NAVY MIL-C-28859 B-1990 CONNECTOR COMPONENT PARTS ELECTRICAL BACKPLANE PRINTED-WIRING GENERAL SPECIFICATION FOR《印刷电路带电的底板连接器零件总说明书》.pdf

1、MIL-C-28859B 59 W 999990b 0429979 O I-I - “ “ MIL-C-28859B 19 JANUARY 1990 SUPERSEDING 15 OCTOBER 1980 MIL-C-28859A( EC) MILITARY SPECIFICATION CONNECTOR COMPONENT PARTS, ELECTRICAL BACKPLANE, PRINTED-WIRING, GENERAL SPECIFICATION FOR This speci fication is approved for use by al 1 Departments and A

2、gencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the general requirements for printed-wiring electrical backplane connector component parts using a compl i ant feature. Beneficial comments (recommendations, additions, deletions) and -any pertinent data which may be

3、 of use in improving this document should be addressed to: Commander, Naval. Sea Systems Command, SEA-55Z3, Depart- ment of the Navy, Washington, D.C. 20362-5101 by using the self- addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by 1 et

4、ter. AMSC N/A FSC 5935 RISTRIBUTION STATEMENT A. Approved for publie release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-28859B 57 a 797770b 0429980 7 MIL-C-28859B 2. APPLICABLE DOCUMENTS 2.1 Government documents

5、 e 2.1.1 Specifications and standards. The following specifications and standards form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense index of Specifications and Stan- dards

6、(DODISS) and supplement thereto, cited in the solicitation (see 6*2). SPECIFICATIONS FEDERAL QQ-P-35 - Passivation Treatments for Corrosion-Resistant QQ-N-290 - Nickel Plating (Electrodeposited). QQ-8-750 - Bronze, Phosphor; Bar, Plate, Rod, Sheet, Strip, / Steel. F1 at Wire, and Structural and Spec

7、ial Shaped Sect ions . MILITARY MIL-P-13949 - Plastic Sheet, Laminated, Metal Clad (For Printed MIL-M-24519 - Molding Plastics, Electrical, Thermoplastic. MIL-C-28754 - Connectors, Electrical, Modul ar, and Component Wi ri ng Boards) , General Speci fi cat i on for e MIL- 1-43553 MIL-G-45204 MI L- 1

8、-46058 MIL-P-55110 MIL-C-55330 MIL-P-81728 Parts, General Speci fi cat ion For. Printed Wirjng-Compliant Pin Printed Wiring, Low Insertion Force (LIF), Compl i ant Contact MIL-C-28859/1 - Connector Component Parts, Electrical ackp MIL-C-28859/5 - Connector Component Parts, Electrical Backp - Ink, Ma

9、rking, Epoxy Base. - Gold Pl at i ng, El ectrodepos i ted. - Insu1 ating Compound, Electri-cal (For Coating - Printed Wiring Boards, General Specification for. - Connectors, Electrical and Fiber Optic, Packaging - Plating, Tin-Lead (Electrodeposited). Printed Circuit Assemblies). of I 2 1 ane, 1 ane

10、, Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-28859B STANDARDS MILITARY MIL-STD-105 - Sampling Procedures and Tables for Inspection by MIL-STD-202 - Test Methods for Electronic and Electrical MIL-STD-1285 - Marking of Electrical and Electro

11、nic Parts. MIL-STD-1344 - Test Methods for Electrical Connectors. MIL-STD-45662 - Cal i bration Systems Requirements. Attributes. Component. Parts. (Unless otherwise indicated, copies of federal and military specifica- tions and standards are avail able from the Naval Pub1 icat ions and Forms Center

12、, (ATTN: NPODS), 5801 Tabor Avenue, Philadelphia, PA 19120-5099.) 2.2 Non-Government pub1 icati ons. The fol 1 owing document (s). form a part of this document to the extent specified herein. Unless otherwise Specified, the issues of the documents which are DoD adopted are those listed in the issue

13、of the DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in the solicitation (see 6.2). AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) B 46.1 - Surface Texture (Surface Roughness, Waviness, and lay). (Ap

14、plication for copies should be addressed to the American National Standards Institute, 1430 Broadway, New York, NY 10018.) AMERICAN SOCIETY FOR TESTING MATERIALS (ASTM) A 681 - Standard Specification for Tool Steels Alloy B 122 - Standard Specification for Copper-Nickel-Tin Alloy, Copper-Nickel -Zin

15、c Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and Rol 1 ed Bar. Plate, Sheet, Strip, and Rolled Bar B 194 - Standard Specification for Copper-Beryllium Alloy 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-28859B 59 m

16、997790b 0429982 O (Application for copies should be addressed to the American Society for Testing and Materials, 1916 Race Street, Philadelphia, PA 19103,) THE INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS (W SM-840 - Qual i fication and Performance of Permanent Polymer -. Coating

