002 1 IEC 60749 31 Semiconductor devices Mechanical and climatic test methods Part 31： Flammability of plastic-encapsulated de

3、vices(internally induced) . 1. ( ) . . 2. . 3. . , . a) 25 5 . , 1 . b) . c) . , . 31 ： ( ) 153787 1 92 3(13) (02)26240114 (02)2624 0148 9 http:/ KSKSKSSKSKS KSKS SKS KSKS SKSKS KSKSKSKorean Agency for Technology and Standards http:/www.kats.go.kr KS C IEC 60749 31： 2006 Semiconductor devicesMechanical and climatic test methodsPart 31：Fl ammability of plastic encapsulated devices(internally induced)ICS 31.080.01