1、Recognized as anAmerican National Standard (ANSI)The Institute of Electrical and Electronics Engineers, Inc.345 East 47th Street, New York, NY 10017-2394, USACopyright 1993 by the Institute of Electrical and Electronics Engineers, Inc.All rights reserved. Published 1993. Printed in the United States
2、 of America.IEEE is a registered trademark in the U.S. Patent IEEE Std 896.x, IEEE Standard Backplane BusSpecification for Multiprocessor Architectures: Futurebus+; IEEE Std 1596-1992, IEEE Standard for ScalableCoherent Interface (SCI); IEEE Std 1014-1987, IEEE Standard for a Versatile Backplane Bus
3、: VMEbus; IEEE Std1296-1987, IEEE Standard for a High-Performance Synchronous 32-Bit Bus: MULTIBUS2 II; and IEEE Std 1301-1991, IEEE Standard for a Metric Equipment Practice for MicrocomputersCoordinating Document.This standard is intended to be used as a core specification. It contains the minimum
4、environmental withstandconditions that are applicable to computer modules/circuit boards and all of the components attached to thosemodules. It has been created to provide general environmental withstand conditions for one or more of the previouslylisted computer buses or interconnect standards. It
5、may also apply to electronic equipment in general.1Information on references can be found in clause 4.2MULTIBUS is a registered trademark of Intel Corporation.2 Copyright 1993 IEEE All Rights ReservedIEEE Std 1156.1-1993 IEEE STANDARD FOR MICROCOMPUTERWhile this document was specifically created for
6、 use with IEEE computer bus standards, nothing herein is intended torestrict its use for other applications, where applicable. A supplier and user may agree to more or less restrictiveenvironmental specifications than those listed in this standard. However, if their specifications are less restricti
7、ve thanthose listed herein, neither supplier nor user may claim conformance to this document.3. PurposeThe purpose of this standard is to provide a common set of specifications for physical integrity and environmentalperformance levels for computer modules and their components.It is the responsibili
8、ty of the system designer to evaluate the relationship between this module-level environmentalspecification and the system-level environmental specification for the enclosure that contains the modules. Forexample, in some applications, the modules are conduction cooled and a system-level thermal “mo
9、del” is required todetermine the relationship between the modules heat sink and the system-level cooling medium.4. ReferencesThis standard shall be used in conjunction with the following documents, which form a part of this standard to theextent specified herein. When any of these standards are supe
10、rseded by an approved revision, the latest revision shallapply.ANSI C63.4-1991, American National Standard for Methods of Measurement of Radio-Noise Emissions from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz.3 ANSI C63.12-1987, American National Standard Recommend
11、ed Practice for Electromagnetic Compatibility Limits. ASTM B827-92, Standard Practice for Conducting Mixed Flowing Gas (MFG) Environmental Testing.4ASTM D2863-87, Standard Method for Measuring the Minimum Oxygen Concentration to Support Candle-LikeCombustion of Plastics (Oxygen Index).Federal Commun
12、ications CommiIEC 50, InternationalIEC 68-2-1 (1990), Basic Environmental Testing Procedures, Part 2: Test A: Cold.5 IEC 68-2-2 (1974), Basic Environmental Testing Procedures, Part 2: Test B: Dry heat. IEC 68-2-3 (1969), Basic Environmental Testing Procedures, Part 2: Test Ca: Damp heat, steady stat
13、e. IEC 68-2-6 (1982), Basic Environmental Testing Procedures, Part 2: Test Fc and guidance: Vibration (sinusoidal). IEC 68-2-10 (1988), Basic Environmental Testing Procedures, Part 2: Test J and guidance: Mould growth. IEC 68-2-11 (1981), Basic Environmental Testing Procedures, Part 2: Test Ka: Salt
14、 mist. 3ANSI publications are available from the Sales Department, American National Standards Institute, 11 West 42nd Street, 13th Floor, New York,NY 10036, USA.4ASTM publications are available from the Customer Service Department, American Society for Testing and Materials, 1916 Race Street,Philad
15、elphia, PA 19103, USA.5IEC publications are available from IEC Sales Department, Case Postale 131, 3 rue de Varemb, CH-1211, Genve 20, Switzerland/Suisse. IECpublications are also available in the United States from the Sales Department, American National Standards Institute, 11 West 42nd Street, 13
16、thFloor, New York, NY 10036, USA.Copyright 1993 IEEE All Rights Reserved 3ENVIRONMENTAL SPECIFICATIONS FOR COMPUTER MODULES IEEE Std 1156.1-1993IEC 68-2-13 (1983,) Basic Environmental Testing Procedures, Part 2: Test M: Low air pressure. IEC 68-2-14 (1984), Basic Environmental Testing Procedures, Pa
17、rt 2: Test N: Change of temperature. IEC 68-2-27 (1987), Basic Environmental Testing Procedure, Part 2: Test Ea and guidance: Shock. IEC 68-2-30 (1980), Basic Environmental Testing Procedure, Part 2: Test Db and guidance: Damp heat, cyclic (12 +12 hour cycle). IEC 68-2-34 (1973), Basic Environmental
18、 Testing Procedures, Part 2, Test Fd: Random vibration wide bandGeneralrequirements. IEC 68-2-35 (1973), Basic Environmental Testing Procedures, Part 2: Test Fda: Random vibration wide bandReproducibility High. IEC 68-2-36 (1973), Basic Environmental Testing Procedures, Part 2: Test Fdb: Random vibr
19、ation wide bandReproducibility Medium. IEC 68-2-37 (1973), Basic Environmental Testing Procedures, Part 2: Test Fdc: Random vibration wide bandReproducibility Low. IEC 512-1 (1984), Electromechanical components for electronic equipment; basic testing procedures and measuringmethods, Part 1: General.
