1、Recognized as anAmerican National Standard (ANSI)The Institute of Electrical and Electronics Engineers, Inc.345 East 47th Street, New York, NY 10017-2394, USACopyright 1993 by the Institute of Electrical and Electronics Engineers, Inc.All rights reserved. Published 1993. Printed in the United States
2、 of America.IEEE is a registered trademark in the U.S. Patent +1 978 750 8400. Permission to photocopy portions of any individual standard for educationalclassroom use can also be obtained through the Copyright Clearance Center.iiiIntroduction(This introduction is not a part of IEEE Std 1301.3-1992,
3、 IEEE Standard for a Metric Equipment Practice for MicrocomputersConvection-Cooled With 2.5 mm Connectors.)This document describes a metric equipment practice for use with 2.5 mm pitch connectors in accordance withIEC48B (Central Office) 245. It is a sublevel standard to IEEE Std 1301-1991, IEEE Sta
4、ndard for a Metric EquipmentPractice for MicrocomputersCoordination Document.This work was performed under the aegis of the P1396 Combus committee whose selection of a 2.5 mm basedconnection system mandated a new equipment practice and under whose auspices the meetings were held.Development of this
5、standard would have been considerably more difficult and time-consuming were it not for thesuperior ground work laid by the Working Group of the “parent“ documents, IEEE Std 1301-1991 and IEEE Std1301.1-1991. These specifications formed a solid base from which to start.The following is a list of tho
6、se who were members of the P1301.3 Working Group at the time this document wasapproved by the Working Group. Any omissions are unintentional and deeply regretted.Elwood T. Parsons, Chair David Brearley, Jr. (Draft Editor)Charles AdelmanAl AndrukAshmanJay BabichBarnumEd BaulsirBeatyJan BenjaminsBrigh
7、twellRichard CarlsonLuis CastellonErich CoorsJean Jacques DuMontRenee EstesStan EvansJim FedderRichard GoeorgesWill HamsherFrank HomHans Karlsson*Tom KlinefelterOscar KornblumJim KoserBill KubinMike LazarJim LongHeinz PiorunneckMartin PullamDavid RobakWard RudolphGene SchrammJohn StapletonJoe Traino
8、rMac J. Van GelderEike WaltzKeith WeberGerd WekingGary WengerDon WilsonPeter WullfKarl Zell*The P1301.3 Working Group is grateful for the vision and outstanding foundation provided by Hans Karlsson, whounfortunately passed away before the publication of this standard. Under his able leadership, the
9、IEEE 1301 MetricEquipment Practices were conceived, organized, and brought into existence. His dedication, organizational abilities,and friendly persuasive powers were key to this effort and he will be remembered always as the father of the IEEEMetric Equipment Practices.ivThe following persons were
10、 on the balloting committee that approved this document for submission to the IEEEStandards Board:Duane L. AndersonPaul L. BorrillDavid Brearley, Jr.Steven CobbPaul D. CookSourav DuttaR. D. EdwardsWilhelm P. EvertzGordon ForceLarry GilbertFrank HomZoltan R. HunorDavid V. JamesErnst H. KristiansenMic
11、hael E. LeeRollins LinserJoe MacuraChittaranjan MallipeddiJoel MartinezKlaus Dieter MullerJ.D. NicoudElwood ParsonsMira PaukerDonald PavlovichBill RigbyGary S. RobinsonJulio Gonzalez SanzRudolf SchubertRobert StewartDaniel TarrantMichael G. ThompsonRobert TripiJohn Van RheeYoshiaki WakimuraDon Wilso
12、nAndrew WilsonJohn WiseJoel WittOren YuenJanusz ZalewskiWhen the IEEE Standards Board approved this standard on December 3, 1992, it had the following membership:Marco W. Migliaro, Chair Donald C. Loughry, Vice Chair Andrew G. Salem, Secretary Dennis BodsonPaul L. BorrillClyde CampDonald C. Fleckens
