1、MILITARY HANDBOOK . ELECTRONIC RELIABILITY DESIGN HANDBOOK NO DELlVERABLE DATA REQUIRED BY THIS DOCUMENT .GLOBAL ENGINEERING DOCUMENTS 2625 So.Hickory St. Santa Ana, CA 92707 Obtained From (71 4)540-9870: (800)854-7179 I RELI J THIS DOCUMENT CONTAINS - PAGES. f “ . . . “ Provided by IHSNot for Resal
2、eNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-334 VOL I RE W 9999970 003564b O MIL-HDBK-338 15 OCTOBER 1984 DEPARTMENT OF DEFENSE WASHINGTON DC 20301 ELECTRONIC RELIABILITY DESIGN HANDBOOK MIL-HDBK-338 1, This standardization handbook was developed by the Department
3、of Defense in accordance with established procedures and is approved for use by all Departments and Agencies of the Department of Defense. 2. This pub1 icati on was approved 15 October 1984 for pri nti ng and inclusion in the military standardization handbook series. 3. Every effort has been made to
4、 reflect the latest information on electronic reliability design techniques. It is the intent to review this handbook periodically to insure its completeness and currency. 4. Beneficial comments (recommendations, addi ti ons , del eti ons and any pertinent data which may be of use in improving this
5、docunent should be addressed to: Comnander , Rune Air Deve1 opment Center, AFSC, ATTN: RBE-2, Griffiss Air Force Base, New York 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter, Provided by IHSNot for R
6、esaleNo reproduction or networking permitted without license from IHS-,-,-“ - MIL-HDBK-338 VOL II RE W 7777770 O35677 2 W MIL-HDBK-338 15 OCTOBER 1984 a PARAGRAPH 1.0 SCOPE TABLE OF CONTENTS PAGE 1-1 1.1 GENERAL INFORMATION 1-2 1.1 1 HISTORY OF COMPONENT RELIABILITY 1-3 1.1.1.1 1NTRODUC.TION 1-3 1 1
7、.1.2 VACUUM TUBE ERA (1940 - 1950) 1-3 1.1.1.3 THE RELIABfL ITY DECADE AND THE EMER- 1-4 1 I. 1.4 THE DECADE OF THE INTEGRATED 1-7 1.1.1.5 DECADE OF THE LARGE SCALE INTEGRATED 1-9 GENCE OF THE TRANSISTOR (1950 - 1960) CIRCUIT (1960 - 1970) CIRCUIT (LSI) (1970 - 1980) GRATED CIRCUITS (VLSI) AND VERY
8、HIGH SPEED INTEGRATED CIRCUITS (VHSIC) (1980) 1.1.1.7 EPILOGUE 1-12 REFERENCES 1-12 1.1.2 NEED FOR RELIABLE COMPONENTS 1-14 1.1.2.1 INTRODUCTION 1-14 1.1.2.2 COMPONENT SAFETY 1-14 1.1.2.4 CRITIClL FUNCTIONS APPLICATIONS 1-16 1.1.2.5 LIFE LICLE COMPONENT COST 1-16 1.1.3 PRESENT STATE OF THE ART 1-18
9、1.1.3.1.1 CLASSES OF SEMICONDUCTOR 1-18 1.1.3.2 SEMICONDUCTOR DEVICE MATERIALS AND 1-20 PROCESSING 1.1.3.2.1 PHOTOFABRICATION 1-20 1.1.3.2.2 PHOTOLITHOGRAPHY 1-22 1.1.3.3 PACKAGING 1-24 1.1.3.4 TESTING OF ELECTRONIC PARTS 1-25 REFERENCES 1-28 1.1.4.1 VHSIC 1-29 1.1.4.2 OTHER NEW TECHNOLOGIES 1-31 .
