NAVY MIL-S-24561-1977 SENSING AND SIGNALING DEVICE CURRENT-TIME (CTS) (NAVAL SHIPBOARD USE)《目前(华视)传感与信号装置(海军舰载使用)》.pdf

1、MILITARY SPECIFICATION SENSING AND SIGNALING DEVICE, CURRENT-TIME (CTS) (NAVAL SHIPBOARD USE) This specification is approved for use by the Naval Sea Systems Command and is available for use by all Departments and Agencies of the Depart- ment of Defense. 1. SCOPE 1.1 Scope. This specification covers

2、 a current-time sensing and signaling device (CTS) and a test set for such device for use on Naval ships. 2. APPLICABLE DOCUMENTS and Systems, Requirements for. Use). MIL-E-917 - Electric Power Equipment, Basic Requirements For (Naval Shipboard MIL-E-2036 - Enclosures For Electric and Electronic Equ

3、ipment, Naval Shipboarc MIL-P-15024 - Plates, Tags and Bands for Identification of Equipment. MIL-P-15024/5 - Plates, IdentiEication. MIL-C-17361 - Circuit Breakers, Air Electric, Insulated Enclosure (Shipboard MIL-1-17384 - Insulating Compound, Electrical, Quick-Drying. MIL-E-17555 - Electronic and

4、 Electrical Equipment, Accessories, and Repair Use). I Parts: Packaging aqd Packing of. MIL-STD-130 - Identification Marking of U.S. Military Property. MIL-CTD-167-1 - Mechanical Vibrations of Shipboard Equipment (Type I - MIL-STD-471 - Maintainability Demonstration. MIL-STD-721 - Definitions of Eff

5、ectiveness Terms For Reliability, Maintain- MIL-STD-882 - System Safety Program For Systems and Associated Subsystems MIL-STD-965 - Parts Control Program. MIL-STD-1399 - Interface Standard for Shipboard Systems. MIL-STD-139gr Section 103 - Interface Standard for Shipboard System, MS90363 - BOX, Fibe

6、rboard, With Cushioning Insert, Limited Re-Use (For Items MS90407 - Box, Fiberboard, With Cushioning Insert, Limited Re-Use (For Items Environmentai and Type II - Internally Excited). ability, Human Factors, and Safety. and Equipment: Requirements For. Electric Power, Alternating Current. 10 Pounds

7、or Less). Over 10 Pounds to 100 Pounds Inclusive). Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Naval Ship Engineering Center, SEC 6124, Department of the Navy, Washington, DC 2036

8、2 by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. I Y Licensed by Information Handling ServicesMIL-S-24561 (SHI in connection with specific procurement functions should be obtained from the procuring activit

9、y or as directed by the contracting officer.) (Copies of specifications, standards, drawings, and publications required by contractors 3, REQUIREMENTS 3.1 General re uirements, The CTC device and test set shall be in accordance with the requirements o-exoept for the following: (a) Radio interference

10、. (b) Noise reduction I (c) Piping systems. (d) (e) Equipment cooled by forced air. Equipment cooled by water fuses. In the event a requirement of MIL-E-917 and a requirement of this specification oonflict, the requirement o this speciication shall govern. 3.1.1 Materials. Reclaimed materials shall

11、be used to the maximum extent possible. 3.2 Sample for first article ins ection, Prior to beginning production a sample shall be examined and tested as specified-e 6.4) . 3.3 Cafet criteria. The equipment design and operational procedures shall comply with Wie ollowI+ (a) (b) Control and minimize ha

12、zards to personnel, equipment, and material which (cl Isolate hazardous substances, parts, and operations from other activities, (d) Xncorporate “fail-safe“ principles where failures would cause a casualty (e) Locate equipment parts so that access to them by personnel during operation, Avoid or elim

13、inate identified hazards by design selection or material selection, cannot: be avoided or eliminated. areas, personnel, and incompatible materials. through injury to personnel or damage to equipment. maintenance, repair, or adjustment shall not require exposure to hazards such as chemical burns, ele

14、ctrical shock, cutting edges, sharp points, or toxic atmospheres. a (1 Provide warning and caution notes in operations, assembly, maintenance, and repair instructions; and distinctive warnings of hazards on the equipment. 3.3.1 S stem hazard analysis. The contractor shall conduct a system hazard ana

15、lysis in aocordanck the requzrements of MIL-STD-882. 3.3.2 3.3.3 Data E. O sra$ devices shall withstand type I vibration tests specified in MIL-CTD-167-1 without mechanical damage or maloperation. the opceified limits. typo C 11 ohock tests specifled in MIL-S-901 on the light-weight shock machine wi

16、thout mchenieal damage or maloperation. Device shall be tested at full operating load during test. 3.6.33 Dielectric strength. CTS devices shall withstand for a period of 1 minute an alternating 6Q 12 voltage of 2200 volts rms between each electrically isolated circuit and u11 otliar eircuitsl conne

17、cted together and to ground. in accardace with wherever feasible, the gate signal shall be maintained over the full conducting interval. (d) The maximum value of total load current for the paralleled combination shall not exceed the amount derived from the following equation: total = (0.6n + 0.4) ce

18、ll where: *total = Total average forward current rating of the paralleled group of devices in the intended application. operating alone - applies to cell under the applicable environment and service conditions and provide the degree of reliability and design margin appropriate for the appli- cation.

