1、 INCH-POUND MIL-STD-1310H(NAVY) 17 September 2009 SUPERSEDING MIL-STD-1310G(NAVY) 28 June 1996 DEPARTMENT OF DEFENSE STANDARD PRACTICE SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY AMSC N/A AREA EMCS Provided
2、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1310H(NAVY) FOREWORD 1. This standard is approved for use by the Department of the Navy and is available for use by all Departments and Agencies of the Department of Defense. 2. The increased use of elec
3、trical and electronic equipment aboard Naval ships introduces risk of electromagnetic interference (EMI) problems to ship operation and performance. As systems are added, they all contribute and could become susceptible to an intense electromagnetic environment (EME). Considering the corrosive salt
4、water environment in which ships must operate and the interaction of a ships electrically conductive metallic superstructure, topside hardware, antenna systems, etc., the potential for interoperability problems is significantly increased. Potential EMI and personnel safety problems related to electr
5、onic equipment operating in these environments are magnified because of: a. The need to establish and maintain a low impedance (Z), common reference ground for all electrical/electronic equipment b. The detrimental effects of: (1) Natural and manmade electromagnetic (EM) energy (2) Spurious and inte
6、ntional EM energy (3) Off-ship and own-ship, EM energy 3. MIL-STD-464 establishes electromagnetic environmental effects (E3) interface requirements and verification criteria for airborne, sea, space, and ground systems, including associated ordnance. This includes intra-ship and inter-ship electroma
7、gnetic compatibility (EMC), electromagnetic pulse (EMP), intermodulation interference (IMI), and electromagnetic radiation hazards to personnel, fuels, and ordnance. 4. This revision of MIL-STD-1310 has been expanded to include procedures for Electromagnetic Pulse (EMP) hardening. It also provides p
8、rocedures and guidance to more easily address MIL-STD-464 requirements in relationship to intra- and inter-ship EMC, hull-generated IMI, lifecycle E3 hardness, EMP, and electrical bonding. However, adherence to the procedures contained herein does not relieve the contractor from meeting the applicab
9、le ships operational performance requirements specified in the contract. 5. This document does not specify EMI reduction through frequency management, limits on operating power, or use of blankers. Grounding for personnel safety continues to be a major part of this standard, particularly in regard t
10、o commercial-off-the-shelf (COTS) equipment and non-developmental items (NDI). A separate appendix is included herein with procedures to identify whether COTS/NDI equipment meets appropriate safety requirements herein before use, and to provide direction to bring them into conformance when necessary
11、. This document does identify the E3 inspection and test procedures that can be used as measures of effectiveness of the EM control and personnel safety measures when installed/implemented. 6. Department of Defense (DoD) acquisition policy encourages contractor innovation, introduction of advancing
12、technology, and determination of the appropriate methods and materials to be used for all DoD acquisitions. Many effective shipboard EMI control measures and materials have been identified by the government and subsequently specified as requirements for ship construction and availabilities. Mandatin
13、g compliance works to the possible exclusion of equally effective industry-developed solutions. To avoid that possibility, this document defines EMC and safety requirements, and presents known effective solutions yet, when appropriate, allows the contractor an option to innovate a new solution with
14、cognizant technical authority approval. Because the appropriate performance demonstration inspections and tests have been identified herein, whichever method/material is used, its effectiveness in meeting the requirement can be determined. 7. Comments, suggestions, or questions on this document shou
