1、Designation: D5109 12Standard Test Methods forCopper-Clad Thermosetting Laminates for Printed WiringBoards1This standard is issued under the fixed designation D5109; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last
2、revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope*1.1 These test methods cover the procedures for testingcopper-clad laminates produced from fiber-reinforced, thermo-setting po
3、lymeric materials intended for fabrication of printedwiring boards.1.2 The procedures appear in the following sections:Procedure SectionReferenced Documents 2Conditioning 4Dielectric Breakdown Voltage Parallel to Laminations 13Dimensional Instability 19Dissipation Factor 14Flammability Rating Test 1
4、6Flexural Strength, Flatwise at Elevated Temperature 15Flexural Strength, Flatwise at Room Temperature 15Oven Blister Test 17Peel Strength Test at Elevated Temperature 10Peel Strength Test at Room Temperature 9Permittivity 14Pin Holes in Copper Surface 20Purity of Copper 5Scratches in Copper Surface
5、 21Solder Float Test 8Solvent Resistance 7Surface Resistivity 11Volume Resistivity 11Terminology 3Thickness a positive value is growth.100 after etch LW! 2 O 2 LW!#O 2 LW!# (2)19.5.2 Compute the arithmetic average from the three setsof “after etch” measurements. This average is the test measure-ment
6、 for dimensional instability due to etch on one specimen.Repeat the calculation for each specimen. The average of thethree test measurements is the test result for dimensionalchange due to etch for the lengthwise direction.19.5.3 For the crosswise direction dimensional instabilityafter etch, repeat
7、the calculations of 19.5.1 and 19.5.2 usingappropriate crosswise direction dimensions.19.5.4 For the after etch and bake dimensional instabilityvalues repeat the calculations of 19.5.1 and 19.5.2 using thedimensional data obtained after etch and bake on each speci-men and in each of the two directio
8、ns.19.6 ReportReport the following information:19.6.1 Complete identification of the laminate,19.6.2 The lengthwise dimensional instability after etch, %,19.6.3 The lengthwise dimensional instability after etch andbake, %,19.6.4 The crosswise dimensional instability after etch, %,19.6.5 The crosswis
9、e dimensional instability after etch andbake, %, and19.6.6 Any deviations from the procedures set forth in thesetest methods.19.7 Precision and Bias:19.7.1 This test has been in use for many years, but noinformation has been presented to ASTM upon which to basea statement of precision. No activity h
10、as been planned todevelop such information.19.7.2 This test method has no bias because the value fordimensional instability is determined solely in terms of this testmethod itself.20. Keywords20.1 copper-clad laminate; dielectric breakdown parallel tolaminations; dimensional instability; dissipation
11、 factor; fiberreinforced; flexural strength; industrial laminate; laminate;oven blister; peel strength; permittivity; printed circuit boards;printed wiring boards; rigid laminate; solder float; surfaceresistivity; thermoset; thickness variation; trace; twist; volumeresistivity; warp; water absorptio
12、nFIG. 2 Target MarksD5109 128SUMMARY OF CHANGESCommittee D09 has identified the location of selected changes to this specification since the last issue,D5109 99R04, that may impact the use of this specification. (Approved November 1, 2012.)(1) The conditioning standard D6054 has been replaced by the
13、conditioning standard D618.(2) Non mandatory terms have been eliminated.ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of
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