19、 = Composite derating factor which for the particular device n = The number of devices connected in parallel. cell = The specified average forward current rating of the device operating singly. NOTE: Any rerating factory which is applicable to average forward current of the device because of the man

20、ner in which it is used (mode, duty, waveform, frequency, etc.) or for any other cause, shall also be included in the composite derating factor. (e) Parallel connection of devices shall be accomplished with connections and leads of the same size and length arranged to provide balanced impedances bet

21、ween or among, the paralleled devices. 3.7.7.2 $urge voltage suppression. Circuits containing devices which do not have inherent capability to withstanding voltage surges of the level specified in 3.7.6 without exceeding allowable stresses shall be protected by incorporating adequate surge voltage s

22、uppression within the circuit. The internal generation of voltage surges shall be minimized with respect to both frequency of occurrence and amplitude. the circuit for suppressing any remaining voltage surges generated within the circuit that would otherwise be excessive. MIL-E-917. MeansSchall be p

23、rovided within Surge voltage suppressors shall be in accordance with 3.7.8 Heat dissipators. Heat dissipators for semiconductor devices shall be constructed of metallic material which is either corrosion-resistant, or which is treated or coated to resist corrosion under shipboard environmental condi

24、tions. Surfaces which contact the semiconductor device, and surfaces to which electrical contacts are made shall not be painted or anodized, but shall be plated or otherwise coated to form surfaces to which the connections or junctions are made and which will retain their mechanical, thermal and ele

25、ctrical 9 Licensed by Information Handling ServicesMIL-S-Z4CbL b3 W 999990b 0089737 O m e MIL-S-24561 (CH) effectiveness for the life of the equipment. of the connections and joints shall be as specified on the applicable heat dissipator drawing. Heat dissipators shall be sized to dissipate the heat

26、 generated by the semiconductor device of highest losses that may be expected to conform to the applicable semiconductor device specification, and to do so under the highest ambient temperature conditions without exceeding the limiting temperatures specified in table I. Maximum power dissipation may

27、 be estimated from calculations taking into account the mode of operation of the device in the circuit, the worst stress levels applied, and the limiting device characteristics as covered by the device specification, Maximum power dissipation may also be estimated by using published data for a parti

28、cular brand of device, and scaling up the losses using a factor calculated from para- meter limits applicable to the particular brand of device and specification limits, taking into account the influence of the parameters considered on the losses under the mode of operation in the circuit and allowi

29、ng for any difference in form factor involved in the way the values are given. Where maximum power dissipation at rated conditions is specified and controlled by the device specification, this value corrected for the stress levels of the application, shall be used in the design. A11 solid state type

30、 components and associated wiring shall be sprayed or dipped ind drying clear varnish in accordance with MIL-1-17384 to prevent corrosion or oxidakion. Contact surfaces of electrical terminals and connectors and of grounding rurfaces shall be free of such coating. 3.8 and Wei ht. The sizes of the cu

31、rrent transformers shall not exceed 4.25 inch by 2.25 inch byTO all times without danger to personnel. installed on both the control module current transformers. Identification plates shall be 3.10.1 Markings fox small components. Markings for small components shall be of a legibla size and type. 3.

32、10.2 Identification plate marking. The data marked on identification plates shall include the following: (a) ManuEacturer I 8 name and catalog number. (b) Year of manufacture. (c) Nomenclature. (d) (e) Voltage, frequency. (f 1 Ampere rating (current transformers only) , (9) National stock number. Na

33、vy type CTS device designation. The selected current rating of the CPS control module shall be indicated on a separate plate or label. 3.11 Reliabilitx 100 cycles at 1 cycle per hour. 4.6.4 Insulation resistance. The insulation resistance shall be measured with a 500 volt d.c. testing generator to d

34、etermine compliance with the requirements of 3.6.10. 4.6.5 Dielectric strength. Tests for dielectric strength shall be made with an alter- nating potential from a transformer or generator of ample capacity having a sinusoidal wave ipe. The test voltage shall be as specified in 3.6.13. -. Licensed by