15、ld be addressed to Commander, Naval Sea Systems Command, ATTN: SEA 05B5, 1333 Isaac Hull Avenue, SE, Stop 5160, Washington Navy Yard DC 20376-5160 or emailed to CommandStandardsnavy.mil, with the subject line “Document Comment”. Since contact information can change, you may want to verify the curren
16、cy of this address information using the ASSIST Online database at http:/assist.daps.dla.mil. ii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1310H(NAVY) CONTENTS PARAGRAPH PAGE 1. SCOPE1 1.1 Scope.1 1.2 Application1 1.3 Tailoring1 1.4 New
17、 materials and technology1 2. APPLICABLE DOCUMENTS 1 2.1 General1 2.2 Government documents 1 2.2.1 Specifications, standards, and handbooks 1 2.2.2 Other Government documents, drawings, and publications.2 2.3 Non-Government publications3 2.4 Order of precedence3 3. ACRONYMS and DEFINITIONS .3 3.1 Ac
18、ronyms used in this standard 3 3.2 Below deck areas 4 3.3 Bond-bonding (electrical) .4 3.4 Bond classification4 3.5 Bond strap.4 3.5.1 Type V bond strap4 3.6 Bright metal 4 3.7 Broadband noise (BBN)5 3.8 Commercial-off-the-shelf (COTS)5 3.9 Computer ground system 5 3.10 Conduit5 3.11 Electrical surg
19、e suppressor, marine type.5 3.12 Electromagnetic compatibility (EMC)5 3.13 Electromagnetic environment (EME) .5 3.14 Electromagnetic interference (EMI) .5 3.15 Electromagnetic pulse (EMP) .5 3.16 Ground (ground potential) 5 3.19 Ground loop 5 3.20 Ground, personnel/electrical safety.5 3.21 Ground, r
20、adio frequency (RF).6 3.22 Ground, 360 degrees (peripheral) .6 3.17 Grounding .5 3.18 Grounding effectiveness .5 3.23 Intermodulation interference (IMI).6 3.24 Maintenance-related EMI .6 3.25 Mobile-transportable electrical equipment6 3.27 Nonlinear junction 6 3.26 Non-developmental item (NDI)6 3.28
21、 Portable equipment .6 3.29 Shield 6 3.30 Shielded area.6 3.31 Terminal protection device (TPD) 6 iii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1310H(NAVY) 3.32 Topside areas 6 3.33 Trunk, wireway.7 4. GENERAL REQUIREMENTS7 4.1 Ground p
22、otential and ships ground plane7 4.2 Class B and/or C bonding .7 4.3 EMP effects.7 4.4 Electrical safety.7 4.5 Bonding and grounding of composite structures.7 4.6 Introduction of new technology 7 4.7 Quality assurance inspection.7 5. DETAILED REQUIREMENTS.7 5.1 Ground potential and ships ground plan
23、e(s) 7 5.1.1 Ground potential.7 5.1.1.1 Ground potential for metallic hull ships 7 5.1.1.2 Ground potential for nonmetallic hull ships 7 5.1.2 Ground plane(s)7 5.1.2.1 Elements of the ground plane 8 5.1.2.1.1 Superstructure, equipment foundations and racks.8 5.1.2.1.2 Cable grounding systems branche
24、s8 5.1.2.1.3 Shielded room(s).8 5.1.2.1.4 Computer ground system 8 5.1.2.2 Grounded items .8 5.1.2.2.1 Equipment cabinets and hardware items.8 5.1.2.2.2 Shock-mounted .8 5.1.2.2.3 Large/long hardware items .8 5.1.2.2.4 Bond strap and grounding wire routing 8 5.1.2.2.5 Joiner/false/honeycomb bulkhead
25、 mounted equipment 8 5.1.3 Class B and class C bonding and grounding preparations8 5.1.3.1 Class B and C bond installation.8 5.1.3.2 Hardware for class B and C bonding.9 5.1.3.3 Class C bonding/bond straps .9 5.1.3.3.1 Type I bond strap 10 5.1.3.3.2 Type II bond strap.10 5.1.3.3.3 Type III bond stra
26、p .10 5.1.3.3.4 Type IV bond strap .10 5.1.3.3.5 Type V bond strap.10 5.1.3.3.6 Bond strap attachment methods 10 5.1.4 Submarine equipment grounding .10 5.2 Hull-generated EMI prevention 10 5.2.1 Nonmetallic topside material10 5.2.2 Topside stowage.11 5.2.2.1 Portable and removable metallic deck har
27、dware .11 5.2.2.2 Other metallic material 11 5.2.3 Insulate topside metal-to-metal contact junctions 11 5.2.4 Bond topside metal-to-metal contact junctions 11 5.3 Cable and hull penetration EMI control11 5.3.1 Topside cable installations .11 5.3.1.1 Shielded cable11 iv Provided by IHSNot for ResaleN
28、o reproduction or networking permitted without license from IHS-,-,-MIL-STD-1310H(NAVY) 5.3.1.2 Unshielded cable .11 5.3.1.3 Wireway trunks .11 5.3.2 Hull penetration EMI control .12 5.3.2.1 Bonding metallic hull-penetrators .12 5.3.2.1.1 Rigid conduit 12 5.3.2.1.2 Flexible metal conduit.12 5.3.2.1.