13、teinJay Forster*David F. FranklinRamiro GarciaThomas L. HannanDonald N. HeirmanBen C. JohnsonWalter J. KarplusIvor N. KnightJoseph Koepfinger*Irving KolodnyD.N. “Jim“ LogothetisLawrence V. McCallT. Don Michael*John L. RankineWallace S. ReadRonald H. ReimerGary S. RobinsonMartin V. SchneiderTerrance
14、R. WhittemoreDonald W. Zipse*Member EmeritusAlso included are the following nonvoting IEEE Standards Board liaisons:Satish K. AggarwalJames BeallRichard B. Engelman David E. SoffrinStanley WarshawPaula M. KeltyIEEE Standards Project EditorvCLAUSE PAGE1. Overview.11.1 Scope 11.2 Purpose. 11.3 Dimensi
15、ons. 11.4 Coordination dimensions . 11.5 Environmental requirements 21.6 Conformance with this standard 22. References.23. Word usage, definitions, and abbreviations 43.1 Special word usage. 43.2 Definitions 43.3 Abbreviations. 44. Dimensional nomenclature .54.1 Dimensional location nomenclature. 54
16、.2 Dimensional nomenclature, heights. 54.3 Dimensional nomenclature, widths 64.4 Dimensional nomenclature, depths 74.5 Dimensional nomenclature, mounting pitches. 75. General arrangement .86. Subracks 97. Backplane design and mounting positions97.1 Rigidity. 97.2 Dimension 98. Plug-in units 14Annex
17、A (informative) Tolerances with 2.5 mm connector and IEEE 1301 metric equipment.21Copyright 1993 IEEE All Rights Reserved 1IEEE Standard for a Metric Equipment Practice for MicrocomputersConvection-Cooled With 2.5 mm Connectors1. Overview1.1 ScopeThis is a detail standard for subracks, plug-in-units
18、, printed boards, and backplanes to be used in conjunction withIEEE Std 1301-19911 and a 2.5 mm connector in accordance with IEC 48B (Central Office) 245.1.2 PurposeThis standard is an implementation of IEEE Std 1301-1991. This standard may be used with other IEEE Std 1301.xconnector implementations
19、 in the same subrack.1.3 DimensionsAll dimensions in this document are in millimeters in accordance with ISO 1000:1981 and ISO 31-1:1978 unlessotherwise specified.First angle projection has been used throughout this document.1.4 Coordination dimensionsThis standard defines the actual dimensions of a
20、 25 mm metric equipment practice. These actual dimensions arederived from coordination dimensions using the principles of boundary and axis references illustrated in IEEE Std1301-1991 and described in IEC 917 (1988).1 Information on references can be found in clause 22 Copyright 1993 IEEE All Rights
21、 ReservedIEEE Std 1301.3-1992 IEEE STANDARD FOR A METRIC EQUIPMENT PRACTICE FOR MICROCOMPUTERS-Overall dimensions and internal subdivisions are determined by using different increments or mounting pitches(mp1 =25 mm, mp2 = 5 mm, and mp3 = n 0.5 mm). These mounting pitches have been used to derive th
22、e keydimensions given in this standard. They are also used when extending this standard with additional dimensions (wheresuch extensions are permitted) and when alternative positions of piece parts are described. (In such cases, it is obviousthat the relationships between involved dimensions shall b
23、e maintained.)The subscript, C, has been used in this document to indicate coordination dimensions. For example, in IEEE Std 1301-1991, see HC, WC, and DC for cabinet and rack coordination dimensions in figure 12 and in tables 1, 2, and 3, and H2C,W4C, and D10C subrack coordination dimensions in fig
24、ure 18 and in tables 4, 6, 7, and 8.1.5 Environmental requirementsPerformance levels and test criteria can be found in P1156.1. This document lists requirements for environmentalstresses, such as temperature, humidity, shock, vibration, flammability, ESD, fungus, etc. The majority of the teststherei
25、n are based on IEC Publication 68, which is a multipart document covering aspects of environmental testing.1.6 Conformance with this standardConformance with this standard can be claimed provideda) The recommended values are used, orb) Non-preferred values or options shall be agreed between supplier