20、 IEC 695-2-2 (1991), Fire Hazard Testing, Part 2: Test methods: Section 2: Needle-flame test. IEC 801-2 (1984), Electromagnetic compatibility for industrial-process measurement and control equipment, Part 2:Electrostatic discharge requirements. UL 94-1990, Tests for Flammability of Plastic Materials
21、 for Parts in Devices and Appliances.6These standards shall be used in conjunction with the detail specification of the modules to be tested. The detailspecification prescribes the tests to be used to ensure that the tested modules conform to the performance levels listedherein.5. TerminologyThe ter
22、minology used in this standard is in accordance with that of the International Electrotechnical Vocabulary(IEV)7 and IEC 512-1. The following additional terms shall apply.5.1 Performance levelThe terms listed in the performance levels below are used only as a guide for possible applications. The spe
23、cificenvironmental testing criteria as listed in clauses 6 and 7 and tables 1 and 3 shall apply.6UL publications are available from Underwriters Laboratories, Inc., 333 Pfingsten Road, Northbrook, IL 60062-2096, USA.7IEC 50, International Electrotechnical Vocabulary.4 Copyright 1993 IEEE All Rights
24、ReservedIEEE Std 1156.1-1993 IEEE STANDARD FOR MICROCOMPUTER5.1.1 Performance Level 1:Environment primarily intended for aircraft applications subject to extreme vibration, shock, and temperaturevariations.5.1.2 Performance Level 2:Environment primarily intended for shipboard, subsurface ship, and s
25、hore applications subject to substantial vibration,extreme shock, and temperature variations.5.1.3 Performance Level 3:Environment primarily intended for shipboard, vehicular, and shore applications subject to vibration, shock, andtemperature variations.5.1.4 Performance Level 4:Environment primaril
26、y intended for sheltered applications subject to vibration, corrosion, shock, and temperaturevariations.5.1.5 Performance Level 5:Environment primarily intended for sheltered applications subject to minimal vibration, shock, or temperaturevariations5.2 Sheltered applicationsThese applications are no
27、t directly exposed to rain, wind, or dew.5.3 Performance level qualificationIn order to claim conformance to this standard, the module shall be tested in accordance with the test methodsspecified for the corresponding performance level parameter. It is the intent of this standard that for each defin
28、edperformance level, all the parameters specified within that level shall be met in their entirety. In keeping with thisintent, modules would be able to claim conformance to IEEE 1156.1 Performance Level 1 if they met all the testrequirements. It is insufficient to simply design to these performance
29、 levels.For Performance Levels 1, 2, and 3, the shock and vibration qualification shall be performed with the module mountedusing the module retainers.Qualification to one performance level also qualifies the module to all less demanding levels, i.e., qualification toLevel 3 also carries automatic q
30、ualification to Levels 4 and 5. Similarly, if conformance to Level 1 is achieved, thenconformance to all levels is achieved. Two exceptions to this definition are for the shock test magnitudes for Levels 1and 2 and for the mixed flowing gas corrosion and life testing of Level 4.The intent of this do
31、cument does not preclude one from mixing and matching requirements from among theperformance levels defined in this standard. However, doing so would obligate one to state the requirement and theassociated performance level of compliance. For example, one may claim conformance of a circuit card as O
32、peratingTemperature to IEEE 1156.1 Performance Level 1 and Random Vibration to IEEE 1156.1 Performance Level 2.Another facet of this documents intent is to standardize the values of environmental parameters and their test methodsto assist systems engineers who must integrate modules from various man
33、ufacturers. Deviating from the valuesCopyright 1993 IEEE All Rights Reserved 5ENVIRONMENTAL SPECIFICATIONS FOR COMPUTER MODULES IEEE Std 1156.1-1993specified by this standard shall be construed as using this standard for guidance only, and no conformance to thisstandard may be claimed.5.4 Normal ope
34、rationThe unit operates within certain specifications, as per the individual module document. The particular parameters to bemonitored shall be specified in the relevant module document, for example, electrical noise, mechanical strength,contact resistance, power level, frequency response, voltage b
