NAVY MIL-P-85576 B-1987 POWER SUPPLY PP-2581C A《PP-2581C A型电源》.pdf

1、- MIL-P-85576B 14 W 779770b 0365231 7 W 0- I543 MIGP-85576B AS) SUPERSEDING MIL-P-85576A(AS) 6 April 1984 with -1 29 March 1985 4 AUGUST 198 4 MILITARY SPECIFICATIof? POWER SPPLY PP-2581C/A This specification is approved for use within the Naval Air Systems oxmiand, Department of the Navy, and is av

2、ailable for use by all Departments and Agencies of the Department of Defense. 1.1 Scope. This specification establishes the perfomce, design, mufacture and acceptance requirements for the Eber Supply, PP-2581C/A, for use in the Guided Missile Launcher LAU-7 Series (MIGL-22620) to provide direct curr

3、ent (E) Wr, firing circuit power, audio amplification, feedthrough wiring and passage of high pressure gas. 2. APPLICABLE lxnwwrs 2.1 Government documents. 2.1.1 spec ifications, standards, and hanbooks. Unless otherwise specified, the follhng specifications, standards, an handbooks of the issue lis

4、ted in that issue of the Department of Defense Index of Specifications and Standkrds (DoDISS) specified in the solicitation, form a part of this specification to the extent specified herein. CPECIFICATIONS MILITAKY MILd-27 MIL-P-116 Preservation, Methocis of Transformers and Inductor (Audio, Wer, an

5、d High power Pulse), General Specifications for . Measurmt of Configuration Control Engineering changes, Deviations, and Waivers EquiFpTient 3 2 Licensed by Information Handling ServicesMIL-P-557bB 14 a 7779906 O365233 O . MIGP-85576B( AS) MIII-701 MIGrn704 MIGSTD-726 E.IIGsTD-750 MIG-781 MIGSTD-785

6、 MIGS1?-81 EIIGSTD-883 MIG-965 MfGSTD-1346 EOD-STD-1399/300 l-lIGSID-1562 MIGSTb1568 MIG-1629 MIG!TKh2068 MIG-2074 MILITARY MIGHDBK-241 MIGHDBK-2 17 List of Standard Semiconductor Devices Aircraft Electric Power Characteristics Packing Requirements Code Test Methods for Semiconductor Devices Reliabi

7、lity Design Qualification an Production Ac- ceptance Tests: Exponential Distribution Reliability Program for Systems and Equipnent Developnent and Prduction Enviramental Test Methods Test Methods and Procedures for Microelectronics Parts Chntrol Program Interface Standard for chipboard Systems, Sect

8、ion 3m Electric Wer, Alternating Current (Metric) Lists of Standard Microcircuits Materials and Processes for Corrosion Prevention and control in Aerospace Weapons Syst- Procedures for Performing a Failure We, Effects, and Criticality Analysis Reliability Developnent Tests Failure Classification for

9、 Reliability Testing / Relay, Selection, and Application / Design Guide for Electromagnetic Interference (Em) Reduction in Pcrwer Supplies Reliability Prediction of Eltxtronic Equipnent 2.1.2 Other Goverment docurcients, drawings, and pciblications. The following other Government documents, drawings

10、, an publications form a part of this specification to the extent specified herein. AS4613 NAVAIR 11-75A-54 Technical Manual for LAU-7 Guided Missile Launcher WS-6536 Pgplication and Derating Requirements for Electronic CCmponents, General Specifications for procedures and requirements for preparati

11、on an soldering of electrical connections E-78-1 Storage Reliability of Missile Material Program, fissile Material Reliability Prediction Handbook, Parts munt Prediction DRAWINGS 3 Licensed by Information Handling ServicesMIL-P-85576B 14 9777906 0365239 2 W 30003-6cIA89C350 Cover, Protective 30083-6

12、0A9D700 Power Supply PP.2581 C/A 30003-58Al64H598 Housing Launcher Assdly 10001-1517259 Connector, Plug 1waoI1-1517260 Connector, Receptacle 10001-1517261 Connector, Receptacle 10001-59A44B303 Valve, Relief (Copies of specifications, standards, handbooks, drawings, publications, an other Government

13、documents required by contractors in connection with specific acquisition functions should be obtained fran the contracting activity or as directed by the contracting activity.) 2.1.3 Order of precedence. In the event of a conflict between the text of this specifications and the references cited her

14、ein, the text of this specification shall take precedence. Nothing in this specification, hmever, shall supersede applicable laws and regulations unless a specific exaption has been obtained. 3.1 Qualification. Wer supplies furnished under this Specification sM1 be products which are qualified for l

15、isting in the applicable Qualified Products List (QPL) at the th set for opening of bids (see 4.4 and 6.3). 3.2 Selection and quality verification of parts, materials and processes. fabricatim of the per supply. Parts and materials shall be procured fran QPL sources. The contractor shall prepare tes