29、3 Waveguides, pipes, tubing, and exhaust stacks.12 5.3.3 Below decks cable and flexible metal conduit installations .12 5.3.3.1 Below deck flexible metal conduit bonding and grounding methods12 5.3.3.2 Termination and coupling of Type 2 conduit 12 5.3.3.3 Shielded multi-conductor cables13 5.4 EMP pr
30、otection .13 5.4.1 Cables.13 5.4.2 Cable shielding performance.13 5.4.3 Wireway trunks.13 5.4.4 Waveguides, pipes, tubing, and exhaust stacks13 5.4.5 Terminal protection device14 5.4.6 EMP protection, composite structure .14 5.5 Superstructure blockage and reflections .14 5.5.1 Topside configuration
31、 drawings.14 5.5.2 Flat and reflective surfaces.14 5.6 Equipment-generated EMI prevention14 5.6.1 RF tuned receiver front-end stages.14 5.6.2 LF-MF receiver(s), but no in-band transmitter(s) 14 5.6.3 BBN suppression; portable electrical tools 14 5.7 Electrical safety; personnel shock hazard preventi
32、on .14 5.7.1 Portable and mobile-transportable electrically-powered equipment 14 5.7.1.1 Electrical equipment with a conductive case.15 5.7.1.2 Electrical equipment with a non-conductive case15 5.7.2 Fixed-installed, electrically-powered equipment .15 5.7.3 Fixed rack mounted or enclosure mounted el
33、ectrically powered equipment .15 6. NOTES .15 6.1 Intended use 15 6.2 Acquisition requirements 15 6.3 Quality assurance provisions 15 6.3.1 In-progress inspection 15 6.3.2 Final inspection 16 6.3.3 Inspection responsibility 16 6.3.4 Inspector certification.16 6.3.5 Government verification 16 6.4 RF
34、impedance measurement .16 6.5 Subject term (key word) listing.16 6.6 Changes from previous issue 16 FIGURES FIGURE 1. EMI filter capacitor installation in sound powered telephone boxes.17 FIGURE 2. Typical wireway trunk.18 FIGURE 3. Cable shield grounding (split SGA).19 v Provided by IHSNot for Resa
35、leNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1310H(NAVY) FIGURE 4. Cable shield grounding20 FIGURE 5. Cable shield grounding21 FIGURE 6. Cable shielding method, flexible metal conduit 22 FIGURE 7. Cable shielding method, flexible metal conduit 23 FIGURE 8. Waveguide
36、s grounding24 FIGURE 9. Method of grounding flexible metal conduit for below decks cable installations 25 FIGURE 10. Antenna tuner and coupler grounding .26 FIGURE 11. Methods of attaching bond straps 27 APPENDIX A A.1 SCOPE.28 A.1.1 Scope.28 A.2 APPLICABLE DOCUMENTS .28 A.2.1 General28 A.2.2 Govern
37、ment documents 28 A.2.2.1 Specifications, standards, and handbooks 28 A.2.3 Order of precedence28 A.3 INSTALLATION GUIDANCE.28 A.3.1 Class B and class C bonding .28 A.3.2 Hull-generated EMI 28 A.3.3 Bonding not recommended .29 A.3.4 RF tuned receiver front-end stages29 A.3.5 COTS and NDI equipment29
38、 A.4 TESTING GUIDANCE.29 A.4.1 Pulse current injection (PCI) testing .29 A.4.2 Cable and case penetration/radiation EMI control 29 APPENDIX B B.1. SCOPE30 B.1.1 Scope.30 B.1.2 Implementation30 B.1.3 Application30 B.2 APPLICABLE DOCUMENTS30 B.2.1 General 30 B.2.2 Government documents.30 B.2.2.1 Speci
