NAVY MIL-I-22352 D-1984 INTERCOMMUNICATION SETS AN AIC-14A& AN AIC-14 GENERAL SPECIFICATION FOR《AN AIC-14A及 AN AIC-14型内部通信设备一般规定》.pdf

1、O MIL-I-22352D 5B 7799706 0350776 L = 10 August 1984 . SUPERSEDING MIL-I-22352C (AS) 26 May 1978 MILITARY SPECIFICATION INTERCOMMUNICATION SETS AN/AIC-l4A AND AN/AIC-14, I 1. SCOPE GENERAL SPECIFICATION FOR This specification is approved for use by the Naval Air Systems Command, Department of the Na

2、vy and is available for use by all departments and agencies of the Department of Defense. 1.1 Scope. This specification sets forth the required characteristics for Inter- communication Sets AN/AIC-l4A and AN/AIC-14, hereinafter referred to as the “ICS“ or “IC system“. This specification also establi

3、shes performance, design, manufacture, reliability test, and acceptance test requirements for these IC systems. addresses the AN/AIC-l4A system, while Appendix A addresses the AN/AIC-14 which is inactive for new design. The main body of this specification The equipment covered by this specification

4、shall provide an intra- aircraft communications facility which shall integrate operator voice intercommunication signals with other audio signals derived from or delivered to associated electronic equipment (i.e., transmitters and receivers). The system shall provide control, selection, isolation, a

5、nd amplification of such signals. e I 1 Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: (Code 93), Naval Air Engineering Center, Lakehurst, New Jersey 08733, by using the self-addressed Standard

6、ization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. Engineering Specifications and Standards Department I I FSC 5831 THIS DOCUMENT CONTAINS -ss- PAGES - , .-_- - - _- - - - Provided by IHSNot for ResaleNo reproduction or networking permitted witho

7、ut license from IHS-,-,-i - _ - MIL-I-22352D 58 MIL-I- 223 52D (AS) 1.2 Classification. Intercommunication Set AN/AIC-l4A shall consist of combinations of the components listed in TABLE I. 2. APPLICABLE DOCUMENTS 2.2 Government documents. 2.1.1 Specifications, standards and handbooks. Unless otherwi

8、se specified, the following specifications, standards, and handbooks of the issue listed in that issue of the Department of Defence Index of Specifications and Standards (DoDISC) specified in the solicitation form a part of this specification to the extent specified herein. 2.2 List of Documents. SP

9、ECIFICATIONS Military MIL-B-5087 MIL-W-5088 MIL-E-5400 MIL-T-5422 MIL-E-6051 MIL-(2-6781 MIL-S-7742 MIL-P-7788 MIL-A-8625 MIL-Q-9858 MIL-E-17555 MIL-M-18012 MIL-“-18303 Bonding, Electrical, and Lightning Protection, for Aerospace Systems Wiring, Aerospace Vehicle Electronic Equipment, Aircraft, Gene

10、ral Specification for Testing, Environmental, Aircraft Electronic Equipment Electfamagnetic Compatibility Requirements, Systems Control Panel; Aircraft Equipment, Rack, or Console mounted Screw Threads, Standard, Optimum Selected Series, General Specification for Panel, Information, Integrally Illum

11、inated Anodic Coatings for Aluminum Packaging and Packing of Marking for Aircrew Station Displays, Design, and Configuration of Test Procedures, Preproduction, Acceptance, and Life for Aircraft Electronic Equipment, Format for 2 b. I Provided by IHSNot for ResaleNo reproduction or networking permitt

12、ed without license from IHS-,-,-MIL-T- 18307 MIL-P-19834 MIL-C-25050 MIL-L-25467 MIL-L-27160 MIL-1-45208 MIL-C-45662 MIL-1-46058 MIL-H-46855 MIL-P-55110 Federal O QQ-P- 4 16 MIL-I-22352D (AS) Nomenclature and Identification for Electronic, Aero- nautical, and Aeronautical Support Equipment including

13、 Ground Support Equipment Plate, Identification, Metal Foil, Adhesive Backed Color, Aeronautical Lights and Lighting Equipment, General Requirements for Lighting, Integral, Red, Aircraft Instrument, General Specification for Lighting, Instrument, Integral, White, General Specification for Inspection

14、 System Requirements Calibration System Requirements Insulating Compound, Electrical (for Coating, Printed Circuit Board Assemblies) Human Engineering Requirements for Military Systems, Equipment, and Facilities Printed Wiring Boards Plating , Cadmium (Electrodeposited 1 (See Supplement 1 for list o

