1、Recognized as anAmerican National Standard (ANSI)The Institute of Electrical and Electronics Engineers, Inc.345 East 47th Street, New York, NY 10017-2394, USACopyright 1992 by the Institute of Electrical and Electronics Engineers, Inc.All rights reserved. Published 1992. Printed in the United States
2、 of America.ISBN 1-55937-232-XNo part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher.IEEE Std 1101.2-1992 (R2008)IEEE Standard for Mechanical Core Specifications for Conduction-Cooled EurocardsS
3、ponsorMicroprocessor and Microcomputer Standards Subcommitteeof theIEEE Computer SocietyReaffirmed 31 January 2008Approved 6 December 2001IEEE-SA Standards BoardReaffirmed 2 May 2002Approved 20 January 1993American National Standards InstituteAbstract: Mechanical characteristics of conduction-cooled
4、 versions of Eurocard-based circuit cardassemblies are described. This specification is applicable to, but not limited to, the VMEbusstandard, aninternal interconnect (backplane) bus intended for connecting processing elements totheir immediatefundamental resources. The aim is to ensure mechanical i
5、nterchangeability ofconduction-cooled circuitcard assemblies in a format suitable for military and rugged applicationsand to ensure their compatibilitywith commercial, double-height, 16 mm, Eurocard chassis.Keywords: dimensions, card slot requirements, circuit card assemblies, conduction-cooled,mech
6、anical interchangeability, Eurocard-basediiIEEE Standards documents are developed within the Technical Committees of the IEEE Societies and the StandardsCoordinating Committees of the IEEE Standards Board. Members of the committees serve voluntarily and withoutcompensation. They are not necessarily
7、members of the Institute. The standards developed within IEEE represent aconsensus of the broad expertise on the subject within the Institute as well as those activities outside of IEEE whichhave expressed an interest in participating in the development of the standard.Use of an IEEE Standard is who
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9、 subject to changebrought about through developments in the state of the art and comments received from users of the standard. EveryIEEE Standard is subjected to review at least once every five years for revision or reaffirmation. When a document ismore than five years old, and has not been reaffirm
10、ed, it is reasonable to conclude that its contents, although still ofsome value, do not wholly reflect the present state of the art. Users are cautioned to check to determine that they havethe latest edition of any IEEE Standard.Comments for revision of IEEE Standards are welcome from any interested
11、 party, regardless of membership affiliationwith IEEE. Suggestions for changes in documents should be in the form of a proposed change of text, together withappropriate supporting comments.Interpretations: Occasionally questions may arise regarding the meaning of portions of standards as they relate
12、 tospecific applications. When the need for interpretations is brought to the attention of IEEE, the Institute will initiateaction to prepare appropriate responses. Since IEEE Standards represent a consensus of all concerned interests, it isimportant to ensure that any interpretation has also receiv
13、ed the concurrence of a balance of interests. For this reasonIEEE and the members of its technical committees are not able to provide an instant response to interpretation requestsexcept in those cases where the matter has previously received formal consideration.Comments on standards and requests f
14、or interpretations should be addressed to:Secretary, IEEE Standards Board445 Hoes Lane, P.O. Box 1331Piscataway, NJ 08855-1331USAIEEE Standards documents are adopted by the Institute of Electrical and Electronics Engineers without regard towhether their adoption may involve patents on articles, mate
15、rials, or processes. Such adoption does not assumeany liability to any patent owner, nor does it assume any obligation whatever to parties adopting the standardsdocuments.iiiForeword(This foreword is not a part of IEEE Std 1101.2-1992, IEEE Standard for Mechanical Core Specifications for Conduction-
16、CooledEurocards.)This document describes mechanical characteristics for conduction-cooled versions of Eurocard-based circuit cardassemblies. It is intended that this specification will be applicable to, but not limited to, the VMEbus standard, aninternal interconnect (backplane) bus intended for con
17、necting processing elements to their immediate fundamentalresources.This standard is intended to be a companion standard to other standards, which include IEEE Std 1101.1-1991,Mechanical Core Specifications for Microcomputers Using IEC 603-2 Connectors; IEEE Std 1014-1987, IEEEStandard for a Versati
18、le Backplane Bus: VMEbus; and MIL-C-55302/131 and MIL-C-55302/132, connectorspecifications for module and backplane.Other uses for the standard are in no way prohibited.At the time this document was approved, the members of the working group were as follows:Kim Clohessy, Chair J. AbdinoorNaresh Ager
