KS C IEC 62326-14-2012 Printed boards－Part 14：Device embedded substrate－Terminology reliability design guide《印刷电路板 第14部分 设备嵌入式基板 术语 可靠性 设计指导》.pdf

1、 KSKSKSKSKSKSKSK KSKSKS KSKSK KSKS KSK KS KS C IEC 62326 14 14： / /KS C IEC 62326 14:2012 2012 11 19 http:/www.kats.go.krKS C IEC 62326 14:2012 : ( ) ( ) ( ) : (http:/www.standard.go.kr) ： ：2012 11 19 2012-0617 ： ： (KPCA) ( 02-509-7294) (http:/www.kats.go.kr). 10 5 , . KS C IEC 62326 14:2012 i . iv

2、v 1 1 2 2 3 .2 3.1 .2 3.2 .5 3.3 (Jisso mounting) .6 3.4 8 4 15 4.1 .15 4.2 TEG (Test Equipment Group Test vehicle) .15 4.3 15 4.4 (TEG) .18 5 .19 5.1 .19 5.2 .19 5.3 .20 5.4 .22 5.5 .22 5.6 .24 5.7 .24 5.8 .24 5.9 .25 5.10 ( , vapour phase cold heat cycle).26 5.11 ( )27 5.12 .28 5.13 .28 5.14 .29 6

3、 , , 29 7 .30 7.1 .30 7.2 .30 7.3 37 7.4 39 7.5 .41 7.6 42 A( ) .48 B( ) .49 KS C IEC 62326 14:2012 ii C( ) .50 D( ) .51 E( ) .52 53 1 .4 2 .6 3 7 4 20 5 .21 6 .22 7 .23 8 .24 9 24 10 .24 11 .25 12 .26 13 27 14 28 15 28 16 .29 17 35 18 .38 19 .39 20 .40 21 .41 22 42 23 .45 E.1 52 1 .2 2 ( ) .2 3 ( )

4、 .3 4 / ( ) 3 5 ( ).4 6 .8 7 ( ).9 8 ( ).9 9 ( )9 10 ( ) .9 11 .9 KS C IEC 62326 14:2012 iii 12 10 13 .10 14 12 15 13 16 13 17 / 14 18 14 19 2 .14 20 15 21 .16 22 , , , , 17 23 TEG 18 24 18 25 19 26 .20 27 , .21 28 .31 29 31 30 .32 31 .33 32 (I) 33 33 (II).34 34 (III)34 35 .36 36 .36 37 .36 38 37 39

5、 43 40 44 A.1 48 B.1 49 C.1 50 D.1 51 KS C IEC 62326 14:2012 iv . , , . , , . KS C IEC 62326 14:2012 v 2010 1 IEC 6232614, Printed boardsPart 14： Device embedded substrateTerminology/reliability/design guide . KS C IEC 62326 14:2012 14： / / Printed boards Part 14： Device embedded substrateTerminolog

6、y/reliability/design guide 1 , , , . SMD . . , , . , (IPD), (MEMS), , . 1 . . , . 2 , 3 . , , , . . SMD , . , / , / , . KS C IEC 62326 14:2012 2 1 2 . 3 3.1 . / , . . 4 LTCC ( . .) 5 . . . 1 . , (WLP), BGA, LGA, QFN . (IPD) . MEMS . , 1 . . (PoP) / , . 2 ( ) ( ) ( ) KS C IEC 62326 14:2012 3 3 ( ) 4

7、/ ( ) KS C IEC 62326 14:2012 4 5 ( ) 1 ( , ) ( , ) BGA, LGA, QFN BGA, LGA, QFN ( , ) ( , ) KS C IEC 62326 14:2012 5 1 ( ) ( , ) IPD IPD ( , ) ( , ) MEMS ( , ) (Sputtering) ( , ) ( , ) ( , ) ( , ) ( , ) ( , ) ( , ) (Seeding) ( , ) ( , ) 3.2 2 . . , , . 2 KS C IEC 62326 14:2012 6 . , , ( , , ) , . 2 1

8、 , 2 3 , 4 5 6 7 ( ) , 8 ( ) 3.3 (Jisso mounting) . , . KS C IEC 62326 14:2012 7 SMD . . 3 . 3 (WLP) MEMS (WLP) KS C IEC 62326 14:2012 8 3 ( ) MEMS .3.4 3.4.1 6 . JPCA-TD01-2008 , JIS C 5603 . L1, L2 L6(6 ) . . JPCA-BU01-2007 . 7 8 (空洞 ) . 9 , 10 . 11 12 . 6 KS C IEC 62326 14:2012 9 7 ( ) 8 ( ) * .

9、9 ( ) 10 ( ) 11 KS C IEC 62326 14:2012 10 12 13 19 , , 2 , , / . 3.4.2 a) b) 13 (seal) KS C IEC 62326 14:2012 11 c) d) e) f) 13 ( ) KS C IEC 62326 14:2012 12 3.4.3 a) b) c) d) 14 KS C IEC 62326 14:2012 13 3.4.4 3.4.4.1 15 3.4.4.2 16 3.4.4.3 / IPD KS C IEC 62326 14:2012 14 17 / 3.4.4.4 18 3.4.4.5 LTC

10、C ( LCTT ) 19 2 KS C IEC 62326 14:2012 15 4 4.1 (un-embedded board) . , . TEG (test element group) . TEG . . 4.2 TEG (Test Equipment Group Test vehicle) 20 TEG , , . . 20 , , , . 4.3 TEG . 21 , (Daisy chain pattern) / . 22 , , , . TEG TEG TEG KS C IEC 62326 14:2012 16 , TEG , . 21 KS C IEC 62326 14:

11、2012 17 22 , , , , / (capacitance) ( , interdigital pattern) KS C IEC 62326 14:2012 18 4.4 (TEG) 23 . , . 10 mm10 mm 0.15 mm . 120 m 316 . 90 m 90 m 110 m . . 24 . ( ) 24 . 25 . 23 TEG 24 (detection) KS C IEC 62326 14:2012 19 25 5 5.1 ( ) , . TEG TEG . . 4 . 5.2 4 . KS C IEC 62326 14:2012 20 4 (JIS C 5012) 7.11 ( ) . . 1. 2. 4 / 7.13 ( ) . ( ) . , , 26 . 1.810 6 cm . 7.12 ( ) . ( ) . TEG . 26 5.3 5 100 mm (m/10 mm)(mm) t 25( )t 100( )KS C IEC 62326 14:2012 21 5 (JIS C 5012) 7.2 ( ) . . 7.3 ( ) . . 27 . TEG . . 27 , (mm) 35 m