17、(Solder Mask) for Printed Boards. (Application for cqpies should be addressed to the Institute for Interconnecting and Packaging Electronic Circuits, 7380 N. Lincoln Avenue, Lincolnwood, IL 60646,) (Non-Government standards and other pub1 ications are normally available from the organizations that p

18、repare or distribute the documents. These documents also may be avai 1 able in or through 1 i braries or other informational servi ces. ) r *_ 2.3 Order. of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related specification shee

19、ts), the text of this document takes precedence. Nothing in this document, however, supersedes appl icabl e 1 aws and regulations un1 ess a specific exemption has been obtained. 3 REQUIREMENTS 3.1 Specification sheets. The individual. item requirements shall be as specified herein and in accordance

20、with the applicable specification sheet. In the event of any conflict between the requirements of this specification and the specification sheet, the latter shall govern. 3.2 Qualification. Connector component parts furnished under this specification shall be products which are authorized by the qua

21、lifying activity for listing on the applicable qualified products list at the time of award of contract (see 4.5 and 6.3). 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-28857B 57 7979706 0427783 2 MIL-C-28859B 3.3 Material S. The material f

22、or each part shall be as specified herein. However, when a definite material is not specified, a material shall be used which will enable the Connector component part to conform to the performance requirements. Acceptance of approval of any constituent material shall not be construed as a guarantee

23、of the acceptance of the f urn i shed product. 3.3.1 Compliant component material, The eompl iant components shall be made from the following material : (a) Compliant contact: Beryl 1 ium copper sheet in accordance with ASTM 8194, UNS number C17200, with a minimum hardness of 50 on the Rockwell 30N

24、scale. The compliant contact shall have a minimum Knoop microhardness -of 310. (b) Feed-to and Feed-through: Either copper alloy sheet, UNS number C72500, temper H08, in accordance with ASTM 812-2, or beryl 1 ium copper in accordance with ASTM 8194, UNS number C17200, minimum Knoop hardness of 310,

25、or phosphor bronze alloy per QQ-8-750, composition A, half hard minimum. 3.3.1.1 Compliant component finish. The compliant components shall be finished with gold plate in accordance with MIL-G-45204, type II, grade C, class 1, to a thickness of 50 microinch minimum over nickel plating in accordance

26、with QQ-“290, class 1, to a thickness of 50 microinch minimum. Exposed base material is permitted in noncritical break off or plating carrier areas of the connector parts, providing al 1 performance requirements are maintained with no degradation of critical areas (see 3.1). 3.3.1.2 Localized compli

27、ant component finish. To reduce the quantity of gold required for protection, when specified (see 6.2), the compliant component shall be provided a localized finish which consists of 50 microinch minimum nickel finish per QQ-N-290, class 1, all over, 50 microinch minimum gold per MIL-G-45204, type I

28、I, grade C, class 1 on the tines contact area, and 0.0001 to 0.0003 inch tin-lead finish per MIL-P-81728, 50-95 percent tin composition on the wrappost tail. 3.3.2 Housing material, The housing material shall be polyester thermoplastic in accordance with MIL-“24519, type GPl“3OF, color black. 5 Prov

29、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-28859B 3.4 Design requirements. 3.4.1 Compl iant components. The compl i ant components shall be designed in accordance with the applicable specification sheet and other requirements herein. 3.4.1.1 C

30、ompl iant feature. The design of the compl iant feature shall be the responsibility of the individual manufacturer. No portion of the compliant feature shall protrude above the top surface of the backplane. 3.4.1.2 Removal. The compl i ant tuning fork component shall be capable of being individually

31、 removed from the backplane without removing the hous i ng . 3.4.2 Housing, The housing shall be designed in accordance with the applicable specification sheet, The- housing shall be designed to be removed and replaced without removing the compliant contact from the printed-wiring backpl ane. 3.5 Pe

32、rformance requirements. 3.5.1 Electrical requirements, 3.5.1.1 Contact resistance, When the contacts are tested as specified in 4.7.2,l and figure 1, the voltage drop shall not exceed 20 millivolts * 3.5.1.2 Contact to printed-wiring backplane resistance. When the contacts are tested as specified in

33、 4.7.2.2 and the applicable figure, the voltage drop shall not exceed 6 mV for double sided boards (see figure 2), and 20 mV for mu1 ti 1 ayer boards (see figure 3). 3.5.1.3 Insulation resistance. When connectors are tested as specified in 4.7.2.3, the insulation resistance shall be as specified in

34、table I, 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-28859B CONNECTOR ASSY MIL-C-28754/8 7 .o20 LO ounces (0.56 newtons) minimum. 3.5.2.2 Low insertion force (LIF) engaging and separating force. When tested as specified in 4.73.1, the ave

