1、UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL UL 1557 Electrically Isolated Semiconductor Devices STANDARD FOR SAFETYUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM ULUL COPYRIGHTED M
2、ATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL UL Standard for Safety for Electrically Isolated Semiconductor Devices, UL 1557 Sixth Edition, Dated March 19, 2018 SUMMARY OF TOPICS: The Sixth Edition of the Standard for Safety for Electrically Isolated Sem
3、iconductor Devices, UL 1557, has been issued to reect the latest ANSI approval date and to incorporate the following proposal: Adding dc production line dielectric testing. The new requirements are substantially in accordance with Proposal(s) on this subject dated February 9, 2018. All rights reserv
4、ed. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form by any means, electronic, mechanical photocopying, recording, or otherwise without prior permission of UL. UL provides this Standard as is without warranty of any kind, either expressed or imp
5、lied, including but not limited to, the implied warranties of merchantability or tness for any purpose. In no event will UL be liable for any special, incidental, consequential, indirect or similar damages, including loss of prots, lost savings, loss of data, or any other damages arising out of the
6、use of or the inability to use this Standard, even if UL or an authorized UL representative has been advised of the possibility of such damage. In no event shall ULs liability for any damage ever exceed the price paid for this Standard, regardless of the form of the claim. Users of the electronic ve
7、rsions of ULs Standards for Safety agree to defend, indemnify, and hold UL harmless from and against any loss, expense, liability, damage, claim, or judgment (including reasonable attorneys fees) resulting from any error or deviation introduced while purchaser is storing an electronic Standard on th
8、e purchasers computer system. MARCH 19, 2018 UL 1557 tr1UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL MARCH 19, 2018 UL 1557 tr2 No Text on This PageUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PE
9、RMISSION FROM UL MARCH 19, 2018 1 UL 1557 Standard for Electrically Isolated Semiconductor Devices First Edition May, 1984 Second Edition May, 1993 Third Edition May, 1997 Fourth Edition June, 2006 Fifth Edition December, 2011 Sixth Edition March 19, 2018 This ANSI/UL Standard for Safety consists of
10、 the Sixth Edition. The most recent designation of ANSI/UL 1557 as an American National Standard (ANSI) occurred on March 19, 2018. ANSI approval for a standard does not include the Cover Page, Transmittal Pages, and Title Page. Comments or proposals for revisions on any part of the Standard may be
11、submitted to UL at any time. Proposals should be submitted via a Proposal Request in ULs On-Line Collaborative Standards Development System (CSDS) at https:/. ULs Standards for Safety are copyrighted by UL. Neither a printed nor electronic copy of a Standard should be altered in any way. All of ULs
12、Standards and all copyrights, ownerships, and rights regarding those Standards shall remain the sole and exclusive property of UL. COPYRIGHT 2018 UNDERWRITERS LABORATORIES INC. ANSI/UL 1557-2018UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL
13、 MARCH 19, 2018 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557 2 No Text on This PageUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL CONTENTS INTRODUCTION 1 Scope .4 2 Components4 3 Units of Measurement .5 4 Undated References 5 5 Glo
14、ssary .5 CONSTRUCTION 6 General 6 7 Insulating Materials6 8 Live Parts 6 9 Wiring Terminals 6 10 Spacings7 PERFORMANCE 11 General.7 12 Dielectric Voltage-Withstand Test 8 13 Limited Thermal Aging Test .8 MANUFACTURING AND PRODUCTION-LINE TEST 14 Dielectric Voltage-Withstand Test .10 RATING 15 Genera
15、l11 MARKING 16 General11 SUPPLEMENT SA - SEMICONDUCTOR DEVICES INCORPORATING THERMISTOR TYPE DEVICES SA1 Scope SA1 SA2 GlossarySA1 SA3 Termistor Type Devices SA4 SA4 Rating SA4 SA5 Marking SA5 APPENDIX A Standards for ComponentsA1 MARCH 19, 2018 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557
16、3UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL INTRODUCTION 1 Scope 1.1 These requirements apply to semiconductor devices of the isolated-mounting type thyristors, transistors, diodes, and the like, and hybrid modules consisting of combina
17、tions of these devices. 1.2 These requirements do not apply to snubber and commutation circuits associated with thyristors, transistors or other analog semiconductor devices. 1.3 These requirements cover the isolation performance of thyristors, transistors, diodes, and the like, and their combinatio