39、fications, standards, and handbooks.30 B.2.2.2 Other Government documents, drawings, and publications .30 B.2.3 Order of precedence 30 B.3 COMMERCIAL QUALIFICATION DOCUMENTATION.31 B.4 ELECTRICAL SHOCK HAZARD PROTECTION REQUIREMENTS31 B.4.1 Double insulated and non-conducting equipment .31 B.4.1.1 D
40、ouble insulated equipment .31 B.4.1.2 Non-conducting equipment 31 B.4.2 Equipment with a conductive case or exposed conductive elements 31 B.4.2.1 Installation requirements; 3-pronged plug31 B.4.2.2 Installation requirements; 2-pronged plug31 vi Provided by IHSNot for ResaleNo reproduction or networ
41、king permitted without license from IHS-,-,-MIL-STD-1310H(NAVY) vii APPENDIX C C.1 SCOPE.33 C.1.1 Scope.33 C.1.2 Primary common ground reference; systems and shielded spaces 33 C.1.3 Common ground reference outside shielded spaces33 C.1.4 Common ground reference inside shielded spaces33 C.1.5 Electr
42、ical safety ground for shock hazard protection 33 C.2 APPLICABLE DOCUMENTS33 C.2.1 General 33 C.2.2 Government documents.33 C.2.2.1 Specifications, standards, and handbooks.33 C.2.3 Non-Government publications 33 C.2.4 Order of precedence 34 C.3 GROUND SYSTEM CABLES34 C.3.1 Ground cable installation
43、.34 C.3.2 Ground plate interconnecting cable.34 C.3.3 Main ground cable.34 C.3.4 Branch ground cables 34 C.3.5 Electronic transmitter ground cable.37 C.3.6 Antenna tuners and couplers, ground cable.37 C.3.7 Lightning protection37 C.3.8 Metal mast.37 C.4 EQUIPMENT/ITEMS GROUNDING REQUIREMENTS.37 C.4.
44、1 Equipment/items that shall be grounded .37 C.4.2 Items that should not require grounding37 C.5 GROUNDING TO SHIELDED AREA.38 C.6 CONNECTIONS .38 FIGURES FIGURE C-1. Nonmetallic hull ship multi-tree ground system35 FIGURE C-2. Nonmetallic hull ship multi-tree ground connection methods.36 Provided b
45、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1310H(NAVY) 1. SCOPE 1.1 Scope. This document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bond
46、ing, and intermodulation interference (IMI) requirements of MIL-STD-464. 1.2 Application. The requirements specified herein apply to metal and nonmetallic hull ships and are applicable during ship construction, overhaul, alteration, and repair. Requirements herein may be invoked upon contractor and
47、government (military and civilian) personnel. 1.3 Tailoring. The requirements herein may be tailored with NAVSEA 05H3, Navy technical warrant authority, approval. 1.4 New materials and technology. To achieve requirements of this standard while reducing lifecycle maintenance costs, implementation of
48、new materials and technology is encouraged. The new materials and technology should not prevent the ship from meeting all applicable MIL-STD-464 E3 performance requirements, and must not introduce EMI or safety problems. An example of new shipboard bonding and grounding technology is a flexible infr
49、astructure deck track system designed to provide equipment reconfigurability. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this standard. This section does not include documents cited in other sections of this standard or recommended for additional information or as examples. While every effort has been made to ensure the
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