NEMA SSL 3-2011 HIGH-POWER WHITE LED BINNING FOR GENERAL ILLUMINATION《普通照明用高功率白光LED组合》.pdf

1、 NEMA Standards Publication SSL 3-2011 High-Power White LED Binning for General Illumination Published by: National Electrical Manufacturers Association 1300 North 17th Street, Suite 1752 Rosslyn, Virginia 22209 www.nema.org Copyright 2011 by the National Electrical Manufacturers Association. All ri

2、ghts including translation into other languages, reserved under the Universal Copyright Convention, the Berne Convention for the Protection of Literary and Artistic Works, and the International and Pan American Copyright Conventions. NOTICE AND DISCLAIMER The information in this publication was cons

3、idered technically sound by the consensus of persons engaged in the development and approval of the document at the time it was developed. Consensus does not necessarily mean that there is unanimous agreement among every person participating in the development of this document. The National Electric

4、al Manufacturers Association (NEMA) standards and guideline publications, of which the document contained herein is one, are developed through a voluntary consensus standards development process. This process brings together volunteers and/or seeks out the views of persons who have an interest in th

5、e topic covered by this publication. While NEMA administers the process and establishes rules to promote fairness in the development of consensus, it does not write the document and it does not independently test, evaluate, or verify the accuracy or completeness of any information or the soundness o

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11、orce compliance with the contents of this document. NEMA does not certify, test, or inspect products, designs, or installations for safety or health purposes. Any certification or other statement of compliance with any health or safetyrelated information in this document shall not be attributable to

12、 NEMA and is solely the responsibility of the certifier or maker of the statement. SSL 3-2011 Page i Copyright 2011 by the National Electrical Manufacturers Association. CONTENTS Foreword . ii Introduction . 1 1 Scope 1 2 Normative References 1 3 Terms and Definitions . 1 4 Color Binning 2 4.1 Color

13、 Binning of White LEDs 2 4.2 Bin Labeling of White LEDs 6 5 Luminous Flux and Luminous Intensity Binning . 6 5.1 Bin Labeling by Luminous Flux . 6 6 Color Rendering Binning 7 7 Forward Voltage Binning 7 7.1 Bin Labeling by Forward Voltage 7 Figures Figure 4-1 White LED Color Binning Pictorial Repres

14、entation . 2 Figure 4-2 White LED Color Binning 4500K6500K Coordinate Representation 3 Figure 4-3 White LED Color Binning 2700K4000K Coordinate Representation 4 Figure 5-1 Luminous Flux Binning Ranges 6 Figure 7-1 Forward Voltage Binning . 7 SSL 3-2011 Page ii Copyright 2011 by the National Electric

15、al Manufacturers Association. Foreword The NEMA Solid State Lighting Section has prepared this standards publication, based on discussions among numerous LED and SSL manufacturers and integrators. In the preparation of this standards publication, input of users and other interested parties has been

16、sought and evaluated. Inquiries, comments, and proposed or recommended revisions should be submitted to the concerned NEMA product subdivision by contacting: Vice President, Technical Services National Electrical Manufacturers Association 1300 North 17th Street, Suite 1752 Rosslyn, Virginia 22209 Se

17、ction approval of the standard does not necessarily imply that all section members voted for its approval or participated in its development. At the time the standard was approved, the Solid State Lighting Section was composed of the following members: Amerlux Global Lighting Solutions Atlas Lightin

18、g Products, Inc. Cooper Industries plc Cree, Inc. Dialight Corporation EiKO, Ltd. EYE Lighting International of N.A., Inc. GE Hatch Transformers, Inc. Hubbell Incorporated LEDnovation, Inc. Leviton Manufacturing Co., Inc. Luminus Devices, Inc. Lutron Electronics Company, Inc. MaxLite Nichia America

19、Corporation Osram Sylvania Inc. Philips Lighting Company Ruud Lighting Inc. Schneider Electric Soraa Inc. Technical Consumer Products, Inc. TerraLUX Inc. Toshiba International Corporation Universal Lighting Technologies SSL 3-2011 Page 1 Copyright 2011 by the National Electrical Manufacturers Associ

20、ation. Introduction The binning of LEDs is a practice used by LED manufacturers to manage the variation of LED performance in mass production processes. The inefficiencies of binning may create structural vulnerability in the supply chain for the market. To reduce the risk and at the same time prote

21、ct product yields, LED manufacturers often choose binning schemes in accordance with their specific or unique mass production process. As a result, the LED components or packages produced by the manufacturers maintain structured variations for their performance characteristics. Because of the unique

22、ness of the mass production and quality control process used by each LED manufacturer, the LED products supplied to LED system integrators or assemblers (module makers, luminaire makers, etc.) with similar performance characteristics produced by different manufacturers are binned and labeled differe

23、ntly. The binning structures and labeling (marking) used varies from manufacturer to manufacturer. Binning structure inconsistency, as a result, requires more effort on the part of LED system integrators and assemblers. More unnecessary testing, verifications, qualification, and validations processe