26、 and user.2. ReferencesThe following publications shall be used in conjunction with this standard. When they are superseded by an approvedrevision, the revision shall apply:ANSI/IPC A-600D-1989, Acceptability of Printed Boards.2ANSI T1.304-1989, American National Standard for Telephone Central Offic
27、e Equipment-Ambient Temperature andHumidity.ANSI T1.307-1990, American National Standard for Telecommunications-Fire Resistance CriteriaPart 1:Ignitability Requirements for Equipment Assemblies, and Fire Spread Requirements for Interconnection Wire andCable Distribution Assemblies.CFR (Code of Feder
28、al Regulations), Title 47: Telecommunications, Part 15J, published by Office of the FederalRegister.3IEC 48B (Central Office) 245, Detail specification for modular two-part connectors for printed boards and backplanes,grid of 2,5 mm (0,098 in) according to IEC 917.4 IEC 50, International Electrotech
29、nical Vocabulary. 2ANSI publications are available from the Sales Department, American National Standards Institute, 11 West 42nd Street, 13th Floor, New York,NY 10036, USA.3CFR publications are available from the Superintendent of Documents, U.S. Government Printing Office, P.O. Box 37082, Washingt
30、on, DC20013-7082, USA.4When published, this document will be designated as IEC 1076-4-100. IEC drafts are available from the IEC Sales Department, Case Postale 131,3 rue de Varemb, CH-1211, Genve 20, Switzerland/Suisse. IEC drafts are also available in the United States from the IEC Department, Amer
31、icanNational Standards Institute, 11 West 42nd Street, 13th Floor, New York, NY 10036, USA.Copyright 1993 IEEE All Rights Reserved 3CONVECTION-COOLED WITH 2.5 mm CONNECTORS IEEE Std 1301.3-1992IEC 68-2-1 (1990), Environmental testing, Part 2: TestsTests A: Cold. IEC 68-2-2 (1974), Environmental test
32、ing, Part 2: TestsTests B: Dry heat. IEC 68-2-6 (1982), Environmental testing, Part 2: TestsTests: Fc and guidance: Vibration (sinusoidal). IEC 68-2-11 (1981), Environmental testing, Part 2: TestsTest Ka: Salt mist. IEC 68-2-27 (1987), Environmental testing, Part 2: TestsTest Ea and guidance: Shock.
33、 IEC 97 (1991), Grid system for printed circuits. IEC 194 (1988), Terms and definitions for printed circuits. IEC 348 (1978), Safety requirements for electronic measuring apparatus. IEC 512, Electromechanical components for electronic equipment; basic testing procedures and measuring methods. IEC 70
34、7 (1981), Methods of test for the determination of the flammability of solid electrical insulating materials whenexposed to an igniting source. IEC 916 (1988), Mechanical structures for electronic equipment. Terminology. IEC 917 (1988), Modular order for the development of mechanical structures for
35、electronic equipment practices. IEC 917-0 (1989), Modular order for the development of mechanical structures for electronic equipment practices,Part 0: Guide for the users of Publication 917. IEC 950 (1991), Safety of information technology equipment including electrical business equipment. P1156.1,
36、 Environmental Specifications for Computer Modules, Draft No. 4.1, Aug. 25, 1992.5IEEE Std 1301-1991, IEEE Standard for a Metric Equipment Practice for MicrocomputersCoordinationDocument.6 IEEE Std 1301.2-1993, IEEE Recommended Practice for the Implementation of a Metric Equipment Practice (IEEEStd
37、1301). ISO 31-1:1978, Quantities and units of space and time.7 ISO 128:1982, Technical drawingsGeneral principles of presentation. ISO 1000:1981, SI units and recommendations for use of their multiples and of certain other units. ISO 1101:1983, Technical drawingsGeometric tolerancingTolerancing char
