NEMA ICS 12 1-1997 Profiles of Networked Industrial Devices - Part 1 General Rules《连网工业设备设置文件 第1部分 通用规则》.pdf

1、NEMA Standards PublicationNational Electrical Manufacturers AssociationNEMA ICS 12.1-1997Profiles of Networked Industrial DevicesPart 1: General RulesNEMA Standards Publication ICs 12.1 Profiles of networked industrial devices-Part 1 : General rules Published by National Electrical Manufacturers Ass

2、ociation 1300 N. 17th Street Rosslyn, Virginia 22209 O Copyright 1998 by the National Electrical Manufacturers Association. All rights including translation into other languages, reserved under the Universal Copyright Convention, the Berne Convention for the Protection of Literary and Artistic Works

3、, and the International and Pan American Copyright Conventions. Contents . Foreword III Introduction 1 1 Scope 2 2 Normative references 2 3 Definitions 3 4 Model architecture . 3 4.1 introduction . 3 4.2 Device information presentation . 4 4.3 Minimal information 5 4.4 Optional information . 5 4.5 C

4、onfiguration information ; 5 4.6 Template definition . 5 4.6.1 Template header 6 4.6.2 Template parameters . 10 4.6.3 Template state model . 13 4.6.4 Template assemblies . 16 Rules of use 20 4.7.1 Common state models . 20 4.7.2 Inheritance 22 Profile information exchange language . 24 General format

5、ting rules . 24 5.1.1 Sentence 25 5.1.2 Field delimiters . 25 5.1.3 Strings in fields . 25 5.1.4 Special characters and long lines . 25 5.1.5 Number fields . 25 5.1.6 In-line comments 25 5.1.7 Profile information exchange example . 26 Parameter and assembly information . 26 5.2.1 cH profile header i

6、nformation . 26 5.2.2 comments . 27 4.7 5 5.1 5.2 . 5.2.3 cP parameter information 27 5.2.4 5.2.5 5.2.6 cb parameter value description . 27 assembly information 28 assembly mapping . 28 ICs 12.1 -1 997 Page ii 5.3 State information 29 state names . 29 state transitions 29 state identification 29 sta

7、te transition command . 30 5.4 Option definitions 30 5.3.1 5.3.2 5.3.3 5.3.4 5.4.1 5.4.2 5.4.3 option header definition 30 parameter supported 31 Memory mapped network binding 32 assembly supported . 31 6 Binding architecture . 32 6.1 6.2 6.3 6.4 Message based network models 34 Buffer based network

8、model . 35 Additional restrictions and requirements in binding models . 35 Annex A (informative) Profile and state model examples 37 A.l Simple sensing device 37 A.2 Breaker device 38 A.3 Intelligent device with self test and external reset 40 A.4 Keypad device profile . 43 A.5 Simple sensor with al

9、arm and control . 43 A.6 AC drive profile . 45 ICs 12.1-1997 Page iii Foreword This Standards Publication provides general rules and definitions for the development of profiles for networked industrial devices. This Standards Publication was prepared by the Industrial Device Communications Task Forc

10、e of the NEMA Industrial Control and Systems Section. User needs and safety considerations were addressed during the preparation of this Standard. At the time of publication of this Standard, ICs 12.1, Profiles of networked industrial devices, is envisioned to be published in multiple parts, as foll

11、ows: ICs 12.1 ICs 12.2 ICs 12.3 ICs 12.4 ICs 12.5 ICs 12.6 ICs 12.7 ICs 12.8 ICs 12.9 ICs 12.10 General rules Device Profiles Profile Bindings to Actuator Sensor Interface Profile Bindings to SDSm Smart Distributed System Profile Bindings to DeviceNeP Profile Bindings to InterBus-S Profile Bindings

12、to LonTalkB Profile Bindings to Profibus-DP Profile Bindings to The Serial MuItMlexed Control Bus (SMCB) Profile Bindings to WorldFIP Profile 1 To facilitate consideration by the International Electrotechnical Commission (specifically, IEC/SC 7B), all parts of ICs 12.1 are being written according to

13、 the IEC Directives for the drafting and presentation of international standards. In this Standards Publication, clauses 1 to 6 are normative; Annex A is informative. The NEMA Industrial Control and Systems Section will periodically review this Standard and revise it as necessary to reflect advancin

14、g technology. Proposed or recommended revisions should be sent to: Vice President, Engineering National Electrical Manufacturers Association 1300 North 17th Street, Suite 1847 Rosslyn, Virginia 22209 This Standards Publication was approved by the NEMA Industrial Automation Control Products and Syste

15、ms Section. Section approval of the standard, however, does not necessarily imply that all section members voted for its approval or participated in its development. At the time this Standard was approved, the Industrial Automation Control Products and Systems Section consisted of the following memb