10、REFERENCES 1-35 1.1.1.6 THE DECADE OF VERY LARGE SCALE INTE- 1-11 1.1.2.3 NON-REPAIRABLE EQUIPMENT SITUATIONS 1-15 1.1.3.1 SEMICONDUCTOR TECHNOLOGY AND MATERIALS 1- 18 DEVICES 1.1.3.2.3 FILM TYPE INTEGRATED CIRCUITS 1-22 1.1.4 FUTURE TRENDS 1-29 2. O REFERENCED DOCUMENTS 2-1 2.1 ISSUES OF DOCUMENTS
11、“-2 - 1 3.0 DEFINITIONS 4.0 RELIABILITY THEORY 4.1 INTRODUCTION 4.1.1 DEFINITIONS 3-1 4-1 4-1 4-1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-HDBK-338 VOL II R m 9999970 0035698 4 MIL-HDBK-338 15 OCTOBER 1984 TABLE OF CONTENTS (Cont I d ) PA
12、RAGRAPH RmABILITY THEORY (Cont d) 4.2 PROBABILITY DISTRIBUTIONS 4.2.1 GENERAL 4.2.2 DISTRIBUTIONS USED IN RELIABILITY 4.2.2.1 EXPONENTIAL DISTRIBUTION 4.2.2.3 WEIBULL DISTRIBUTION 4.2.2.4 GAMMA DISTRIBUTION 4.2.3.1 CONFIDENCE LEVELS FOR THE MEAN OF AN 4.2.2.2 LOG-NORMAL DISTRIBUTION 4.2.3 CONFIDENCE
13、 INTERVALS EXPONENTIAL DISTRIBUTION 4,2.4 STATISTICAL QUALITY CONTROL 4.3 TEMPERATURE DEPENDENCE OF FAILURE RATE 4.3.1 ARRHENIUS MODEL 4.3.2 EYRING MODEL 4.3.3 ACTIVATION ENERGY REFERENCES 5.0 COMPONENT RELIABILITY DESIGN.CONSIDERATIONS 5.1 PART SELECTION AND CONTROL 5.1 1 PART CONTROL 5.1 . 2 STAND
14、ARD PART SELECTION 5.1.3 PART APPROVAL 5.1 . 2.1 MRAP/SRAP 5.1.3.1 PART JUSTIFICATION 5.1.3.2 PART APPLICATION 5.1 . 3.3 PART PARAMETERS 5.1 . 4 CRITICAL PARTS 5.1.5 FAILURE RATE PREDICTION 5.1.5.1 MIL-HDBK-217 5.2 PARTS SELECTION GUIDELINES 5.2.1 MICROCIRCUITS 5.2.1.1 SELECTION GUIDELINES 5.2.1.2 A
15、PPLICATION CONSIDERATIONS 5.2.1 . 3 APPLICATION NOTES FOR COMMONLY USED 5.2.1.4 APPLICATION DATA FOR COMMONLY USED 5.2.1 . 5 APPLICATION DATA FOR COMMONLY USED LINEAR ICs DIGITAL MICROCIRCUITS 5.2.2 LSI MICROCIRCUITS 5.21.6 MICROPROCESSORS, MICRNOMP BIT-SLICE PROCESSORS REFERENCES DISCRETE SEMICONDU
16、CTOR DEVICES 5.2.2.1 INTRODUCTION 5.2.2.2 DEVICE SELECTION 5.2.2.3 GENERAL APPLICATION DATA 5.2.2.4 DERATING UTERS AND REFERENCES PAGE 4-2 4-2 4-4 4-5 4-6 4-7 4-12 4-12 4-14 4-14 4-17 4-17 4-17 4-18 4-19 5-1 5-1 5-1 5-3 5-5 5-6 5-6 5-7 5-7 5-7 5-10 5-10 5-12 5-12 5-12 5-17 5-38 5-51 5-61 5-64 5-74 5
17、-75 5-75 5-75 5-75 5-92 5- 102 iv Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-PIIL-HDBK-338 VOL II RE 7779770 0035b77 b m. MIL-HDBK-338 15 OCTOBER 1984 TABLE OF CONTENTS (Cont d) PARAGRAPH 5.0 COMPONENT RELIABILITY DESIGN CONSIDERATIONS (Contd) 5