16、t reports to conform to applica- ble requirements. Derating of canponents in accordance with the guidelines in AS46138 Class A, shall be made to ensure reliable operation under environmental conditions. Ail. nonampliance with derating criteria shall require written approval by the procuring activity

17、 prior to acceptance. The derating shall be such that the maxh junction temperature of semiconductor devices shall not exceed 1lW Centigrade (C). Quality verified parts and materials shall be used in the . 3.2.1 Stress analysis. ?he contractor shall determine the stress applied to each part to verif

18、y that all derating requirements are met under worst case environments, wrst case continuously applied paver (external to the power supply) and nani.mil part and circuit parameters (see 6.2.2) . plastic dielectric capacitors in mldd cases, plastic or epoxy, or other encapsulated semiconductors, and

19、microelectronic devices, germdm semiconductors and photo couplers (photo transistors) shall be prdiibited. 3.2.2 Prohibited application. lhe use of electron tubes, fixed paper and 4 Licensed by Information Handling Services3.2.3 Restricted application. The use of noncolid sintered-slug tantalum capa

20、citors shall be restricted to MIM-39006, CLR 79 and CLR 80 qualified devices. Aiuminum electrolytic capacitors shall require approval of the requiring activitiy. 3.2.4 Nonstandard part s and niaterial approval. Approval for the use of nonstandard parts and materials, including transistors and diodes

21、, other than microelectronic devices, shall be obtained as specified in MILE-5400 and MG -965. The contractor shall prepare requests for approval of nonstandard parts and propsed addition to an approved Program Parts Selection List (PPSL) (see 6.2.2). 3.2.5 Parts. Each electrical canponent part shal

22、l be tested as specified in 4.5.2 for conformance to its requirements. i/I-pecification conformance tests Temperaturealtitude dinations Hddity Vibratiar Service shock salt-fog Electranagnetic interference Acceleratia elibility qualification Requirement Para 3 .4 - 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3

23、05.6 3.5.7 3.6 3.5.8 3.8 Test Para . 4.4.2 4.4.3 4.4.3.1 4.4.3.2 4.4.3.3 4.4.3.4 4.4.3.5 4.4.3.6 4.4.3.7 4.4.5 4.4.2 Individual equipoent tests. Each power supply shall be subjected to the individual equipnt tests. These tests shall be adequate to determine cmpliance with the requirements of niateri

24、ai, mrkmanship, aperational 8 each power swly shall pass the adequacy, and reliability. As a muiimun foiiowing tests : a. Examination of product b. Insulation resistance test c. Gas pressure system test d. Operation test e. Relay operation test f. Feedthrough wiring test g. Surge test h. Audio ampli

25、fier test i. Meter inSpeCtim j. Fit test para. - 3.14 3.4.1 3.4.2 3.4.3, 3.4.4 3.4.5 304.6 3.4.7 3.4.8 3.4.9 3.4.10 Test para 4.4.2-1 4.4.2.2 4.4.2.3 4.4.2.4 4.4.2.5 4.4.2.6 4.4.2.7 4.4.2.8 4.4.2.9 4.4.2 10 22 Licensed by Information Handling Services4.4.2.1 Examination of product. Fach equiprent sh

26、all be examined carefully to determine that the material and mrkmanship requirements have been met. O 4.4.2.2 Insulation resistance test. An insulation resistance test shall be performed in accordance with MIGSTD-202, Method 302. Ahigh potential is applied between each isolated circuit and ail other

27、 isolated circuits, including graund. Insulation resistance shall be not less than 100 megoims at 500 (plus 50 or minus 20) VDC. Circuits which will be damge by this test shall not be subjected to this test. 4.4.2.3 Gas system test. The gas system shall be tested With dry air or nitrogen at a pressu

28、re of 3800 (2 5cI) pig and 2200 (2 50) pig at 77 (+ 1010 fahreriheit for leakage and at a pressure of 3000 (+ 10L3) pounds for flow. a. With a suitable pressure system at a pressure of 300 (+ 50) psig and 2200 (+ 50) psig, a leakage test shall be perfonned and the maxinunn leakage rate SIEU be not g

29、reater than i cubic centimeter per minute at each pressure. b. A pressure drop shall be performe with a suitable rotaneter and pressure mnitoring systan. With the inlet of J1 maintained at a pressure of 3000 (+ lm) psig at a flm rate of 28.3 standard liters per minute, the to hcweverr the MlBF shall

30、 be mnitored using the grm niode1 Outlined in MIL-STD-2068. At the anpletion of m, the contractor shall prepare an R report which includes ali failure analyses and corrective actions taken (see 6.2.2). Perform the tests as specified in 4.4.2.5b every 10 minutes during per-on periods. The vibration s

31、pectrum of FI- 3 shall conform to the functional test of 4.4.3.3a. nly pcikuer suppiy “per on“ time shall be counted tomrd the 10,000 hours. The M0 Hz input shall vary between 98, 115 and 124 V AC with each input maintained for one-third the operating the. Every tenth cycle the maxh temperature shall be +850 C. Licensed by Information Handling Services