1、 IEC 62047-5 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 5: RF MEMS switches Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 5: Commutateurs MEMS-RF IEC 62047-5:2011 colour inside THIS PUBLICATION IS C
2、OPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either
3、 IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits
4、 de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI d
5、u pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva
6、 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical c
7、ontent of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria
8、 (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available o
9、n-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnica
10、l Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI
11、 La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI es
12、t constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm Le Catalogue en-ligne de la CEI vous permet deffectuer des recherches en utilisant diffrents cr
13、itres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remplaces. Just Published CEI: www.iec.ch/online_news/justpub Restez inform sur les nouvelles publications de la CEI. Just Published dtaille deux fois par mois les nouvelles
14、 publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues
15、additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous
16、: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62047-5 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 5: RF MEMS switches Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 5: Commutateur
17、s MEMS-RF INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE V ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-88912-584-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colour inside
18、 2 62047-5 IEC:2011 CONTENTS FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 3.1 Switching operation . 7 3.2 Switching configuration . 7 3.3 Actuating mechanism 7 3.4 Switching network configurations . 8 3.5 Reliability (performance) . 8 3.6 Electrical characteristics
19、 9 4 Essential ratings and characteristics . 10 4.1 Identification and types . 10 4.2 Application and specification description . 11 4.3 Limiting values and operating conditions . 11 4.4 DC and RF characteristics . 11 4.5 Mechanical and environmental characteristics . 12 4.6 Additional information 1
20、2 5 Measuring methods 12 5.1 General . 12 5.1.1 General precautions 12 5.1.2 Characteristic impedances . 12 5.1.3 Handling precautions . 12 5.1.4 Types 12 5.2 DC characteristics . 12 5.2.1 DC actuation voltage . 12 5.2.2 On or off resistance (d.c. contact or resistive type) 14 5.2.3 On or off capaci
21、tance (capacitive type) 15 5.2.4 Power consumption . 16 5.3 RF characteristics . 17 5.3.1 Insertion loss (L ins ) 17 5.3.2 Isolation (L iso ) . 19 5.3.3 Voltage standing wave ratio (VSWR) . 20 5.3.4 Input power at the intercept point 21 5.4 Switching characteristics . 21 5.4.1 General . 21 5.4.2 Swi
22、tching time measurement . 21 6 Reliability (performance). 22 6.1 General . 22 6.2 Life time cycles . 22 6.2.1 General . 22 6.2.2 Cold switching . 23 6.2.3 Hot switching or power handling 23 6.3 Temperature cycles . 24 6.3.1 General . 24 6.3.2 Test temperature . 24 6.3.3 Test cycle 24 62047-5 IEC:201
23、1 3 6.4 High temperature and high humidity testing . 24 6.5 Shock testing 25 6.6 Vibration testing 25 6.7 Electrostatic discharge (ESD) sensitivity testing 25 Annex A (informative) General description of RF MEMS Switches 26 Annex B (informative) Geometry of RF MEMS switches . 27 Annex C (informative
24、) Packaging of RF MEMS switches 30 Annex D (informative) Failure mechanism of RF MEMS switches . 31 Annex E (informative) Applications of RF MEMS switches . 32 Annex F (informative) Measurement procedure of RF MEMS switches . 34 Figure 1 Terminals of RF MEMS switch . 11 Figure 2 Circuit diagram for
25、measuring d.c. actuation voltage and RF characteristics of RF MEMS switches . 13 Figure 3 Circuit diagram for measuring impedance between the input and output ports . 14 Figure 4 Circuit diagram for measuring RF characteristics between the input and output ports using a network analyzer . 18 Figure
26、5 Circuit block diagram of a test setup to evaluate life time of RF MEMS switch . 22 Figure 6 Circuit block diagram of a test setup for power handling capability of RF MEMS switch 24 Figure B.1 RF MEMS series d.c. contact switch with two contact areas. . 27 Figure B.2 RF MEMS series d.c. contact swi
27、tch with one contact area . 27 Figure B.3 RF MEMS shunt d.c. contact switch 28 Figure B.4 RF MEMS series capacitive type switch with one contact area 28 Figure B.5 RF MEMS shunt capacitive type switch . 29 Figure F.1 Measurement procedure of RF MEMS switches 34 Table A.1 Comparison of semiconductor
28、and RF MEMS switches 26 Table B.1 Comparison of RF MEMS switches with different actuation mechanism 29 Table D.1 Comparison of failure mechanism of RF MEMS switches . 31 4 62047-5 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 5: RF ME
29、MS switches FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardiz
30、ation in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is
31、 entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the
32、International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects s
33、ince each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical conte
34、nt of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possibl
35、e in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
36、 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors,
37、 employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out
38、of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to
39、 the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-5 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC
40、technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/83/FDIS 47F/93/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publicat
41、ion has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 62047 series, under the general title Semiconductor devices Micro-electromechanical devices, can be found in the IEC website. 62047-5 IEC:2011 5 The committee has decided that the contents of this
42、publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside
43、 logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 62047-5 IEC:2011 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES
44、Part 5: RF MEMS switches 1 Scope This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (
45、Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) switches with various structures, contacts (d.c. contact and capacitive contact), configurations (series and shunt), switching networks (SPST, SPDT, DPDT, etc.), and actuation mechanism such as electrostatic, electro-thermal, electromagnetic,
46、piezoelectric, etc. The RF MEMS switches are promising devices in advanced mobile phones with multi-band/mode operation, smart radar systems, reconfigurable RF devices and systems, SDR (Software Defined Radio) phones, test equipments, tunable devices and systems, satellite, etc. 2 Normative referenc
47、es The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the normative documents (including any amended documents) referred to applies. IEC 60747-1: 2006, Semicond
48、uctor devices Part 1: General IEC 60747-16-1, Semiconductor devices Part 16-1: Microwave integrated circuits Amplifiers IEC 60747-16-4:2004, Semiconductor devices Part 16-4: Microwave integrated circuits Switches IEC 60749-5, Semiconductor devices Mechanical and climatic test methods Part 5: Steady-
49、state temperature humidity bias life test IEC 60749-10, Semiconductor devices Mechanical and climatic test methods Part 10: Mechanical shock IEC 60749-12, Semiconductor devices Mechanical and climatic test methods Part 12: Vibration, variable frequency IEC 60749-27, Semiconductor devices Mechanical and climatic test methods Part 27: Electrostatic discharge (ESD)