19、walWayne AndersonMichael BlomquistClint BrownBarry BurnsidesDave CaserzaMichael CrawfordThomas CurnanAllan G. FosterWill HamsherBen La PointeMichael MunroDoug PattersonMike SchmidtGene SchrammMichael ThompsonJohn Van RheeTres WileyDuncan C. YoungThe following persons were on the balloting committee
20、that approved this document for submission to the IEEEStandards Board:Ray S. AldermanR. E. AllenJohn C. BrightwellKim ClohessyWilhelm P. EvertzGordon ForceDavid B. GustavsonFrank HornEdgar JacquesErnst H. KristiansenRollins LinserMichael MunroeElwood ParsonsDonald PavlovichRichard C. PedersonShlomo
21、Pri-TalMichael G. ThompsonJoseph ToyEike WaltzAndrew WilsonJoel WittJanusz ZalewskiivWhen the IEEE Standards Board approved this standard on June 18, 1992, it had the following membership:Marco W. Migliaro, Chair Donald C. Loughry, Vice Chair Andrew G. Salem, Secretary Dennis BodsonPaul L. BorrillCl
22、yde CampDonald C. FleckensteinJay Forster*David F. FranklinRamiro GarciaThomas L. HannanDonald N. HeirmanBen C. JohnsonWalter J. KarplusIvor N. KnightJoseph Koepfinger*Irving KolodnyD.N. “Jim” LogothetisLawrence V. McCallT. Don Michael*John L. RankineWallace S. ReadRonald H. ReimerGary S. RobinsonMa
23、rtin V. SchneiderTerrance R. WhittemoreDonald W. Zipse*Member EmeritusAlso included are the following nonvoting IEEE Standards Board liaisons:Satish K. AggarwalJames BeallRichard B. Engelman David E. SoffrinStanley WarshawPaula M. KeltyIEEE Standards Project EditorvCLAUSE PAGE1. Scope.11.1 Mechanica
24、l Characteristics 11.2 Environmental Requirements. 12. Purpose13. References.24. Special Word Usage, Definitions, and Acronyms 24.1 Special Word Usage. 24.2 Definitions 24.3 Acronyms. 35. Characteristics.35.1 Introduction 35.2 CCA Arrangement . 35.3 Card Pitch. 45.4 Card Dimensions 45.5 Pinout . 105
25、.6 Optional Features . 106. Chassis Interface .106.1 Card Connectors. 106.2 Card Guide Slots 117. Materials, Processes, and Parts .117.1 Fungus Resistance 117.2 Hazardous Components . 117.3 Conduction Plate Material . 118. Bibliography11Copyright 1992 IEEE All Rights Reserved 1IEEE Standard for Mech
26、anical Core Specifications for Conduction-Cooled Eurocards1. ScopeThis standard defines the mechanical requirements for Eurocard-based conduction-cooled circuit card assemblies(CCAs).1.1 Mechanical CharacteristicsThe standard defines dimensions and card slot requirements for conduction-cooled, CCAs
27、of the double-height,nominal 160 mm, Eurocard format.1.2 Environmental RequirementsThe prime use of CCAs developed according to this specification is for environments with extreme temperature,shock, and vibration. However, there are other applications for which this specification is suitable.P1156.1
28、 31 deals with environmental conditions and should be used to specify environmental requirements.2. PurposeThe purpose of this standard is to ensure mechanical interchangeability of conduction-cooled CCAs in a formatsuitable for military and rugged applications. The CCAs shall also be compatible wit
29、h commercial, double-height,160mm Eurocard chassis.1 The numbers in brackets correspond to those of the references in Section 3; when preceded by a “B,” they correspond to those in the Bibliographyin Section 8.2 Copyright 1992 IEEE All Rights ReservedIEEE Std 1101.2-1992 IEEE STANDARD FOR MECHANICAL
30、 CORE SPECIFICATIONS3. ReferencesThe following documents form a part of this standard to the extent referenced herein. The revisions of these documentsto be used are those current at the commencement of a design activity. In the event of conflict between the documentsreferenced herein and the conten
31、ts of this standard, the contents of this standard will be considered a supersedingrequirement.1 IEEE Std 1014-1987, IEEE Standard for a Versatile Backplane Bus: VMEbus (ANSI). 2 IEEE Std 1101.1-1991, IEEE Standard for Mechanical Core Specifications for Microcomputers Using IEC 603-2Connectors (ANSI
32、). 3 P1156.1, Environmental Specifications for Computer Modules (Draft No. 3.2, Nov. 19, 1991).24 MIL-C-55302/131, Connectors, Plug, Electrical, Printed Circuit Subassembly and Accessories: Right Angle, PinContact, 64 or 96 Contact Positions for Printed Wiring Board (.100 inch spacing).35 MIL-C-5530
33、2/132, Connectors, Plug, Electrical, Printed Circuit Subassembly and Accessories: Receptacle, SocketContacts, Straight Through, 64 or 96 Contact Positions for Printed Wiring Board (.100 inch spacing).6 MIL-P-55110, Printed Wiring Boards.7 MIL-STD-454, Standard General Requirements for Electronic Equ
34、ipment.4. Special Word Usage, Definitions, and Acronyms4.1 Special Word Usagemay. A key word that indicates flexibility of choice with no implied preference.shall. A key word indicating a mandatory requirement. Designers shall implement all such mandatory requirements toensure interoperability with
35、other products that meet this specification.should. A key word indicating flexibility of choice with a strongly preferred implementation. The phrase it isrecommended is used interchangeably with the key word should.4.2 Definitionsheight: By convention, the height axis is parallel to the connectors.