15、f associated specifications) STANDARDS Federal DOD-STD-100 DOD-D-1000 Military MIL-STD-130 MIL-STD-275 MIL-STD-280 /=- Engineering Drawing Practices Drawings, Engineering, and Associated Lists Identification Marking of U.S. Military Property Printed Wiring for Electronic Equipment Definitions of Ite

16、m Levels, Item Exchangeability, Models, and Related Terms 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-411 MIL-STD-415 MIL-STD-454 MIL-STD-461 MIL-STD-462 MIL-STD-470 MIL-STD-471 MIL-STD-704 MIL-STD-781 MIL-STD-783 MIL-STD-785 MIL-STD-79

17、4 MIL-STD-810 MIL-STD-826 MIL-STD-882 MIL-STD-889 MIL-STD-1472 MIL-STD-1569 MIL-I-22352D (AS) Military Standard Aircrew Station Signals Test Provisions or Electronic Systems and Associated Equipment, Design Criteria for Standard General Requirements for Electronic Equipment Electromagnetic for the C

18、ontrol Electromagnetic of Maintainability Equipments) Maintainability Emission and Susceptibility Requirements of Electromagnetic Interference Interference Characteristics, Measurement Program Requirements (for Systems and Verification/Demonstration/Evaluation Aircraft Electric Power Characteristics

19、 Reliability Design Qualification and Production Acceptance Tests: Exponential Distribution Legends for Use in Aircrew Stations and on Airborne Equipment Reliability Program or Systems and Equipment Development and Production Parts and Equipment, Procedures for Packaging and Packing of Environmental

20、 Test Methods Electromagnetic Interference Test Requirements and Test Methods System Safety Program Requirements Dissimilar Metals Human Engineering Design Criteria for Military Systems Requirements for Repair and Modification of Printed-Wiring Assemblies (See Supplement 1 for list of MS sheet form

21、standards) E 4 . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-1-2 2352D (AS) HANDBOOKS * Military e MIL-HDBK-217 Reliability Prediction Of Electronic Equipment MIL-HDBK-237 Electromagnetic Compatibility Management Guide for Platforms, Systems,

22、 and Equipment (Copies of specifications, standards, handbooks, drawings, and publications required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting officer.) 5 Provided by IHSNot for ResaleNo reprod

23、uction or networking permitted without license from IHS-,-,-MIL-I- 2235 2D (AS) nnnh- n 2 W s VI m FI cv n 2 2 W b In FI FI m n W 2 N In m cv cv n 2 h W 03 VI m cv Cu n 2 W N In m CJ FI n 2 ;U W O rl in CJ m I 4 I x H I rl I $ I rl I H c I rl I c H I rl I n cv 1 rl I n n m n .t n 4 m m ce O1 .rl u c

24、i Wl 2 .a s a al W n 4 m Q ce 01 *rl U ci Wl 2 .a g a al W al ri 3 5 O c X O 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-I-22352D 58 W 797770b 0350782 7 MIL-I-22352D (AS) 2.3 Order of precedence. In the event of a conflict betwe- the text o

25、f this specification and the references cited herein, the text of this specification shall take precedence. 3. REQUIREMENTS 3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the detail specification sheet. In the event of any conflict betw

26、een the system requirements of this specification and any detail specification sheet, the latter shall govern. 3.2 First article. When specified, a sample shall be subjected to first article inspection (see 4.2.1) 3.3 Materials. .- 3.3.1 Selection of Printed wiring boards. Parts and materials shall

27、be selected in accordance with MIL-E-5400. materials shall be in conformance with MIL-STD-454 or with the approval of the acquiring agency. Microelectronic technology shall be utilized to the fullest extent possible. Microelectronic components shall be rated so that when the set is operated with any

28、 and all combinations of the environments specified herein, its performance shall remain within the limits of this specification. Components shall also be rated so that the set shall function within the limits of this specification after extended inoperative periods while carried or installed in mil

29、itary aircraft and subjected to the varied range of environmental conditions defined herein. The selection of parts and Nonrepairable subassemblies, as outlined in MIL-E-5400, shall be used when practicable. The general size of the subassembly, and the amlunt of circuitry to be included therein shal

30、l be approved by the acquiring activity. When previously produced models of this equipment did not use nonrepairable subassemblies, the design shall not be changed to employ nonrepairable assemblies without the approval of the acquiring activity. Approval for the use of nonstandard parts and materia

31、ls shall be as specified in MIL-E-5400. 3.3.2 Standard parts. Military standard parts shall be used whenever they are suitable for the purpose, and shall be identified on the drawing by their appropriate military part number. number shall be interchangeable as applied within the system. Standard par

32、ts shall be in accordance with MIL-E-5400. Any part of the same part 3.3.2.1 Approval of non standard parts. Request for approval for the use of non-standard parts shall be in accordance with MIL-E-5400. 3.3.3 Printed wiring boards. Printed wiring boards shall be designed conformance with MIL-P-5511