18、n in module packages and constructional features that are pertinent to that performance. 1.4 These requirements apply to isolated semiconductors for use as components in products. Compliance of an isolated semiconductor with these requirements does not determine that the semiconductor is acceptable
19、for use as a component of an end product without further investigation. The acceptability of a semiconductor in any particular product depends upon its acceptability for continued use under the conditions that prevail in actual service. 2 Components 2.1 Except as indicated in 2.2, a component of a p
20、roduct covered by this Standard shall comply with the requirements for that component. See Appendix A, for a list of standards covering components generally used in the products covered by this Standard. 2.2 A component is not required to comply with a specic requirement that: a) Involves a feature
21、or characteristic not required in the application of the component in the product covered by this standard, or b) Is superseded by a requirement in this standard. 2.3 A component shall be used in accordance with its rating established for the intended conditions of use. 2.4 Specic components are inc
22、omplete in construction features or restricted in performance capabilities. Such components are intended for use only under limited conditions, such as certain temperatures not exceeding specied limits, and shall be used only under those specic conditions. MARCH 19, 2018 ELECTRICALLY ISOLATED SEMICO
23、NDUCTOR DEVICES - UL 1557 4UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 3 Units of Measurement 3.1 Values stated without parentheses are the requirement. Values in parentheses are explanatory or approximate information. 4 Undated Referenc
24、es 4.1 Any undated reference to a code or standard appearing in the requirements of this standard shall be interpreted as referring to the latest edition of that code or standard. 5 Glossary 5.1 For the purposes of this Standard, the following denitions apply. 5.2 CASE TEMPERATURE External location
25、on the semiconductor device or module package where temperatures are specied (and measured) in accordance with the manufacturers rating curve. 5.3 HERMETICAL SEAL Any material or cover employed to prevent air inltration, that is, encapsulant. 5.4 INSULATING MATERIAL OPERATING TEMPERATURE The maximum
26、 temperature of the insulating material for either the semiconductor device or module when operating in accordance with the manufacturers specications, usually the maximum junction temperature. 5.5 INSULATING MATERIALS Any material providing insulation between live parts, between the live parts and
27、the metal heat-sink, or in direct contact with the live parts. Case material, that provides insulation between live parts and the metal heat-sink (usually over the surface of the material) would be included. 5.6 ISOLATION VOLTAGE The maximum withstand potential at 60 Hz between live parts and metal
28、mounting surface of the semiconductor. 5.7 JUNCTION TEMPERATURE The maximum allowable temperature of the semiconductor junction specied by the manufacturer. 5.8 MODULE PACKAGE An assembly consisting of two or more semiconductor devices. 5.9 ON-STATE CURRENT The principle current when the semiconduct
29、or is in the ON-state. 5.10 SEMICONDUCTOR DEVICE Discrete isolated-mounting type electronic device in which the characteristic distinguishing electronic conduction takes place within a semiconductor, examples include thyristors, transistors, and diodes. 5.11 STORAGE TEMPERATURE Acceptable temperatur
30、e range at which the semiconductor can be stored, without any power applied, as specied by the manufacturer. MARCH 19, 2018 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557 5UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL CONSTRUCTION 6
31、 General 6.1 A semiconductor shall be constructed in compliance with Sections710. 7 Insulating Materials 7.1 Insulating materials shall be evaluated in accordance with the applicable requirements for Polymeric Materials Use in Electrical Equipment Evaluations, UL 746C, and shall have a thermal index
32、 at least equal to the insulating material operating temperature. Exception: Insulating material that are encapsulated or hermetically sealed need only be subjected to the Dielectric Voltage-Withstand Test, Section 12, and if the generic temperature rating of the material is exceeded, the Limited Th
33、ermal Aging Test, Section 13. 7.2 Insulating materials used to encapsulate devices shall: a) Have a minimum thickness of 1/32 inch (0.8 mm) and b) Operate within the generic temperature limitations as specied in the Standard for Polymeric Materials Long Term Property Evaluations, UL 746B, and may be
