1、 AMERICAN NATIONAL STANDARD FOR TELECOMMUNICATIONS ATIS-0600333.2013 GROUNDING AND BONDING OF TELECOMMUNICATIONS EQUIPMENT As a leading technology and solutions development organization, ATIS brings together the top global ICT companies to advance the industrys most-pressing business priorities. Thr
2、ough ATIS committees and forums, nearly 200 companies address cloud services, device solutions, emergency services, M2M communications, cyber security, ehealth, network evolution, quality of service, billing support, operations, and more. These priorities follow a fast-track development lifecycle fr
3、om design and innovation through solutions that include standards, specifications, requirements, business use cases, software toolkits, and interoperability testing. ATIS is accredited by the American National Standards Institute (ANSI). ATIS is the North American Organizational Partner for the 3rd
4、Generation Partnership Project (3GPP), a founding Partner of oneM2M, a member and major U.S. contributor to the International Telecommunication Union (ITU) Radio and Telecommunications sectors, and a member of the Inter-American Telecommunication Commission (CITEL). For more information, visit . AME
5、RICAN NATIONAL STANDARD Approval of an American National Standard requires review by ANSI that the requirements for due process, consensus, and other criteria for approval have been met by the standards developer. Consensus is established when, in the judgment of the ANSI Board of Standards Review,
6、substantial agreement has been reached by directly and materially affected interests. Substantial agreement means much more than a simple majority, but not necessarily unanimity. Consensus requires that all views and objections be considered, and that a concerted effort be made towards their resolut
7、ion. The use of American National Standards is completely voluntary; their existence does not in any respect preclude anyone, whether he has approved the standards or not, from manufacturing, marketing, purchasing, or using products, processes, or procedures not conforming to the standards. The Amer
8、ican National Standards Institute does not develop standards and will in no circumstances give an interpretation of any American National Standard. Moreover, no person shall have the right or authority to issue an interpretation of an American National Standard in the name of the American National S
9、tandards Institute. Requests for interpretations should be addressed to the secretariat or sponsor whose name appears on the title page of this standard. CAUTION NOTICE: This American National Standard may be revised or withdrawn at any time. The procedures of the American National Standards Institu
10、te require that action be taken periodically to reaffirm, revise, or withdraw this standard. Purchasers of American National Standards may receive current information on all standards by calling or writing the American National Standards Institute. Notice of Disclaimer American National Standard for
11、 Telecommunications ATIS-0600311, DC Power Systems Telecommunications Environment Protection; and American National Standard for Telecommunications ATIS-0600313, Electrical Protection for Telecommunications Central Offices and Similar Type Facilities. It is not intended that the requirements of this
12、 standard supersede any pertinent requirements of any other standard, but rather that it provide practical and supplemental information on bonding and grounding of telecommunications equipment consolidated in a single document. Although it represents a consensus of the subject matter experts in bond
13、ing and grounding of telecommunications equipment, this standard is in no way intended to guarantee against damage or injury that may result from events such as lightning, ac or dc power faults, EMI, ESD or other similar occurrences. There are five annexes to this standard. All annexes are informati
14、ve and are not considered a part of this standard. ANSI guidelines specify two categories of requirements: mandatory and recommendation. The mandatory requirements are designated by the word shall and recommendations by the word should. Where both a mandatory requirement and a recommendation are spe
15、cified for the same criterion, the recommendation represents a goal currently identifiable as having distinct compatibility or performance advantages. Suggestions for improvement of this document are welcome. They should be sent to the Alliance for Telecommunications Industry Solutions, NIPP, 1200 G
