NAVY MIL-A-81236 (2)-1968 ADHESIVE EPOXY RESIN WITH POLYAMIDE CURING AGENT《带聚酰胺固化剂的环氧树脂粘合剂》.pdf

1、MILITARY SPECIFICATION MIL-A-81236(OS) Amendment 2 9 September 1968 Superseding Amendment 1 19 November 1966 ADHESIVE: EPOXY RESIN WITH POLYAMIDE CURING AGENT This amendment forms a part of Military Specification MIL-A-81236(OS), dated 29 March 1965, and has been approved by the Naval Ordnance Syste

2、ms Command, Depart- ment of the Navy. Page 1, paragraph 1.1, delete and substitute: “1.1 Scope - This specification covers one type of adhesive consisting of an epoxy resin and a polyamide curing agent for general use under normal circumstances. It provides for an additional type of material suitabl

3、e for use under AIR POLLUTION REGULATIONS (see 6.4) .“ Page 1, Add new paragraph: “1.2 Classification: The adhesive covered by this specification shall be of the following types as specified (see 6.2): Type I - For -general use under normal circumstances. Type II - For use where AIR POLLUTION REGULA

4、TIONS are enforced.“ Page 1, paragraph 2.1: Delete “QQ-A-362 Aluminum Alloy, Plate and Sheet, Alclad 2024“ and substitute nQQ-A-250/5 Aluminum Alloy, Alclad 2024, Plate and Sheet. Page 2, paragraph 2.2, Under publications, add: “ASTM D 2267 Aromatics and Light Naphthas, Reformates and Gasolines by G

5、as Chromatography.“ Pages 2 and 3, Section 3: Delete entire section 3 and substitute: r. THlS DOCUMENT CORTAiNS L$!-“ P b. A combinatin of aromatic compounds with eight or more carbon atoms to the molecule except ethylbenzene: 8.percent; c. A combination of ethylbenzene, ketones having branched hydr

6、ocarbon structures, trichloroethylene or toluene: 20 percent.! 3.4 Physical and chemical properties.# The physical and chemical properties shall be as specified in Table I. Page 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-A-81236(OS) Amendm

7、ent 2 Table I - Physical and Chemical Properties Property ;Epoxy Resin ! Viscosity at 25 degrees Centigrade (C), i. poises Density at 25 degrees C, ,gm/ml Epoxide equivalent, gm/eq Polyamide curing agent Viscosity at 75 degrees C, poises. Density at 25 degrees C, gm/ml Amine value T j l i 1 110 1.15

8、 187 2 0.94 350. i i 1 i I ! ! L Maximum 160 1.21 191 6 1.00 40 O 3.4.1 Adhesive properties. The adhesive, consistingof three parts by weight of epoxy resin and two parts by weight of polyamide curing agent, shall have the following properties: 3.4.1.1 Curability. When the epoxy resin and curing age

9、nt are mixed, the ljlend shall cure to a Shore trD“ hardness of 75 + 10 in not more than 16 hours at 110 + 5 degrees Fahrenheit (F). 3.4.1.2 Tensile shear strength. The cured adhesive shall have a mini- mum tensile she* strength of 1500 pounds per square inch (psi) at 75 + 6 degrees F when cured for

10、 not more than 16 hours at 110 + 5 degrees F. - - - 3.5 Workmanship. The material shall be uniform in quality and shall be free from impurities and other defects that could adversely affect its use.“ Page 4, paragraph 4.5.2: Add to end or paragraph “except that the test temperature shall be 25 degre

11、es Centigrade (C) for testing the epoxy resin base, and 75 degrees C for testing the polyamide curing agent .It Page 6, paragraph 4.5.6.2: Delete “QQ-A-362.“ and substitute Q9-0/0/5. M r- Page 3 ._ .- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-M

12、IL-A-B1236(OS) Amendment 2 Page 6, Add new paragraph: “4.5.6.3 Non-photochemically reactive solvents - The non-photochemically reactive solvent composition shall be determined using a gas chromatograph or other suitable device in accordance with Method ASTM-D-2267 (See 3,3.1).“ Page 7, paragraph 6.2

13、, add the following subparagraph: “g. Type required (See 1.2 1. Page 7, Add new paragraph: “6.4 Type II adhesive - Type II adhesive should be specified for use in areas with regulations controlling %he emission of solvents into the atmosphere. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-