18、.2.3 RESISTORS 5.2.3.1 INTRODUCTION 5.2.3.2 SELECTION 5.2.3.3 GENERAL APPLICATION DATA 5.2.3.4 MIL-R-19, RESISTORS, VARIABLE, WIRE- MOUND (LOW OPERATING TEMPERATURE (STYLE RA) 5b2.3.5 MIL-R-22, RESISTORS, VARIABLE, WIRE- WOUND, (POWER TYPE) (STYLE RP) (UN- ENCLOSED) (POWER TYPE) (STYLE RW) POSITION
19、(STYLE RV) (POWER TYPE) (STYLE RD. UNINSULATED) 5.2.3.6 MIL-R-26, RESISTORS, FIXED, WIREWOUND 5,2.3.7 MIL-R-94, RESISTORS, VARIABLE, COM- 5.2.3.8 MIL-R-11804, RESISTORS, FIXED, FILM 5.2.3.9 MIL-R-12934, RESISTORS; VARIABLE, WIRE- WOUND, PRECISION (STYLE RR) 5.2.3.10 MIL-R-18546, FIXED, WIREWOUND (PO
20、WER 5.2,3.11 MIL-R-22097, RESISTORS, VARIABLE, NON- 5.2.3.12 MIL-R-23285, RESISTORS, VARIABLE, NON- 5.2.3.13 MIL-R-27208, RESISTORS, VARIABLE, WIRE- 5.2.3.14 MIL-R-39002, RESISTORS, VARIABLE, WIRE- 5.2.3.15 MIL-R-39005, RESISTORS, FIXED, WIRE TYPE, CHASSIS MOUNTED) (STYLE RE) WIREWOUND (ADJUSTMENT T
21、YPE) (STYLE RJ) WIREWOUND (STYLE RVC) WOUND (ADJUSTMENT TYPE) (STYLE RT) WOUND, SEMIPRECISION (STYLE RK) WOUND (ACCURATE) ESTABLISHED REL IABIL- ITY (STYLE RBR) 5.2.316 MIL-R-39007, RESISTORS, FIXED, WIRE- WOUND (POWER TYPE), ESTABLISHED RELIA- BILITY (STYLE RWR) 5.2.3.17 MIL-R-39008, RESISTORS, FIX
22、ED, COMPO- SITION (INSULATED) ESTABLISHED RELIABIL- ITY (STYLE RCR) WOUND (POWER TYPE, CHASSIS MOUNTED) ESTABLISHED RELIABILITY (STYLE RER) 5.2.3.18 MIL-R-39009, RESISTORS, FIXED, WIRE- 5.2.3.19 MIL-R-39015, RESISTORS, VARIABLE, WIRE- WOUND (LEAD SCREW .ACTUATED) ESTABLISHED RELIABILITY (STYLE RTR)
23、(INSULATED), ESTABLISHED RELIABILITY STYLE RLR) WIREWOUND, PRECISION (STYLE RQ) 5.2.3.20 MIL-R-39017, RESISTORS, FIXED, FILM, 5.2.3.21 MIL-R-39023, RESISTORS, VARIABLE, NON- PAGE 5- 103 5- 103 5- 103 5- 108 5-116 5-118 5-119 5- 120 5- 121 5- 122 5-123 5- 124 5-125 5- 127 5- 128 5- 129 5- 130 5-131 5
24、- 132 5- 133 5- 134 5- 136 V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-338 VOL II RE W 7779970 0035700 7 MIL-HDBK-338 15 OCTOBER 1984 TABLE OF CONTENTS (Contd) PARAGRAPH PAGE COlVONENT RELIABILITY DESIGN CONSIDERATIONS (Contd) 5. 2.3.2
25、2 MIL-R-39035, RESISTORS, VARIABLE, NON- 5-137 WIREWOUND (LEAD-SCREW ACTUATED) ESTA- 5.2.3.23 MIL-R-55182, RESISTORS, FIXED, FILM, 5-1 39 5.2.3.24 MIL-R-55342, RESISTORS, FIXED, FILM, 5-140 5.2.3.25 MIL-R-83401, RESISTOR NETWORKS, FIXED, 5-141 5.2.3.26 MIL-T-23648, THERMISTOR (THERMALLY SEN- 5-143 B