16、ers: ABB Control, Inc. -Wichita Falls, TX AEG Automation Systems Corporation - Pittsburgh, PA Allen-Bradley Company - Milwaukee, W I Amerace Electronics Components - Punta Gorda, FL AMP Inc. - Harrisburg, PA Automatic Switch Company - Florham Park, NJ Baldor Electric - Fort Smith, AR Balluff, Inc. -

17、 Florence, KY USD Products, Bussman Division, Cooper Industries - Chicago, IL CEGELEC Automation - Macon, GA Control Concepts - Beaver, PA ICs 12.1-1997 Page iv Cyberex - Mentor, OH Danaher Controls - Gurnee, IL Eaton Corporation, Cutler-Hammer Products - Milwaukee, W I Echelon - Palo Alto, CA Elect

18、rical Power Systems, Inc. - Tulsa, OK Electro Switch Corporation - Weymouth, MA Elliott Control Company - Hollister, CA Emerson Electric Company - Grand Island, NY Entrelec, Inc. - Irving, TX Firetrol, Inc. - Cary, NC Fisher-Rosemount - Marshalltown, IA General Electric - Plainville, CT I Gerber Sci

19、entific - South Windsor, CT Gettys Corporation - Racine, WI Harland Simon Control Systems - Baldwinsville, NY Harnischfeger Corporation - Milwaukee, W I Honeywell, Inc. - Fort Washington, PA Hubbell Incorporated - Madison, OH Joslyn Clark Control, Inc. - Lancaster, SC Kiliark-Stahl, Inc. - St. Louis

20、, MO Klockner-Moeller Corporation - Franklin, MA Lexington Switch Presentation Layer (6) Session Layer Transport Layer (41 4.2 Device information presentation Standard Device profiles may be viewed as the formal definition of the presentation of data in the application layer in the OS1 communication

21、s reference model, as shown in Figure 1, The profiles define the format in which the data is presented, in particular how the individual elements of information are collected and formatted, and how the device is commanded. Standard . Ap p I i cati0 n Layer t Definition . 5 Network I binding model Da

22、ta Link Layer Physical Layer Interface is the network Network Layer (3) Data Link Laver (2) I Physical Layer (11 Figure 1 - OS1 reference model and scope of standard Many industrial networks use a collapsed version of the OS1 model. The collapsed model has only layers 1,2, and 7 as distinct layers.

23、Any functionality normally defined in one of the missing layers is incorporated into one of the defined layers. The device presentation in the collapsed model, as defined by the device profile, would be part of the application layer, as shown in Figure 2. “Collapsed” Network Model on Connected Devic

24、e I User Layer Scope of Figure 2 - Scope in a collapsed network model ICs 12.1-1997 Page 5 4.3 Minimal information In this standard, the device profile specifies the minimal information which can be exchanged with the device. The minimal information shall be the infomation shared at run time to moni

25、tor and control the device in its regular mode of operation. It shall not define capabilities which can be optionally implemented by the device, and it shall not include information content which is network specific. 4.4 Optional information A device profile may also contain run time information bey

26、ond the minimal information. This is information and commands which define optional elements of a device, such as an optional set of auxiliary contacts or configuration data. Optional information may also specify information and commands which are only available on a limited set of networks, such as

27、 large data sets. 4.5 Configuration information Configuration information is data which is not normally exchanged at run time, such as device setup data or network addresses. A device profile may also contain configuration information. Some devices may have no configuration data. Some networks do no

28、t support configuration of devices across the network, so all configuration information is considered optional. 4.6 Template definition Figure 3 shows the format of the template for a device profile. A template defines the set of required and optional items which must be supplied by the device on th

29、e network or the network interfaces. Once a template has been populated with the device specific information, it becomes a device profile. ICs 12.1-1997 Page 6 Param Parameter Name Type Engr. Unifs Units No. Multiplier Profile ID Number PFXX.YYYY Version: VAAA Date: YYYY-MM-DD t class of Device: Ran

30、ge Descriptial I Description: Figure 4 - Location of profile ID number 4.6.1 2 Version Each profile will have a version control number. Version control numbers are administered by the National Electrical Manufacturers Association. Version control is used to document changes to a device profile which

31、 can occur over time. Version changes occur when the following change: - parameters; - the state model; - new optional assemblies. When the order of parameters in an assembly change, or new required assemblies are needed, then a new profile shall be developed, not a version of an existing profile. T

32、he format for the version identification is VAAA where V AAA is the version identification. is always the capital letter “V“; An example of a profile and version would be P002.0008 V004, which means a type 02 device with subtype 8, fourth revision. Only numerical characters are permitted in the iden