35、 Information Handling ServicesMIL-S-245bL blr W 9939906 0089721 2 MIL-S-24 561 (SH) devices are In accordanceth this specification, The tests shall be performed with the sizes of AQB circuit breakers corresponding to the CTS current setting, having shunt trip devices as specified in 3.6.9 at ambient

36、 temperatures of OC and 65OC. The CTS devices shall be supplied with 60 Hz power, and shall be tested in accordance with table V. following tests shall be performed: 4.6.6 Per-drmance test. Performance tests shall be made to determine that the CTS The (a) Demonstrate conformance with the time curren

37、t characteristics indicated on (b) Demonstrate reset, (c) Demonstrate ability to withstand 5000 amperes for 0.7 seconds (see 3.6.4.1) The above tests at condition A of table V shall be performed at 85OC to determine conformance with 3.6.9, data ordering document included in the contract or order (se

38、e 6.2.2). figure 1 at the following per unit current values: 1.19, 1.31, 1.50, 2.00, 2.85, 3.15, 4r00, 5.00. (test condition A only of table VI. The contractor shall prepare detailed test procedures in accordance with the TABLE V, Performance test condition. Test condition (Code) A B C D E F Nominal

39、 400 Hz current supply Voltage Frequency 450 4 O0 450 4 O0 450 4 O0 450 400 450 400 120 4 O0 (Ems volts) (Hz) Wominal 60 1iz control power supply Vol tage Frequency (rms volts) 115 107 123 86 144 115 (Hz) 60 61.8 63.6 50.4 60 58.2 4.6.7 Sliock. CTS devices shall be tested in accordance with grade A,

40、 class 1, type C and as specified in MIL-S-901. The mounting for shock testing CTC devices shall be in accor ance with the fixture 6E of MIL-S-901. The CTC devices shall be carrying 100 percent rated current: and be at an operating temperature not to exceed temperature limits during all shock tests.

41、 Device shall continuously perform its intended function. the following examinations and tests: Monitoring dming test shall be as specified in 3.6.4.1. After shock tests, the CTS devices shall be subjected to (a) Examination for evidence of mechanical damage or loosening of parts. (b) Performance as

42、 specified in 4.6.6 for test condition A at 65OC ambient (c) ansulation resistance - Shall be not less than 10 megohms (see 3.6.10 and (a) temperature. No change from original specified limits. 4.6.4) 3.6.13. Dielectric strength - Shall withstand 60 percent of the specified voltage of 4.6.7.1 Failur

43、e to perform rinci al functions. The CTS device shall not be damaged and shall be capable of-continuously + per orming its intended functions. 4.6.8 Vibration. CTS devices shall be tested in accordance with type I of MIL-CTD-167-1. The CTB devices shall be carrying 100 percent rated current and be a

44、t an operating tempera- ture not: to exceed temperature limits during the tests, devices shall be subjected to the examinations and tests listed in 4.6.7(a) through (d). shall not operhte to trip the cirEuit breaker, and shall be capable of continuously performing its intended functions. ance with M

45、IL-STD-471, method 4. shall consist correction of simulated faults. No advance information on the faults shall be allowed to the demonstration technicians. After vibration tests, the CTS 4.6.8.1 Failure to perform rincipal functions, The CTS device shall not be damaged, 4.6.9 Maintainability demonst

46、ration. Maintainability shall be demonstrated in accord- 4.6.9.1. Faults for correction. Corrective maintenance tasks for the demonstration The test set shall be used as applicable. 14 Licensed by Information Handling ServicesMIL-S-24561 (SHI 4.6.9.2 Scope of demonstration tasks. The time measured f

47、or each corrective maintenance sk shall consist of the sum of the times of all the steps sufficient to complete the repair. includins preparation, fault location, fault correction, adjustment, calibration, e - - checkout, and the consulting of technical manuals and other allowed aids. 4.6.10 Self-pr

48、otection from input voltage spikes. A separate test shall be performed for: (a) Voltage spike to the 60 Hz input. (b) Voltage spike to the 400 Hz input. During each test the inputs shall be at rated current, frequency, and voltage. The 60 Hz input shall have a source impedance of 0.4 ohm inductive r

49、eactance and 0.07 ohm resistance. For each test, the CTS device shall be disconnected from the input lines and a 2500 (peak) volt spike having a basic impulse level (BIL) wave shape as shown on figure entitled “Spike voltage (short time transient) wave shape“ of MIL-STD-1399, section 103 shall be applied to its required input between both line-to-line and line-to-ground. After reconnecting the CTS device back to the input lines, the voltage spike shall be reapplied. Three CTS control modules and 3 of each size current transformer circuitry, rigged in simulated operation with appr