26、LISHED RELIABILITY (STYLE RJR) ESTABLISHED RELIABILITY (STYLE RNR) CHIP, ESTABLISHED RELIABILITY FILM (STYLE RZ) SITIVE RESISTOR) INSULATED (STYLE RTH) 5.2.4 CAPACITORS 5-144 5.2.4.1 INTRODUCTION 5- 144 5.2.4.2 CAPACITOR SELECTION 5-146 5.2.4.3 GENERAL APPLICATION CONSIDERATIONS 5- 153 DIELECTRIC (T
27、EMPERATURE COMPENSATION), ESTABISHED RELIABILITY (STYLE CCR) DIELECTRIC (STYLE CV) DIELECTRIC, BUTTON STYLE (STYLE CB) DIELECTRIC (GENERAL PURPOSE) (STYLE CK) TON TYPE, TABULAR TRIMMER) (STYLE PC ) 5.2.4.4 MIL-C-20, CAPACITORS, FIXED, CERAMIC 5-157 5.2.4.5 MIL-C-81, CAPACITORS, VARIABLE, CERAMIC 5-1
28、58 5.2.4.6 MIL-C-10950, CAPACITORS, FIXED, MICA 5- 158 5.2.4.7 MIL-C-11015, CAPACITORS, FIXED CERAMIC 5-158 5.2.4.8 MIL-C-14409, CAPACITORS, VARIABLE (PIS- 5-158 5.2.4.9 MIL-C-19978, CAPACITORS, FIXED PLASTIC 5-159 (OR PAPER-PLASTIC) , DIELECTRIC (HERMETI- CALLY SEALED IN METAL CASES), ESTA- BLISHED
29、 RELIABILITY (STYLE COR) 5.2.4.10 MIL-C-23183, CAPACITORS, FIXED OR VAR- 5-160 IABLE, GAS OR VACUUM DIELECTRIC, CERA“ IC, CERAMIC OR GLASS ENVELOPE (STYPE CG) DIELECTRIC, ESTABLISHED RELIABILITY (STYLE CYR 1 5.2.4.11 MIL-C-23269, CAPACITORS, FIXED, GLASS 5-161 5.2.4.12 ML-C-S%l, CAPACITORS, FIXED, M
30、ICA 5-161 DIELECTRIC, ESTABLISHED RELIABILITY (STYLE CMR) TROLYTIC (SOLID ELECTROLYTE), TANTALUM, ESTABLISHED RELIABILITY (STYLE SCRl 5.2.4.13 MIL-C-39003, CAPACITORS, FIXED, ELEC- 5-161 5.2.4.14 ML-C-39006, CAPACITORS, FIXED,-ELEC- 5-162 TROLYTIC (NON-SOLID ELECTROLYTE) TANTALUM, ESTABLISHED RELIAB
31、ILITY (STYLE CLR ) 5.2.4.15 MIL-C-39014, CAPACITORS, FIXED, CERAMIC 5-164 DIELECTRIC (GENERAL PURPOSE), ESTA- BLISHED RELIABILITY (STYLE CKR) vi Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-L MIL-HDBK-338 VOL II RE“ 9999970 0035703 O MIL-HDBK-338
32、15 OCTOBER 1984 TABLE OF CONTENTS- (Contd) PARAGRAPH PAGE COMPONENT RELIABILITY DESIGN CONSIDERATIONS (Contd) 5.2.4.16 MIL-C-39018, CAPACITORS, FIXED, ELEC- 5-164 TROLYTIC (ALUMINUM OXIDE) (STYLES CU AND CUR), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY LIZED, PAPER PLASTIC FILM OR PLAST
33、IC DI- 5.2.4.17 MIL-C-39022, CAPACITORS, FIXED, METAL- 5-165 ELECTRIC, DIRECT AND ALTERNATING CURRENT (HERMETICALLY SEALED IN METAL CASES), ESTABLfSHED RELIABILITY (STYLE CHR) TANTALUM, ESTABLISHED RELIABILITY (STYLE CWR ) 5.2.4.18 MIL-C-55365, CAPACITORS, CHIP, FIXED, 5-165 5.2.4.19 MIL-C-55514, CA