38、acteristics and symbolsExamplesof indication and interpretation. UL 1459-1987, Telephone Equipment.8UL 1863-1990, Communication Circuit Accessories.UL 1950-1989, Information Technology Equipment Including Electrical Business Equipment.5This IEEE authorized standards project was not approved by the I
39、EEE Standards Board at the time this standard went to press. For informationabout obtaining drafts, contact the IEEE Computer Society, 1730 Massachusetts Ave., NW, Washington, DC 20036-1903, USA.6IEEE publications are available from the Institute of Electrical and Electronics Engineers, Service Cent
40、er, 445 Hoes Lane, P.O. Box 1331,Piscataway, NJ 08855-1331, USA.7ISO publications are available from the ISO Central Secretariat, Case Postale 56, 1 rue de Varemb, CH-1211, Genve 20, Switzerland/Suisse. ISOpublications are also available in the United States from the Sales Department, American Natio
41、nal Standards Institute, 11 West 42nd Street, 13thFloor, New York, NY 10036, USA.8 UL publications are available from Underwriters Laboratories, Inc., 333 Pfingsten Road, Northbrook, IL 60062-2096, USA.4 Copyright 1993 IEEE All Rights ReservedIEEE Std 1301.3-1992 IEEE STANDARD FOR A METRIC EQUIPMENT
42、 PRACTICE FOR MICROCOMPUTERS-3. Word usage, definitions, and abbreviations3.1 Special word usage3.1.1 mayA key word indicating flexibility of choice with no implied preference. The phrase is optional is used interchangeablywith the key word may.3.1.2 shallA key word indicating a mandatory requiremen
43、t. Designers shall implement such mandatory requirements to ensuremechanical interchangeability and to claim conformance with the specification. The phrase is required is usedinterchangeably with the key word shall.3.1.3 shouldA key word indicating flexibility of choice with a strongly preferred imp
44、lementation. The phrase is recommended andthe word preferred are used interchangeably with the key word should.3.2 Definitions3.2.1 aperture dimension: The usable height, width, or depth between features.3.2.2 coordination dimension: A reference dimension used to coordinate mechanical interfaces. Th
45、is is not amanufacturing dimension with a tolerance,3.2.3 mounting pitch (mp): The interval of distance between parts or assemblies in a given space.3.2.4 n: Multiplier having integer values of 1, 2, 3 ., n3.2.5 reference plane: A theoretical plane, having neither thickness nor tolerance, used to se
46、parate space. See 4.1 inIEEE Std 1301-1991.3.2.6 system unit (SU): The equipment reference increment mounting pitch, 1 SU = 25.0 mm, for height, width, anddepth.3.3 AbbreviationsThe following abbreviations are used in this document:D depth nomenclatureEMI electromagnetic interferenceH height nomencl
47、atureI/O input/outputmm millimetermp mounting pitchPB printed boardSU system unitW width nomenclatureCopyright 1993 IEEE All Rights Reserved 5CONVECTION-COOLED WITH 2.5 mm CONNECTORS IEEE Std 1301.3-19924. Dimensional nomenclature4.1 Dimensional location nomenclatureThe following location key is use
48、d to specify which document is responsible for assigning values to the defineddimensional parameters:1) IEEE Std 1301 Specified Dimensions. IEEE Std 1301-1991 contains all the generic dimensions that are notconnector-related.2) IEEE Std 1301.3 Implementation Parameters. This standard contains all of
49、 the connector-dependentdimensions for the defined printed board plug-in unit. Generic dimensions specified in IEEE Std 1301-1991are given in this standard for reference only.3) Application-Specific Parameters. Application-specific parameters are product-related and have not beenassigned values by IEEE Std 1301-1991 or by this standard. In order to design and manufacture products,these parameters must be specified. Recommendations made in P1301.2 provide a list of these parameters.4.2 Dimensional nomenclature, heightsFollowing is a list identifying abbreviatio