35、rage force to engage shall be 2.25 ounces (O. 63 newton) maximum with random readings at 4 ,O0 ounces (1.12 newtons) maximum. Separation force shall be 4 .O ounces (1.11 newtons) maximum. 3.5.2.3 LIF normal force. When tested as specified in 4.7.3.2, the average normal force on each ti ne shall be g

36、reater than 3.53 ounces (O. 98 newtons) with random readings of not less than 3 00 ounces (0.84 newtons) al 1 owed. TABLE I. Insulation resistance (megohms). Before Measured within After 2 hours humidity 1 hour after removal drying from chamber 10 I 500 10 Provided by IHSNot for ResaleNo reproductio

37、n or networking permitted without license from IHS-,-,-MIL-C-28857B 57 = 777770b 0427789 3 W MIL-C-28859B 3 + 5.2.4 CQmplianteomponent retenti on 3.5.2.4.1 Initlal lnstallatlsn. After lnltial installation of the conpl iant component into the printed-wiring backplane, the maximum pushout force al low

38、ed shall be 45 pounds (208 newtons), when tested In accordance with 4.7.3.3. Upon insertion or extractlsn from the backplane, the cornpllant component shall not displace conductive debris outside the plated through hol e. 3.5.2.4.2 Conditioning. After condltionlng in accordance with 4.7.3.3.1, the p

39、ushout force shall be a minimum of 7.5 pounds (33.4 newtons). 3.5.2.5 Compliant component torque. When tested as specified in 4.7.3.4, the component shall withstand a mjnimum torque of 3 ounce-inches (0.021 newton-meter) . Fol 1 owing removal of the app.l led torque, no displacement or deformation o

40、f the conpllant.csntponent shall be visible. 3.5.2.6 Housing retention. The housing retention force shall be as specified when tested in accordance with 4.7.3.5 (see 3.1). 3.5.2.7 Plated-throuqh hole integrity. When microsectioned in accordance with 4.7.3.7, plated-through holes containing compliant

41、 components shall conform tg the requirements specified in 3.5.2.7.1 through 3.5.2.7.3. 3.5.2.7.1 Hole deformation. The average plated-thro.ugh hole deformation shall be no greater than 0.0015 inches (0.0038 centimeters (cm), when measured from the dril led hole, based on a 10-hole microsection samp

42、le. The absolute maximum deformation shall be 0.002 inches (0.005 cm) (see figure 4). 3.5.2.7.2 Hole wall damage. The minimum copper thickness remainlng between the compliant component and the printed-wiring laminate, averaged over a 10-hale microsection sample, shall not be les.s than 0.0003 inch (

43、0.0008 em) (see 4.7.3.7). In addition, there shall be no copper cracks or other Interplane separations Prom the hole wall barrel or separations between the printed-w.i ring board 1 aminate and the plated copper barrel . Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

44、ense from IHS-,-,-MIL-C-28857B 57 7797706 0427770 T M MIL-C-288598 Ir DEFORMATION I FINISHED I I -1 HOL HOL E E .0453f.0010 DRILLED HOLE .040f.003 FINISHED HOLE (.O01 MIN COPPER AND ,0003 MIN TIN-LEAD ON HOLE WALL) T. I NOTE : 1. Dimensions are in inches. Metric equivalents are given for information

45、 only. FIGURE 4. Plated-through hole deformation. 12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-28859B 57 797790b 0427993 L MIL-C-28859B 3.5.2.7.3 Vertical plane. The sample shqll be viewed to ensure that no copper cracks, separations betw

46、een conductor Interfaces, or 1 aminate-to-copper separations have occurred. 3.5.2.8 Durabi 1 i ty. When connector component parts adsembl ed onto the qual if ication test sample (see figure 5) and mated with connector assembl ies qual if led to MIL-C-28754 and wl th an appropriate supporting structu

47、re, are tested as speclfied In 4.7.3.6, there shall be no evidence of mechanical degradation that would advemely affect the contacts ability to functlon, In addition, after the test, the connector assembly shall conform to the requirements of 3.5.1.1 and 3.5.2.1 or 3.5.2.2. 3.5.3 Env_iro_nmental. 3.

48、5.3.1 Temperature eye1 lnq. lJhen the connector assembly is tested as speclfied in 4.7.4.1, the connector assembly shall show no evidence of cracking, fracturing, or other damage detrimental to the operation sf the connector assembly. 3.5.3.2 Humidity. When tested as specified in 4.7.4.2, the connec

49、tor assembly shall conform to the requirements of 3.5.1.5, 3.5.2.4.1, 3.5.1.2, 3.5.1.3, and 3.5.1.4. 3.5.3.3 Temperature-altitude. When tested as specified in 4.7.4.3, there shall be no evidence sf cracks, burns, OP other vtsible or dimensional damage which could cause electrical or mechanlcal breakdown sf the connector- assembly. In addition, at the completion of the temperature-altitude test,