34、PACITORS, FIXED, PLASTIC 5-166 . (OR METALLIZED PLASTIC) DIELECTRIC, DC (IN NON-METAL CASES), ESTABLISHED RELIA- BILITY (STYLE CFR) LAYER, FIXED, CERAMC DIELECTRIC, ESTABLISHED RELIABILITY (STYLE CDR) 5.2.4.20 MIL-C-55681, CAPACITORS, CHIP, MULTI- 5-166 5.2.4.21 DERATING FACTORS 5-166 5.2.5 MAGNETIC
35、 DEVICES 5-169 5.2.5.1 INTRODUCTION 5-169 5.2.5.2 DEVICE SELECTION 5-169 5.2.5.3 GENERAL APPLICATION CONSIDERATIONS 5-173 5.2.6 RELAYS 5-175 5.2.6.1 INTRODUCTION 5-175 5.2.6.2 DEVICE SELECTION 5-175 5.2.6.3 APPLICATION CONSIDERATIONS 5-177 REFERENCES 5-184 5.2.7 SWITCHES 5- 185 5.2.7.1 INTRODUCTION
36、5- 185 5.2.7.2 SELECTION OF SWITCHES 5- 186 5.2.7.3 APPLICATION CONSIDERATIONS 5-189 5.2.7.4 ENVIRONMENTAL CONSIDERATIONS 5- 191 5.2.7.5 DERATING 5- 193 5.2.8 ELECTRICAL CONNECTORS 5-194 5.2.8.1 INTRODUCTION 5-194 5.2.8.2 SELECTION OF CONNECTORS 5- 194 5.2.8.3 DERATING REQUIREMENTS 5-204 5.2.9 ELECT
37、RON TUBES 5-206 5.2.9.1 INTRODUCTION 5-206 5.2.9.2 ELECTRON TUBE SELECTION CRITERIA - 5-206 5.2.9.3 FAILURE MODES AND MECHANISMS 5-206 5.2.10 CABLES 5- 208 5.2.10.1 INTRODUCTION 5-208 5.2:lO. 2 SELECTION 5-208 “ 5.2.10.3 SELECTION- AND APPLICATION CONSIDERATIONS 5-209 Provided by IHSNot for ResaleNo
38、 reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-338 VOL II RE M 7779770 0035702 2 M MIL-HDBK-338 15 OCTOBER 1984 TABLE OF CONTENTS (Contd) I PARAGRAPH PAGE COWONENT RELIABILITY DESIGN CONSIDERATIONS (Contd) - 5.2.11 ELECTRO OPTICS./FIBER OPTICS 5.2.11.1 INTRODUCTION 5.2.1
39、1.2 SPECIFICATION AND STANDARDS REFERENCES 5.2.12 PRINTED CIRCUITRY 5.2.12.1 INTRODUCTION 5.2.12.2 PKlNIED CIRCUIT DESIGN AND TREATMENT 5.2.12.3 COMPONENT MOUNTING (SOLDERING) 5.2.12.4 PRINTED WIRING BOARD SELECTION 5.2.13.1 INTRODUCTION 5.2.13.2 SEM PROGRAM OBJECTIVES 5.2.13.3 SEM SELECTION AND USE
40、 CRITERIA 5.2.13.4 SEM PROGRAM REQUIREMENTS 5.2.13.5 QUALITY AND RELIABILITY REFERENCES CRITERIA 5.2.13 STANDARD ELECTRONIC MODULE (SEM) PROGRAM 6.0 APPLICATIONS GUIDELINES 6.1 ENVIRONMENTAL CONSIDERATIONS 6.1.1 ENVIRONMENTAL RESISTANCE 6.1 . 2 ENVIRONMENTAL FACTORS 6.1.2.1 TEMPERATURE EFFECTS 6 . 1
41、 . 2.2 MECHANICAL SHOCK 6.1.2.3 HUMIDITY AND SALT 6.1.2.4 ELECTROMAGNETIC AND NUCLEAR RADIATION 6.1.2.5 OTHER STRESS FACTORS 6.1.3 ENVIRONMENTAL RESISTANCE PROVISIONS 6.1. 3.1 THERMAL PROTECTION 6.1.3.2 MECHANICAL PROTECTION 6.1.3.3 SHOCK AND VIBRATION PROTECTION 6.1.3.4 HUMIDITY, SALT AIR, SAND AND