24、s have to take place. As a result, overall solid state lighting (SSL) industry productivity may be negatively influenced. With a rapidly growing SSL market, more LED products will be manufactured and more manufacturers will be participating in the market. This makes it necessary and important to est

25、ablish industry agreed-upon guidelines to ensure product consistency. 1 Scope This standard applies to LEDs emitting incoherent, visible radiation in solid state lighting applications. It specifies bins and bin codes for LEDs for the following characteristics: Color Lumens Forward Voltage 2 Normativ

26、e References ANSI/NEMA/ANSLG C78.377-2008 Specifications for the Chromaticity of Solid State Lighting Products ANSI/IESNA RP-16 Nomenclature and Definitions for Illuminating Engineering 3 Terms and Definitions 3.1 Bin: A restricted range of LED performance characteristics used to delimit a subset of

27、 LEDs near a nominal LED performance as identified by chromaticity and photometric performance. NOTEAs the result of small but meaningful variations in the manufacturing process of LED wafers and subsequent dies, the electrical and photometric characteristics of LEDs may vary from LED to LED, even w

28、hen the dies are from the same wafer. 3.2 Binning: The process of sorting and grouping a manufactured distribution of LED packages into smaller groupings. SSL 3-2011 Page 2 Copyright 2011 by the National Electrical Manufacturers Association. 3.3 Color Bin: The code to indicate the range of chromatic

29、ity variation from a grouping of LED packages. 4 Color Binning 4.1 Color Binning of White LEDs As specified in ANSI/NEMA/ANSLG C78.377, SSL products shall have chromaticity values that fall into one of the nominal Correlated Color Temperature (CCT) categories, and SSL products with a given nominal C

30、CT shall have the defined target CCT and Duv. Additionally, the values of individual samples shall be within the tolerances of CCT and Duv, and the white color binning of LED components should be set with defined quadrangles. The binning boundaries should match the boundaries of each quadrangle spec

31、ified in ANSI/NEMA/ANSLG C78.377. The chromaticity evaluation shall be conducted at a specific drive current. This drive current will be specified by the LED package manufacturer and will be stated on the datasheet for the component. All measurements are assumed to be done at room conditions 25C. A

32、pictorial representation of the binning structure is shown in Figure 4-1 (built on the MacAdam ellipse as shown in ANSI/NEMA/ANSLG C78.377): Figure 4-1 White LED Color Binning Pictorial Representation 0 . 3 0 00 . 3 2 00 . 3 4 00 . 3 6 00 . 3 8 00 . 4 0 00 . 4 2 00 . 4 4 00 . 3 0 0 0 . 3 2 0 0 . 3 4

33、 0 0 . 3 6 0 0 . 3 8 0 0 . 4 0 0 0 . 4 2 0 0 . 4 4 0 0 . 4 6 0 0 . 4 8 0 0 . 5 0 0yxSSL 3-2011 Page 3 Copyright 2011 by the National Electrical Manufacturers Association. The coordinates of the new binning structure are as follows in Figures 4-2 and 4-3: Figure 4-2 White LED Color Binning 4500K6500K

34、 Coordinate Representation SSL 3-2011 Page 4 Copyright 2011 by the National Electrical Manufacturers Association. Figure 4-3 (continued on next page) White LED Color Binning 2700K4000K Coordinate Representation SSL 3-2011 Page 5 Copyright 2011 by the National Electrical Manufacturers Association. Fi

35、gure 4-3 (continued) White LED Color Binning 2700K4000K Coordinate Representation SSL 3-2011 Page 6 Copyright 2011 by the National Electrical Manufacturers Association. 4.2 Bin Labeling of White LEDs This section reserved for future expansion. There is no current scheme accepted by all manufacturers

36、. 5 Luminous Flux and Luminous Intensity Binning The luminous flux evaluation shall be conducted at a specific drive current. This drive current will be specified by the LED package manufacturer and will be stated on the datasheet for the component. All measurements are assumed to be done at room co

37、nditions 25C. Any tolerances associated with the final measurement shall be specified by the manufacturer on the datasheet. A pictorial representation of the binning structure is shown in Figure 5-1. Figure 5-1 Luminous Flux Binning Ranges 5.1 Bin Labeling by Luminous Flux This section reserved for

38、future expansion. There is no current scheme accepted by all manufacturers. SSL 3-2011 Page 7 Copyright 2011 by the National Electrical Manufacturers Association. 6 Color Rendering Binning There is currently no specification for color rendering binning. 7 Forward Voltage Binning The forward voltage

39、evaluation shall be conducted at a specific drive current. This drive current will be specified by the LED package manufacturer and will be stated on the datasheet for the component. All measurements are assumed to be done at room conditions 25C. Any tolerances associated with the final measurement

40、shall be specified by the manufacturer on the datasheet. A pictorial representation of the binning structure is shown in Figure 7-1. Min (Vdc) Max (Vdc) 2.5 2.75 2.75 3 3 3.25 3.25 3.5 3.5 3.75 3.75 4 Figure 7-1 Forward Voltage Binning 7.1 Bin Labeling by Forward Voltage This section reserved for future expansion. There is no current scheme accepted by all manufacturers.