1、SPCIFICATION TECHNIQUE CEI IEC TECHNICAL SPECIFICATION TS61945 Premiredition Firstedition 200003 Circuitsintgrs Agrmentdunelignedefabrication Mthodologiedanalysetechnologique etdedfaillance Integratedcircuits Manufacturinglineapproval Methodologyfortechnologyandfailureanalysis Numroderfrence Referen
2、cenumber IEC/TS61945:2000Numrosdespublications Depuisle1erjanvier1997,lespublicationsdelaCEI sontnumrotespartirde60000. Publicationsconsolides Lesversionsconsolidesdecertainespublicationsde laCEIincorporantlesamendementssontdisponibles. Parexemple,lesnumrosddition1.0,1.1et1.2 indiquentrespectivement
3、lapublicationdebase,la publicationdebaseincorporantlamendement1,etla publicationdebaseincorporantlesamendements1 et2. Validitdelaprsentepublication LecontenutechniquedespublicationsdelaCEIest constammentrevuparlaCEIafinquilreflteltat actueldelatechnique. Desrenseignementsrelatifsladatedereconfir mat
4、iondelapublicationsontdisponiblesdansle CataloguedelaCEI. Lesrenseignementsrelatifsdesquestionsltudeet destravauxencoursentreprisparlecomittechnique quiatablicettepublication,ainsiquelalistedes publicationstablies,setrouventdanslesdocumentsci dessous: SitewebdelaCEI* CataloguedespublicationsdelaCEI
5、Publiannuellementetmisjour rgulirement (Catalogueenligne)* BulletindelaCEI DisponiblelafoisausitewebdelaCEI* etcommepriodiqueimprim Terminologie,symbolesgraphiques etlittraux Encequiconcernelaterminologiegnrale,lelecteur sereporteralaCEI60050: VocabulaireElectro techniqueInternational (VEI). Pourles
6、symbolesgraphiques,lessymboleslittraux etlessignesdusagegnralapprouvsparlaCEI,le lecteurconsulteralaCEI60027: Symboleslittraux utiliserenlectrotechnique,laCEI60417:Symboles graphiquesutilisablessurlematriel.Index,relevet compilationdesfeuillesindividuelles, etlaCEI60617: Symbolesgraphiquespourschmas
7、 * Voiradressesitewebsurlapagedetitre. Numbering Asfrom1January1997allIECpublicationsare issuedwithadesignationinthe60000series. Consolidatedpublications ConsolidatedversionsofsomeIECpublications includingamendmentsareavailable.Forexample, editionnumbers1.0,1.1and1.2refer,respectively,to thebasepub
8、lication,thebasepublicationincor poratingamendment1andthebasepublication incorporatingamendments1and2. Validityofthispublication ThetechnicalcontentofIECpublicationsiskept underconstantreviewbytheIEC,thusensuringthat thecontentreflectscurrenttechnology. Informationrelatingtothedateofthereconfirmatio
9、n ofthepublicationisavailableintheIECcatalogue. Informationonthesubjectsunderconsiderationand workinprogressundertakenbythetechnical committeewhichhaspreparedthispublication,aswell asthelistofpublicationsissued,istobefoundatthe followingIECsources: IECwebsite* CatalogueofIECpublications Publishedyea
10、rlywithregularupdates (Onlinecatalogue)* IECBulletin AvailablebothattheIECwebsite*and asaprintedperiodical Terminology,graphicalandletter symbols Forgeneralterminology,readersarereferredto IEC60050:InternationalElectrotechnicalVocabulary (IEV). Forgraphicalsymbols,andlettersymbolsandsigns approvedby
11、theIECforgeneraluse,readersare referredtopublicationsIEC60027: Lettersymbolsto beusedinelectricaltechnology ,IEC60417: Graphical symbolsforuseonequipment.Index,surveyand compilationofthesinglesheets andIEC60617: Graphicalsymbolsfordiagrams. * Seewebsiteaddressontitlepage.SPCIFICATION TECHNIQUE CEI I
12、EC TECHNICAL SPECIFICATION TS61945 Premiredition Firstedition 200003 Circuitsintgrs Agrmentdunelignedefabrication Mthodologiedanalysetechnologique etdedfaillance Integratedcircuits Manufacturinglineapproval Methodologyfortechnologyandfailureanalysis Commission Electrotechnique Internationale Interna
13、tionalElectrotechnicalCommission Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue IEC2000Droitsdereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttrereproduiteni utilisesousquelqueformequecesoitetparaucunprocd, lectroniqueoumcanique,ycomprislaphotocopieet
14、les microfilms,sanslaccordcritdelditeur. Nopartofthispublicationmaybereproducedorutilizedin anyformorbyanymeans,electronicormechanical, includingphotocopyingandmicrofilm,withoutpermissionin writingfromthepublisher. InternationalElectrotechnicalCommission 3,ruedeVarembGeneva,Switzerland Telefax:+4122