34、 applied independently onto a cured insulating material employed beneath it. Exception: Encapsulating material subjected to a single point, hot spot temperature, such as the junction temperature, that exceeds the thermal index shall be tested as outlined in the Limited Thermal Aging Test, Section 13
35、. 8 Live Parts 8.1 Metal employed for current-carrying parts shall be of stainless steel, silver, gold, copper, nickel, aluminum, an alloy of the same, or an equivalent material. 9 Wiring Terminals 9.1 A semiconductor shall be provided with a means for factory wiring for circuit wiring connections s
36、uch as wire binding screws, pressure connectors, stud and nut-type connectors, solder connections, quick-connectors, wire leads, or the like. 9.2 A quick-connect terminal shall be evaluated as described in the Standard for Electrical Quick-Connect Terminals, UL 310. MARCH 19, 2018 ELECTRICALLY ISOLA
37、TED SEMICONDUCTOR DEVICES - UL 1557 6UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 10 Spacings 10.1 The spacings through air and over surface of an electrically isolated semiconductor device, a) Between uninsulated live parts of opposite p
38、olarity; and b) Between uninsulated live parts and any other uninsulated metal parts, shall be based on the end-product spacing requirements. Exception No. 1: The spacing requirements do not apply to internal parts that are encapsulated or hermetically sealed. Exception No. 2: The spacing requiremen
39、ts of (a), above, do not apply between terminals of discrete semiconductor devices. For example, among collector, emitter, and base of a transistor or among anode, cathode, and gate of an SCR, and the like. 10.2 An insulating barrier or liner employed to provide the required spacings between uninsul
40、ated live parts of opposite polarity and between such parts and any other uninsulated metal parts shall: a) Comply with the requirements for internal barriers contained in the Standard forPolymeric Materials Use in Electrical Equipment Evaluations, UL 746C; and b) Not be less than 0.028 inch (0.71 m
41、m) thick. Exception: A barrier or liner used to maintain spacings between uninsulated live parts or any uninsulated metal parts may be less than 0.028 inch (0.71 mm) thick if the device is encapsulated or hermetically sealed. PERFORMANCE 11 General 11.1 Samples of semiconductors shall be tested as d
42、escribed in the Dielectric Voltage-Withstand Test, Section 12, and the Limited Thermal Aging Test, Section 13. MARCH 19, 2018 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557 7UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 12 Dielectri
43、c Voltage-Withstand Test 12.1 Immediately following each of the conditionings indicated in 12.3 12.5, a semiconductor device shall be capable of withstanding without breakdown for 60 seconds a 48 62 Hz essentially sinusoidal potential equal to the rated isolation rms voltage applied between metal mo
44、unting surface and all of the device terminals. For this test, all of the terminals are to be connected together. 12.2 The test potential is to be obtained from any convenient source having either a capacity of at least 500 VA or a lower capacity source with the meter connected in the output circuit
45、. The voltage is to be gradually increased until the required test level is reached and is to be held at that value for one minute. The increase in the applied potential is to be at a uniform rate and as rapid as is consistent with its value being correctly indicated by a voltmeter. 12.3 Six samples
46、 are to be subjected to the dielectric test procedure in the as-received condition. 12.4 Six samples are to be exposed to the maximum rated junction temperature for 7 hours. 12.5 Six samples are to be exposed to 0.0 2.0C (32.0 3.6F) for 7 hours. 13 Limited Thermal Aging Test 13.1 Material, as descri
47、bed in 7.1 and 7.2, shall not crack or warp in any of three samples of the device when the samples are aged in a full-draft circulating-air oven at a temperature and time chosen from the graph in Figure 13.1, using the index line that corresponds to the maximum operating temperature of the insulatin
48、g material or the maximum storage temperature of the device, whichever is greater. After this oven conditioning, all three samples of the device shall be capable of withstanding the rated isolation rms voltage when tested as described in 12.1 and 12.2. 13.2 The air oven is to be essentially as indic
49、ated in the Standard Specication for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation, ANSI/ASTM D5423 (Type II ovens) and the Standard Test Methods for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation, ANSI/ASTM D5374. A portion of the air may be recirculated, but a substantial amount of fresh air is to be admitted continuously to maintain an essentially normal air content surrounding the samples. The oven is to be adjusted to