16、 Street NW, Suite 500, Washington, DC 20005. At the time of consensus on this document, STEP, which was responsible for its development, had the following roster: K. Biholar, STEP Chair Alcatel-Lucent B. Pipkin, STEP Vice-Chair AT 2. Define and promote the use of harmonized grounding and bonding ter
17、minology; and 3. Define baseline grounding and bonding requirements. 1.3 Application This standard applies to the grounding and bonding of network telecommunications equipment installed in central offices and other similar facilities. 2 Normative References The following standards contain provisions
18、 that, through reference in this text, constitute provisions of this American National Standard. At the time of publication, the editions indicated were valid. All standards are subject to revision, and parties to agreements based on this American National Standard should investigate the possibility
19、 of applying the most recent editions of the standards indicated below. ATIS-0600313.2008, Electrical Protection for Telecommunications Central Offices and Similar Type Facilities.1ATIS-0600334.2008, Electrical Protection of Communications Towers and Associated Structures.1ANSI/IEEE, Standard Dictio
20、nary of Electrical and Electronics Terms.2ANSI/NFPA 70-2011, National Electrical Code.31ATIS documents are available from the Alliance for Telecommunications Industry Solutions, 1200 G Street N.W., Suite 500, Washington, DC 20005. 2This document is available from the Institute of Electrical and Elec
21、tronics Engineers (IEEE). 3NFPA 70 is available from the National Fire Protection Association, One Batterymarch Park, Quincy, MA 02269. ATIS-0600333.2013 2 3 Definitions, Abbreviations, Acronyms, typically, a connection to earth obtained by a grounding electrode. 3.1.12 grounded conductor: A system
22、or circuit conductor that is intentionally grounded. 3.1.13 grounding conductor: A conductor used to connect equipment or the grounded circuit of a wiring system to a grounding electrode or electrodes. 3.1.14 grounding electrode conductor: The conductor used to connect the grounding electrode to the
23、 equipment grounding conductor, to the grounded conductor, or to both, of the circuit at the service equipment or at the source of a separately derived system. 3.1.15 grounding electrode system: The group of all grounding electrodes used in a facility, interconnected among themselves and connected t
24、o the building principal ground (BPG). ATIS-0600333.2013 3 3.1.16 horizontal equalizer: A conductor used for the bonding together of vertical risers when more than one such risers are used. 3.1.17 incidental ground: An unplanned grounding connection. 3.1.18 isolated bonding network (IBN): A bonding
25、network that has a single point of connection (SPC) to either the common bonding network or another isolated bonding network. All IBNs considered herein will have a connection to earth via the SPC. 3.1.19 mesh-BN: A bonding network in which all associated equipment frames, racks, and cabinets, and u
26、sually the dc power return conductor, are intentionally bonded together as well as at multiple points to the CBN. Consequently, the mesh-BN augments the CBN. 3.1.20 mesh-IBN: A type of IBN in which the components of the IBN (e.g., equipment frames) are interconnected to form a mesh-like structure. T
27、his may, for example, be achieved by multiple interconnections between cabinet rows, or by connecting all equipment frames to a metallic grid (a “bonding mat”) extending beneath the equipment. The bonding mat is, of course, insulated from the adjacent CBN. If necessary, the bonding mat could include
28、 vertical extensions, resulting in an approximation to a Faraday cage. The spacing of the grid is chosen according to the frequency range of the electromagnetic environment. 3.1.21 return: Circuit conductor nearest ground potential in dc power systems. A common example is the battery return. 3.1.22
29、single point connection (SPC): The unique location where an IBN is connected to the CBN, usually to the grounding electrode system or its extension. 3.1.23 single point connection window (SPCW): The interface or transition region between an IBN and the CBN, typically envisaged as a sphere with a dia
30、meter of 2 m (6 feet). 3.1.24 single point connection bus bar (SPCB): A copper bus bar located entirely within the SPCW and serving as a means for bonding the metallic conductors associated with the IBN to ground. After passing through the SPCW, these conductors must remain insulated from the CBN; n