42、 DUST PROTECTION 6.1.3.5 RADIATION PROTECTION 6.1.4 GENERAL PACKAGING CONSIDERATIONS 6.1 . 5 PRODUCTION ENVIRONMENTAL STRESS 6 . 1 . 6 ELECTROSTATIC DISCHARGE CONTROL (ESD 1 6.1.6.1 INTRODUCTION 6.1.6.2 ESDS PART FAILURE TYPE, FAILURE MODES 6.1.6.3 FAILURE MODES AND MECHANISMS 6.1.6.4 ESD SENSITIVIT
43、Y TESTING (VZAP TESTS) 6.1.6.5 ESD PROTECTIVE MATERIALS AND EQUIPMENT 6.1.6.6 DESIGN PRECAUTIONS FOR ESD 6.1.6.7 ESD CONTROL PROGRAM 6,l. 6 . 8 SOURCE MATERIAL REFERENCES AND FAILURE MECHANISMS 5-211 5-211 5-212 5-214 5-215 5-21 5 5-215 5-218 5-219 5-221 5-221 5-221 5-221 5-222 5-222 5-223 6-1 6-1 6
44、-1 6-1 6-4 6-5 6-5 6-5 6-6 6-6 6-8 6-10 6-10 6-10 6-11 6-12 6-13 6-13 6-13 6-14 6-16 6-16 6-22 6-23 6-24 6-24 viii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I MIL-HDBK-338 VOL II RE 7777770 0035703 LI a lo MIL-HDBK-338 15 OCTOBER 1984 TABLE OF
45、CONTENTS (Contd) PARAGRAPH 6.0 ENVrRONMENTAL DESIGN (Contd) PAGE 6.2 DESIGN GUIDELINES FOR RELIABLE CIRCUITS 6-25 6.2.1 ELECTRICAL DERATING 6-25 6.2.2 THERMAL DESIGN 6-32 6.2.2.1 RELIABILITY IMPLICATIONS OF TEMPERATURE 6-33 6.2.2.2 HEAT AND HEAT TRANSFER THEORY 6-35 6.2.3 GUIDELINES FOR ACHIEVING RE
46、LIABLE THERMAL DESIGNS 6-38 6.2.3.1 LIMITATIONS ON COOLING TECHNIQUES 6-38 6.2.3.2 PLACEMENT/LAYOUT OF PARTS 6-39 6.2.3,3 MOUNTING PARTS 6-41 6.2.4 MANAGEMENT OF THERMAL DESIGNS 6-44 REFERENCES 6-47 6.2.5 LIMITATIONS OF CURRENT STATE-OF-THE-ART 6-46 7.0 SPECIFICATION AND CONTROL DURING ACQUISITION .
47、 7-1 7.1 PART SCREENING 7.1.1 THEORY AND PURPOSE OF SCREENING 7.1.2 DESIGN OF COMPONENT SCREENS 7.1.2.1 ESTABLISHED RELIABILITY (ER) PASSIVE 7.1.2.2 JAN, JANTX, JANTXV, AND JANS SEMI- 7.1.2.3 QUALITY/RELIABILITY LEVELS OF MICRO- PARTS CONDUCTORS CIRCUITS 7.1.3 SCREENING COST EFFECTIVENESS 7.2.1 TEST
48、ING CONCEPTS 7.2 MICROCIRCUIT TESTING 7.2.1.1 LOGIC INTEGRITY TESTS 7.2.1.2 A.C. TESTS 7.2.1.3 D.C. (STATIC) TESTS 7.2.2 MEMORY TEST1 NG 7.2.3 TESTING OF LSI RANDOM LOGIC 7.3 MANAGEMENT FOR RELIABLE COMPONENTS 7.3.1 PART SELECTION AND CONTROL 7.3.2 RELIABILITY PROGRAMS 7-1 7-1 7-3 7-4 7-6 7-15 7-18
49、7-27 7-27 7-28 7-28 7-28 7-29 7-32 7-34 7-35 7-35 I - 8.0 LOGISTIC SUPPORT 8-1 8.1 STORAGE 8.1.1 GENERAL STORAGE CONSIDERATIONS FOR PARTS 8.1.2 MICROCIRCUIT STORAGE CHARACTERISTICS 8.1.3 DISCRETE SEMICONDUCTORS STORAGE CHARACTERISTICS 8.1.5 CAPACITOR STORAGE CHARACTERISTICS 8.1.6 INDUCTIVE DEVICE STORAGE CHARACTERISTICS 8.1.7 PRINTED CIRCUIT STORAGE CHARACTERISTICS 8.1.8 PROTECTION ME7HOD