35、reakdown, functional parameters, etc.5.5 ModuleIn this standard, the term “module” refers to completely assembled computer circuit packs and circuit boards.5.6 ComponentIn this standard, the term “component” refers to a part (resistors, connectors, ICs, guide rails, etc.) that serves as anelement in
36、/on a larger, more complete item such as a module.5.7 Maximum powerAll operating tests shall be performed with the module under test operating at it maximum rate of power consumptionor maximum rate of data throughput.5.8 MountingAny module undergoing testing shall be mounted as it would be typically
37、 mounted for its most common usage. Theparticular parameters to be monitored shall be specified in the relevant module document. For an assembly ofcomponents (i.e., rack, circuit board, connector, and backplane) the system or subsystem manufacturer is responsiblefor the final testing.5.9 Test durati
38、onTiming of the test duration, when applicable, begins after the item under test has achieved stability with regards to thetest parameter.5.10 Initial and final measurementsThe measurements include all measurements that are needed to verify that the module under test meets all aspects ofthe modules
39、detail specification before and after the test procedure for nonoperating tests. The time at which thesedetail specification tests are to be performed is described in the specific IEC environmental test to be used. Foroperating tests listed in table 3, the measurements must also be performed during
40、the test at maximum rated powerlevels at the times suggested in the IEC document. The particular parameters to be monitored shall be specified in therelevant module document. Records of the testing and results of the testing are to be retained by the modulemanufacturer for at least three years after
41、 the last date of module sale.6 Copyright 1993 IEEE All Rights ReservedIEEE Std 1156.1-1993 IEEE STANDARD FOR MICROCOMPUTER5.11 Relevant specificationThe IEC documents cited in this standard refer to the “relevant specification.” For the purpose of this standard, therelevant specification shall be I
42、EEE Std 1156.1-1993. If this standard does not offer complete information, then thedetail specification for the module shall govern.6. Nonoperating environmental conditionsComputer modules/circuit cards and components shall withstand, without damage, the nonoperating environmentalconditions listed i
43、n table 1 and described briefly below. All testing shall be performed without a shipping containerunless otherwise specified.Table 1 Nonoperating conditions6.1 Low temperature (nonoperating/storage)The IEC 68-2-1-Ab test shall be performed to demonstrate compliance with the low temperature withstand
44、requirement for the applicable performance level as shown in table 1. The tests are for 24 h at the applicabletemperatures, as listed in table 1 for the five performance levels.After the specimen is placed in the chamber, the temperature shall be reduced until 55 C, with a tolerance of +0 Cto 5 C, i
45、s reached for Performance Levels 1, 2, and 3.The temperature is to be measured on the module at the location of the largest thermal mass.Test parameterIEC test publicationSeverity or conditionsPerformance level requirements1 2 3 4 5Low temperature 68-2-1-Ab 24 h 55 C 55 C 55 C 40 C 40 CHigh temperat
46、ure 68-2-2-Bb 24 h +125 C +125 C +70 C +65 C +55 CThermalshock68-2-14Test Na 3 min 55 C to+125 C55 C to+85 C55 C to+70 C55 C to+70 C40 C to+70 CHumidity 68-2-30-Db 6 cycles 30 C to65 C95% RH30 C to65 C95% RH30 C to65 C95% RH25 C to55 C93% RH25 C to55 C93% RHShock 68-2-27-Ea 6 ms 100 g 100 g 50 g 30
47、g 15 gSalt fog 68-2-11-Ka 48 h X X X MFG ASTM B-827 14 days X Fungus 68-2-10-J 28 days X X X X Flammability ANSI T1.307 Meet 5 s 5 s 5 s 30 s 30 sESD 801-2 15 kV/150pF X X X X XCopyright 1993 IEEE All Rights Reserved 7ENVIRONMENTAL SPECIFICATIONS FOR COMPUTER MODULES IEEE Std 1156.1-19936.2 High tem
48、perature (nonoperating/storage)The IEC 68-2-1-Bb test shall be performed to demonstrate compliance with the high temperature withstandrequirement for the applicable performance level as shown in table 1. The tests are for 24 h at the applicabletemperatures as listed in table 1 for the five performan
49、ce levels.After the specimen is placed in the chamber, the temperature shall be increased until 125 C, with a tolerance of +5 Cto 0 C, is reached with a transfer time of 3 min for Performance Levels 1 and 2. For Performance Level 3, after thespecimen is placed in the chamber, the temperature shall be increased until 70 C, with a tolerance of +5 C to 0 C,is reached.6.3 Thermal Shock (nonoperating/storage)The IEC 68-2-14-Na test shall be performed to demonstrate compliance with the thermal shock requirement