31、o additional paths to ground, intentional or unintentional, are permitted inside the IBN. 3.1.25 star-IBN: A type of IBN in which equipment or clusters of equipment are interconnected to form a star- or tree-like structure. 3.1.26 vertical ground riser (VGR): A copper conductor (or sometimes buildin
32、g structural steel) to which the BPG and all FGBs are bonded. 3.1.27 Mesh-IBN (ground mat): A series of copper conductors meshed together using the cable raceway above the equipment as the connection conductor, which are in turn connected to a peripheral connector that terminates on the main telecom
33、munications ground bar (TMGB). Intersection between equipment rows are no greater than seven 3.1.28 TMGB-PANI: Main telecommunication ground bar with noise separation. It discriminates different noise present in a telecommunication room. 3.2 Abbreviations, Acronyms, and 2. Either the requirement in
34、5.2.1.1 or the requirement in 5.2.1.2 has been met. 5.8 Reinforced Concrete Buildings Buildings constructed of reinforced concrete shall have a VGR as described in this standard. The reinforcing metal bars shall generally not be treated as part of the grounding system on older buildings. Consequentl
35、y, the BPG, VGR, and FGBs shall not be bonded to the rebars of older buildings unless there is positive proof that the rebar assembly was specifically constructed to form a continuous structure suitable for grounding. Note that in the latest editions of the NEC (see Article 250.52A3), for new buildi
36、ngs, the rebar assembly of the foundation and/or the concrete slab of the lowest floor is required to be continuous through traditional rebar-tying methods, and is required to be used as a grounding electrode. 5.9 Cable Entrance Facility Grounding Cable entrance facilities shall be grounded in accor
37、dance with the applicable requirements of ATIS-0600313.2008, Electrical Protection for Telecommunications Central Offices and Similar Type Facilities. ATIS-0600333.2013 8 5.10 Apparatus Containing Protector Units A distributing frame, splice cabinet, or similar apparatus containing protector units s
38、hall be bonded to the BPG. Protectors shall be grounded in accordance with the applicable requirements of ATIS-0600313.2008. 6 AC Power Systems 2. Isolation transformer; 3. Current loop adapter; or 4. Fiber-optic links. 8.4.3 Links from Remote Facilities Incoming communication links from remote faci
39、lities such as other central offices shall be grounded in accordance with 5.9. ATIS-0600333.2013 22 Figure 12 - Example of Communication Link between IBN and Mesh-BN Equipment 9 Grounding Conductors & Associated Hardware 9.1 Conductor Sizing 9.1.1 General Requirements Grounding conductors shall be s
40、ized to withstand without damage any fault current likely to be imposed on them, while facilitating the operation of the overcurrent protective devices employed in the associated circuits. ATIS-0600333.2013 23 9.1.2 Methods for Conductor Sizing A suitable method shall be used to establish the size (
41、cross-sectional area) of grounding conductors. Information that may be considered when establishing the size of grounding conductors, including Direct Current Equipment Ground (DCEG) conductors, is given in Annex C (informative) and Annex D (informative). 9.1.3 Minimum Size of Direct Current Equipme
42、nt Ground (DCEG) Conductors The minimum size for a DCEG conductor shall be that specified in Table 3, except that a DCEG conductor for an equipment frame, cabinet, or enclosure shall not be smaller than No.6 AWG. Table 3 - Minimum Size Requirements for DCEG Conductors Rating or Setting of Automatic
43、Overcurrent Protective Device in Circuit Ahead of Equipment, Not Exceeding (Amperes) Minimum Size of Copper Equipment Grounding Conductor 12 same size as the battery and battery return feeders 15 14 AWG 20 12 AWG 30 10 AWG 40 10 AWG 60 10 AWG 100 8 AWG 200 6 AWG 300 4 AWG 400 3 AWG 500 2 AWG 600 1 A
44、WG 800 1/0 AWG 9.1.4 Vertical Ground Riser (VGR) & Horizontal Equalizer The conductor size for the VGR and the horizontal equalizer shall be the larger one resulting from application of the following criteria: 1. 2000 circular mils per linear foot (750 kcmil maximum). 2. The conductor size for the V
45、GR and the horizontal equalizer should be at least 1/0 AWG. 9.2 Grounding Hardware 9.2.1 Grounding Connectors, Terminals, & Associated Hardware Connectors used with grounding conductors shall be listed for their intended purpose by a nationally recognized testing laboratory. Compression-type, two-hole, connectors are required for terminating grounding conductors. Any hardware used to terminate or secure grounding conductors shall be installed in accordance with the manufacturers instructions.
