QJ 831B-2011 航天用多层印制电路板通用规范.pdf

相关资源

QJ 831A-1998 航天用多层印制电路板通用规范.pdf

SIS SS CECC 23100-1986 Sectional specification Single and double sided printed boards with plain holes《分规范 有平孔的单双面印制电路板》.pdf

KS C IEC 60326-10-2003 Printed boards－Part 10：Specification for flex-rigid double-sided printed boards with through connections《印制电路板 第10部分 有贯穿连接的弯曲刚性双面印制电路板规范》.pdf

SIS SS CECC 23200-800-1986 Capability detail specification Single and double sided printed boards with plain holes《能力详细规范 有平孔的单双面印制电路板》.pdf

SIS SS CECC 23100-800-1987 Capability detail specification Single and double sided printed boards with plain holes《能力详细规范 有平孔的单双面印制电路板》.pdf

SIS SS CECC 23200-1986 Sectional specification Single and double sided printed boards with plated-through holes《分规范 有金属化孔的单双面印制电路板》.pdf

EN 123700-1996 en Sectional Specification Flex-Rigid Double Sided Printed Boards with Through Connections《分规范 带贯通连接的弯曲刚性双面印制电路板》.pdf

DIN EN 123700-1997 Sectional specification - Flex-rigid double sided printed boards with through connections German version EN 123700 1996《分规范 带贯通连接的弯曲刚性双面印制电路板》.pdf

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