36、(Refer to Fig 1.)depth: By convention, the depth axis is perpendicular to the connectors in the plane of the PWB. (Refer to Fig 1.)width: By convention, the width axis is perpendicular to the PWB. (Refer to Fig 2.)bottom edge: By convention, that edge of the module that is seen counterclockwise from
37、 the faceplate when viewingthe component side.2 Numbers with a “P” prefix are IEEE-authorized standards projects. For information about obtaining drafts, contact the IEEE Computer Society,1730 Massachusetts Ave., NW, Washington, DC 20036-1903, USA.3 MIL publications are available from the Director,
38、U.S. Navy Publications and Printing Service, Eastern Division, 700 Robbins Avenue,Philadelphia, PA 19111, USA.Copyright 1992 IEEE All Rights Reserved 3FOR CONDUCTION-COOLED EUROCARDS IEEE Std 1101.2-1992back edge: By convention, the edge of the module closest to the ponent side: By convention, the s
39、ide of the module seen furthest from row A of the connector. On single-sidedmodules, this is the side populated with circuit components. This is the right side when looking at an IEEE 1101.1 2system through the front door.faceplate: By convention, the edge of the module that is furthest from the bac
40、kplane, also known as the front panel orfront plane.solder side: By convention, the side of the module opposite to the component side. This is the left side when lookingat an IEEE 1101.1 2 system through the front door.top: By convention, the edge of the module seen clockwise from the faceplate when
41、 viewing the component side. InIEEE 1101.1 2 systems, the P1 connector is closer to the top than the bottom edge.web: That portion of the cold wall that extends between modules to permit heat transfer.4.3 AcronymsANSI American National Standards InstituteCCA circuit card assembly, also referred to a
42、s a moduleDIP dual in-line packageHP horizontal pitchIC integrated circuitPGA pin grid array, a type of integrated circuit packagePWB printed wiring boardVME Versa Module European, modules as defined by IEEE Std 1014-1987 15. Characteristics5.1 IntroductionConduction-cooled CCAs are used wherever co
43、nvection cooling or forced-air cooling is not possible or appropriate.For example, the CCA might consist of a PWB bonded to a conduction plate. The conduction plate is a metallic panelthat conducts heat from CCA components to the edge of the CCA. The conduction plate is a three-dimensional partrequi
44、ring small tolerances to ensure that it does not interfere with component leads and that it provides accuratelocation of the CCA in the chassis card slot.This specification should be used in conjunction with IEEE Std 1101.1-1991 2, which addresses convection-cooledcircuit card assemblies. Specificat
45、ions MIL-C-55302/131 4 and MIL-C-55302/132 5 detail the CCA connectors,connector locating, and assembly information, and are applicable to CCAs built to this specification.This document uses an aluminum thermal management layer bonded to the PCB as the vehicle for describing thespecifications. This
46、document does not require this particular implementation. Other implementations that meet themechanical intermateability specifications are permitted.5.2 CCA ArrangementConduction-cooled CCAs used in rugged and extended temperature environments present certain design challenges.Of prime concern is t
47、he layout of components to ensure effective heat transfer to card edge.A number of principles can be stated that help define the component layout on a conduction-cooled CCA. In general,the heat flow is from the center line of the CCA to the top and bottom edges. Components with a significant dissipa
48、tion4 Copyright 1992 IEEE All Rights ReservedIEEE Std 1101.2-1992 IEEE STANDARD FOR MECHANICAL CORE SPECIFICATIONSshould be placed such that the heat load is distributed evenly along either edge of the CCA and the thermal path to theCCA edge is a minimum length with a maximum cross section of conduc
49、tion plate.Typical implementations of CCAs using this specification incorporate stiffening ribs that run along the height axis.Depending on the end application, one, two, or three stiffening ribs should be positioned between the connector andthe front edge. The best mechanical support is along the edges of the CCA with good support along the stiffening ribs.The heaviest components should be placed along card edges or stiffening ribs. High-dissipation parts have priority atthe card edge.Pin grid array (PGA) devices should be separated to