33、0. 3.3.3.1 Printed wiring modifications. Printed wiring board modificat shall be performed in accordance with MIL-STD-1569. 7 in ons Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-I-22352D (AS) 3.3.4 Dissimilar metals. The use of dissimilar meta

34、ls in contact with each other (particularly brass, copper, or steel in contact with aluminum or other alloys) shall be avoided. Where contact between dissimilar metals is unavoidable, they shall be suitably protected against electrolytic corrosion. When protection is used, it shall be a type that of

35、fers a low impedance path to radio frequency current. shall be as defined in MIL-STD-889. Dissimilar metals 3.3.5 Threaded parts. All threads shall conform to MIL-S-7742. All internal or external parts which are threaded shall be positively locked. Accidental loosening of threaded elements shall be

36、prevented by self-locking nuts, safety wiring, or other approved methods. 3.3.6 Commercial parts (hardware), Commercial utility hardware items may be used i they possess suitable properties. 3.3.7 Toxic. Materials which produce harmful toxic effects under any conditions, including fire, shall not be

37、 incorporated in the design. - 3.3.8 Flammable. Materials which will support combustion shall not be used. Definitions and restrictions on the use of flammable materials shall be in accordance with MIL-STD-454, Requirement 3. 3.3.9 Metals. Metals shall be of a corrosion resisting type or suitably pr

38、ocessed to resist corrosion. 3.3.9.1 Aluminum alloy parts. Aluminum alloy parts shall be anodically treated in accordance with MIL-A-8625. To provide adequate bonding, the aluminum oxide film formed by this treatment shall be removed from the actual contact area of all surfaces that act as a path fo

39、r electrical current and from the areas under screws, nuts, etc., used for assembly or mounting purposes. 3.3.9.2 Steel parts. Steel parts shall be cadmium plated in accordance with QQ-P-416 Type II or III. 3.3.10 Insulating materials. Electrical insulating materials shall be in accordance with MIL-

40、STD-454, Requirement 11. Insulation for power circuits shall be arc-resistant in accordance with MIL-STD-454, Requirement 26. 3.3.11 Encapsulation and embedment (potting). Materials for encapsulation and embedment shall be in accordance with MIL-STD-454, Requirement 47. 3.3.12 Semiconductor devices.

41、 Semiconductor devices shall be selected and applied in accordance with MIL-STD-454, Requirement 30. Microelectronic devices shall be selected and applied in accordance with MIL-STD-454, Requirement 64. Use of non-standard parts shall be substantiated by reliability data or testing to assure adequat

42、e device reliability for the application. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-I-22352D 5 9999906 OL5098Y O M MIL-I-22352D (AS) 3.3.13 Capacitors. Capacitors shall be chosen and applied in accordance with Requirement 2 of MIL-STD-454.

43、3.3.14 Soldering. Soldering shall be in accordance with MIL-STD-454, Requirement 5. 3.3.15 Relays. Relays shall be chosen and applied in accordance with Requirement 57 of MIL-STD-454. 3.4 Design. Intercommunication Set AN/AIC-l4A shall provide two-way voice communication between aircraft crew statio

44、ns and shall integrate operator voice signals with other audio signals derived from or delivered to on-board communication sets (i.e., transmitters and receivers). The system shall provide signal selection, signal isolation, signal amplification, and audio output voluie control as described herein.

45、The modular design of the AN/AIC-l4A provides a high degree of versatility, adapting to numerous aircraft installations. Specific configuration is dependent upon the aircraft type and the applicable operational doctrine for the aircraft mission. The block diagrams of Figures 1 and 2 illustrate typic

46、al station and system configurations. Typical installations include peripheral. equipment not contained within the ICs which have a direct influence on ICs operation. A typical configuration showing headset and interconnecting cabling is shown in Figure 3. The organization of this specification plac

47、es WRA and SRA detailed performance requirements under separate detail specification (slash) sheets. Refer to these individual detail specification sheets for interface discussions and data. The detail specification sheet references are shown in Table I. 3.4.1 Modular design. This specification has

48、been developed for use in procurement of entire IC systems, individual WRAs and individual SRAs. The descriptions of performance and physical characteristics for WRAs and SRAS are contained in separate detail specifications as listed in Table I. Refer to these individual detail specifications for di

49、scussions and data concerning internal interface and WRA/SRA performance requirements. The system requirements are specified herein. In the event of any conflict between the system requirements of this specification and the particulars contained within the detail specifications, the latter shall govern. The circuitry of the respective WRAs shall be partitioned into SRAS to the maximum extent possible; chassi