15、9190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CODEPRIX PRICECODE L2 TS61945 CEI:2000 SOMMAIRE Pages AVANTPROPOS .4 Clause 1 Domainedapplicationetobjet . 8 2 Rfrencesnormatives 10 3 Terminologie 10 4 Typesdanalysetechnologique 10 4.1 Premierdegr:Examenvisuelgnral(essaiAT1). 12 4.2 Seconddegr:
16、Examenvisuelapprofondi(essaiAT2). 14 4.3 Troisimedegr:ExamendtaillauMEBsousfortgrossissement(essaiAT3) . 14 4.4 Quatrimedegr:Analysedeconstruction(essaiAT4) . 16 4.5 Cinquimedegr:Essaiscomplmentaires(essaiAT5) 18 5 Analysededfaillance(essaiAT6) 20 5.1 But 20 5.2 Moyens. 20 5.3 Description . 20TS6194
17、5 IEC:2000 3 CONTENTS Page FOREWORD 5 Clause 1 Scopeandobject . 9 2 Normativereferences. 11 3 Terms 11 4 Classificationoftechnologyanalysis 11 4.1 Firstlevel:Generalvisualinspection(AT1test) 13 4.2 Secondlevel:Detailedvisualinspection(AT2test) . 15 4.3 Thirdlevel:ScanningElectronMicroscopeexaminatio
18、nunderlargemagnification (AT3test) . 15 4.4 Fourthlevel:Constructionanalysis(AT4test) . 17 4.5 Fifthlevel:Complementarytests(AT5test). 19 5 Failureanalysis(AT6test) . 21 5.1 Objective 21 5.2 Resources 21 5.3 Description . 214 TS61945 CEI:2000 COMMISSIONLECTROTECHNIQUEINTERNATIONALE _ CIRCUITSINTGRS
19、AGRMENTDUNELIGNEDEFABRICATION Mthodologiedanalysetechnologiqueetdedfaillance AVANTPROPOS 1) LaCEI(CommissionlectrotechniqueInternationale)estuneorganisationmondialedenormalisation composedelensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIa pourobjetdefavoriserlacooprationinte
20、rnationalepourtouteslesquestionsdenormalisationdansles domainesdellectricitetdellectronique.Aceteffet,laCEI,entreautresactivits,publiedesNormes internationales.Leurlaborationestconfiedescomitsdtudes,auxtravauxdesquelstoutComitnational intressparlesujettraitpeutparticiper.Lesorganisationsinternationa
21、les,gouvernementalesetnon gouvernementales,enliaisonaveclaCEI,participentgalementauxtravaux.LaCEIcollaboretroitement aveclOrganisationInternationaledeNormalisation(ISO),selondesconditionsfixesparaccordentreles deuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniques
22、reprsentent,danslamesure dupossible,unaccordinternationalsurlessujetstudis,tantdonnquelesComitsnationauxintresss sontreprsentsdanschaquecomitdtudes. 3) Lesdocumentsproduitsseprsententsouslaformederecommandationsinternationales.Ilssontpublis commenormes,spcificationstechniques,rapportstechniquesougui
23、desetagrscommetelsparles Comitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnationauxdelaCEIsengagentappliquerde faontransparente,danstoutelamesurepossible,lesNormesinternationalesdelaCEIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormedelaCEIetlanormenationa
24、leourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcernantlemarquagecommeindicationdapprobationetsaresponsabilit nestpasengagequandunmatrielestdclarconformelunedesesnormes. 6)Lattentionestattiresurlefaitquecertainsdeslmentsdelaprsentespcificationte
25、chniquepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour responsabledenepasavoiridentifidetelsdroitsdepropritetdenepasavoirsignalleurexistence. LatcheprincipaledescomitsdtudesdelaCEIestllaborationdesNormes internationales.Exceptionnellement,uncomitdtude
26、speutproposerlapublicationdune spcificationtechnique lorsquendpitdemaintsefforts,laccordrequisnepeuttreralisenfaveurdela publicationduneNormeinternationale,ou lorsquelesujetenquestionestencoreencoursdedveloppementtechniqueouquand, pouruneraisonquelconque,lapossibilitdunaccordpourlapublicationduneNor
27、me internationalepeuttreenvisagepourlavenirmaispasdanslimmdiat; Lesspcificationstechniquesfontlobjetdunnouvelexamentroisansauplustardaprsleur publicationafindedciderventuellementdeleurtransformationenNormesinternationales. LaCEI61945,quiestunespcificationtechnique,attablieparlesouscomit47A: Circuits
28、intgrs,ducomitdtudes47delaCEI:Dispositifssemiconducteurs. Letextedecettespcificationtechniqueestissudesdocumentssuivants: Projetdenqute Rapportdevote 47A/523/CDV 47A/555/RVC Lerapportdevoteindiqudansletableaucidessusdonnetouteinformationsurlevoteayant aboutilapprobationdecettespcificationtechnique.T