33、tification numbers. The initial release of a profile will be 001. All profiles with a major version identification of O00 are considered prototypes and are not valid as a standard. Figure 5 shows the location of the version control number in a template. STD.NEGIA ICs ICs 12.1-1997 Page 8 1997 u 6470

34、247 0514427 264 Profile ID Number: PFXX.YYYY Version VAAA Date: YYYY-MM-DD L Class of Device: Figure 5 - Location of version control number 4.6.1.3 Release date The date of the release of the device profile is shown in the IS0 format YYYY-MM-DD where DD MM YYYY is theyear. is the day of the month (0

35、1-31); is the month of the year (O1 -12); Figure 6 shows the location of the release date in a template. Table 1 - Profile automation function and device type identifiers I I 05 I Magnetic Sensors I 06-99 I Reserved for future assignments I STDmNEMA ICs LZmL-ENGL 3997 U b470247 0534428 LTO = Automat

36、ion Device Function Type ICs 12.1- 97 Pag Description: Figure 6 - Location of release date ICs 12.1-1997 Page 10 4.6.1.4 Class of device The class of device field is the English language text string which describes the device class as seen from the network. This must be a recognized name for the dev

37、ice class-for example, “Motor Starter“ from IEC 60947-4-1 or “Capacitive Proximity Switch“ from IEC 60947-5-2. A description of the device class may also be included with the class name. Generally, devices of different sizes, or in different enclosures, will have the same device profiles and charact

38、eristics. For example, the same device profile may be used for any size starter, but some of the optional configuration information available from the starter would be its size. Figure 7 shows the location of the class of device in a template. Profile ID Number: PFXX.YYYY Version VAAA Date: YYYY-MM-

39、DD Class Of Device: Description: Figure 7 - Location of class of device 4.6.2 Template parameters Device parameters describe the basic elements of information which can be read from a device and commands, and data which can be written to a device. A parameter is an indivisible data element. The foll

40、owing clauses define how the value for the parameter isdo be. interpreted, its data type, units, range, specific values, etc. Each parameter has the information described in 4.6.2.1 to 4.6.2.7. 4.6.2.1 Parameter number The numeric identifier for the parameter numbers are decimal based and start at t

41、en (10). Parameter numbers zero (O) to nine (9) are reserved for the Common Device Profile. There is no requirement that parameter numbers be sequential. For example, parameters with related functionality may be sequentially numbered, separated by unassigned numbers. Figure 8 shows the location of t

42、he parameter number. PARAMETERS: / Figure 8 - Location of the parameter number ICs 12.1-1997 Page 11 4.6.2.2 Parameter name This contains the English language name for the parameter. Figure 9 shows the location of the parameter name. l l I I I I I I Figure 9 - Location of the parameter name 4.6.2.3

43、Type This contains the data type of the parameter. The valid data types are listed in Table 2. The data types are derived from the data types defined in IEC 61 131 -3. STRING and UNICODE shall include their length, in bytes, in the type field-for example, STRING (10) for a ten byte string, or UNICOD

44、E (12) for a 12 byte unicode string. Figure 10 shows the location of the parameter type. I 1 I I I I Figure 10 - Location of the parameter type Table 2 - Standard data types ICs 12.1 -1 997 Page 12 Table 2 (continued) 4.6.2.4 Engineering units This specifies the engineering units of the parameter in

45、 International Systems of units (SI) and the specified units multiplier (e.g., degrees Celsius in Iths of a degree). SI units are set out in IS0 31 and IS0 1000. When no engineering units are defined or required, the text string “ (not applicable) shall be used. Figure 11 shows the location of the e

46、ngineering unit field. PARAMETERS: / Figure 11 - Location of the engineering unit field 4.6.2.5 Engineering units multiplier This specifies the specified units multiplier. The units multiplier scales the value represented to the engineering unit scale. The engineering unit multiplier is a scalar (fl

47、oating point or integer) number, without units. For example, an integer parameter with engineering units of Degrees Celsius and a unit multiplier of 0.1, corresponds to a 1 O* degree Celsius per integer value in the parameter. The engineering units and engineering unit multiplier defines how the par

48、ameter value should be interpreted, not how it is converted from a network representation. Figure 12 shows the location of the engineering units multipiier. Figure 12 - Location of the engineering unit multiplier field - STD-NEMA ICs 12.L-ENGL 1997 = 6470247 0514432 621 ICs 12.1-1997 Page 13 4.6.2.6

49、 Range This specifies the valid range of data values in engineering units of the parameter. This range may be more limited than the range specified by the parameter type (e.g., the parameter type may be “Byte“ (0255), while the valid range may only be 40 200). The range is inclusive of the specified values, and any exceptions are described in the description field. The range is specified as the minimum number, followed by two periods (“I), followed by the maximum number. Parameters which require a null or a “not defined“ value shall use a value within the type definition, but