29、S61945 IEC:2000 5 INTERNATIONALELECTROTECHNICALCOMMISSION _ INTEGRATEDCIRCUITS MANUFACTURINGLINEAPPROVAL Methodologyfortechnologyandfailureanalysis FOREWORD 1) TheIEC(InternationalElectrotechnicalCommission)isaworldwideorganizationforstandardizationcomprising allnationalelectrotechnicalcommittees(IE
30、CNationalCommittees).TheobjectoftheIECistopromote internationalcooperationonallquestionsconcerningstandardizationintheelectricalandelectronicfields.To thisendandinadditiontootheractivities,theIECpublishesInternationalStandards.Theirpreparationis entrustedtotechnicalcommittees;anyIECNationalCommittee
31、interestedinthesubjectdealtwithmay participateinthispreparatorywork.International,governmentalandnongovernmentalorganizationsliaising withtheIECalsoparticipateinthispreparation.TheIECcollaboratescloselywiththeInternational OrganizationforStandardization(ISO)inaccordancewithconditionsdeterminedbyagre
32、ementbetweenthe twoorganizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmattersexpress,asnearlyaspossible,an internationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitteehasrepresentation fromallinterestedNationalCommittees. 3) Thedocumentsproducedhavetheformofrecomme
33、ndationsforinternationaluseandarepublishedintheform ofstandards,technicalspecifications,technicalreportsorguidesandtheyareacceptedbytheNational Committeesinthatsense. 4)Inordertopromoteinternationalunification,IECNationalCommitteesundertaketoapplyIECInternational Standardstransparentlytothemaximumex
34、tentpossibleintheirnationalandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalorregionalstandardshallbeclearly indicatedinthelatter. 5)TheIECprovidesnomarkingproceduretoindicateitsapprovalandcannotberenderedresponsibleforany equipmentdeclaredtobeinconformitywithoneofi
35、tsstandards. 6)AttentionisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethesubject ofpatentrights.TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. ThemaintaskofIECtechnicalcommitteesistoprepareInternationalStandards.In exceptionalcircumstances,atechn
36、icalcommitteemayproposethepublicationofatechnical specificationwhen therequiredsupportcannotbeobtainedforthepublicationofanInternationalStandard, despiterepeatedefforts,or thesubjectisstillundertechnicaldevelopmentorwhere,foranyotherreason,thereisthe futurebutnoimmediatepossibilityofanagreementonanI
37、nternationalStandard. Technicalspecificationsaresubjecttoreviewwithinthreeyearsofpublicationtodecide whethertheycanbetransformedintoInternationalStandards. IEC61945,whichisatechnicalspecification,hasbeenpreparedbysubcommittee47A: Integratedcircuits,ofIECtechnicalcommittee47:Semiconductordevices. The
38、textofthistechnicalspecificationisbasedonthefollowingdocuments: Enquirydraft Reportonvoting 47A/523/CDV 47A/555/RVC Fullinformationonthevotingfortheapprovalofthistechnicalspecificationcanbefoundin thereportonvotingindicatedintheabovetable.6 TS61945 CEI:2000 CettepublicationatrdigeselonlesDirectivesI
39、SO/CEI,Partie3. Lecomitadcidquelecontenudecettepublicationneserapasmodifiavant2003. Acettedate,lapublicationsera reconduite; supprime; remplaceparuneditionrvise,ou amende.TS61945 IEC:2000 7 ThispublicationhasbeendraftedinaccordancewiththeISO/IECDirectives,Part3. Thecommitteehasdecidedthatthecontents
40、ofthispublicationwillremainunchangeduntil 2003.Atthisdate,thepublicationwillbe reconfirmed; withdrawn; replacedbyarevisededition,or amended.8 TS61945 CEI:2000 CIRCUITSINTGRS AGRMENTDUNELIGNEDEFABRICATION Mthodologiedanalysetechnologiqueetdedfaillance 1 Domainedapplicationetobjet Cettespcificationtec
41、hniquedcritlamthodologiedanalysetechnologiqueetdedfaillance aucoursdelafabricationdescircuitsintgrs. Avecuneapprocheprenantenconsidrationledegrdecomplexitdestechniquesetdes moyensmettreenoeuvre,laprsentespcificationtechniquedonneuneclassificationdes diffrentesanalysestechnologiquesdontpeuventfairelo
42、bjetlessemiconducteursetdfinit pourchaquedegr: lobjectifpoursuivi(oubut); lesobservationseffectuer; lesoutilsettechniquesqui,dansltatactueldestechnologiesdisponibles,permettent gnralementdatteindrecesobjectifs. Lanalysetechnologiqueapourbutdedterminerlaconstitutionduncomposantpardes observationsutilisantdesmoyensdontlepouvoirdersolutionestprogressifavecledegr danalyseconsidr. Ellepermetdautrepartdedtectertouteanomaliesusceptibledaffe
