1、ANSI INCITS 368-2003for Information Technology Parallel Interconnect Performance (PIP)ANSIINCITS 368-2003ANSIINCITS 368-2003American National Standardfor Information Technology Parallel Interconnect Performance (PIP)SecretariatInformation Technology Industry Council (ITI)Approved June 5, 2003America
2、n National Standards Institute, Inc.AbstractThis standard defines the electrical measurement techniques and acceptable performance limits for vari-ous test parameters on the collection of wires, connectors, and circuits that form the electrical path be-tween SCSI devices. This document specifies the
3、 details of the measurement methodology to minimizethe error in results from different electrical testing laboratories. Details are given at each stage of testingincluding calibration, fixturing and sample preparation.Approval of an American National Standard requires review by ANSI that therequirem
4、ents for due process, consensus, and other criteria for approval havebeen met by the standards developer.Consensus is established when, in the judgement of the ANSI Board ofStandards Review, substantial agreement has been reached by directly andmaterially affected interests. Substantial agreement me
5、ans much more thana simple majority, but not necessarily unanimity. Consensus requires that allviews and objections be considered, and that a concerted effort be madetowards their resolution.The use of American National Standards is completely voluntary; theirexistence does not in any respect preclu
6、de anyone, whether he has approvedthe standards or not, from manufacturing, marketing, purchasing, or usingproducts, processes, or procedures not conforming to the standards.The American National Standards Institute does not develop standards andwill in no circumstances give an interpretation of any
7、 American NationalStandard. Moreover, no person shall have the right or authority to issue aninterpretation of an American National Standard in the name of the AmericanNational Standards Institute. Requests for interpretations should beaddressed to the secretariat or sponsor whose name appears on th
8、e titlepage of this standard.CAUTION NOTICE: This American National Standard may be revised orwithdrawn at any time. The procedures of the American National StandardsInstitute require that action be taken periodically to reaffirm, revise, orwithdraw this standard. Purchasers of American National Sta
9、ndards mayreceive current information on all standards by calling or writing the AmericanNational Standards Institute.American National StandardPublished byAmerican National Standards Institute, Inc.25 West 43rd Street, New York, NY 10036Copyright 2003 by Information Technology Industry Council (ITI
10、)All rights reserved.No part of this publication may be reproduced in anyform, in an electronic retrieval system or otherwise,without prior written permission of ITI, 1250 Eye Street NW, Washington, DC 20005. Printed in the United States of AmericaCAUTION: The developers of this standard have reques
11、ted that holders of patents that may berequired for the implementation of the standard disclose such patents to the publisher. However,neither the developers nor the publisher have undertaken a patent search in order to identifywhich, if any, patents may apply to this standard. As of the date of pub
12、lication of this standardand following calls for the identification of patents that may be required for the implementation ofthe standard, no such claims have been made. No further patent search is conducted by the de-veloper or publisher in respect to any standard it processes. No representation is
13、 made or impliedthat licenses are not required to avoid infringement in the use of this standard.iContentsPageForeword viiiIntroduction xii1 Scope .12 References .22.1 Overview .22.2 Approved references .22.3 References under development 22.4 Informative references 23 Definitions .33.1 Terms 33.2 Ac
14、ronyms 93.3 Symbols and abbreviations .93.4 Keywords 103.5 Conventions 113.6 Specification of measurement equipment .114 Overview .134.1 General .134.2 Open vs. closed systems related to this standard .134.3 Structural considerations .134.3.1 SCSI interconnects 134.3.2 SCSI passive interconnect topo
15、logy 144.3.3 Interconnect sub-assemblies, transition regions, and bulk cable .144.3.4 Interconnect assemblies 144.3.5 Relationship between SE and DF in this document .154.4 Relationship between requirements on bulk cable and requirements on interconnect assemblies 154.5 Physical measurement points .
16、154.6 Concatenated configurations 154.7 Interoperability points 164.8 Constructions considered 164.9 Identification, constraints and loading requirements .174.9.1 Connector function identification 174.9.2 Constraints .174.9.3 Standard loads .184.9.3.1 Targets and initiators with no enabled terminato
17、r .184.9.3.2 Targets and initiators with enabled terminator 184.10 Nature of requirements .184.10.1 Measurements and tests 184.10.2 Performance levels and applications .184.10.3 Basic performance requirements for interconnect assemblies 194.10.3.1 Overview .194.10.3.2 Measurement conditions for non-
18、precomp received signal quality requirements .204.10.3.3 Measurement conditions for precomp received signal quality requirements 204.10.4 Deriving the launch signal requirements for this standard from the signal requirements in SPI-x .204.11 Local neighborhood concepts .214.12 Length specifications
19、.214.13 S21 relationship among point to point and multidrop configurations .214.14 Accommodation of receiver compensation in interconnect requirements .22ii4.15 Instrumentation and text fixture considerations .234.16 Signals covered by this standard 244.17 Error rate considerations .265 Summary bulk
20、 cable .276 Bulk cable samples, test fixtures and setups 296.1 Bulk cable samples and sample preparation 296.1.1 Overview 296.1.2 Summary 296.1.3 Point to point bulk cable .306.1.3.1 Point to point bulk cable sample preparation (SP_Bulk_PP3) 306.1.3.2 Point to point bulk cable sample preparation (SP
21、_Bulk_PP10) 306.1.3.3 Point to point bulk cable sample preparation (SP_Bulk_PP25) 306.1.4 Sample preparation for multi-drop bulk cable or printed circuit boards 306.1.4.1 Multi-drop bulk cable sample preparation (SP_Bulk_MD3) 306.1.4.2 Printed circuit boards sample preparation .316.2 Bulk cable and
22、printed circuit board test fixture specifications 316.2.1 Overview 316.2.2 Summary 316.2.3 Test fixture (FIX_Bulk_1) .326.2.4 Test fixture (FIX_Bulk_2) .336.2.5 Test fixture (FIX_Bulk_3) .346.2.6 Test fixture (FIX_Bulk_4) .346.2.7 Printed circuit boards test fixture (FIX_PCB_1) .346.3 Bulk cable mea
23、surement equipment and setups 356.3.1 Summary 356.3.2 Set up (SET_Bulk_1) .366.3.3 Set up (SET_Bulk_2) .366.3.4 Set up (SET_Bulk_3) .376.3.5 Set up (SET_Bulk_4) .376.3.6 Set up (SET_Bulk_5) .386.4 STD calibration 387 Level 1 bulk cable tests 407.1 SE tests .407.2 Differential local impedance 407.2.1
24、 Overview 407.2.2 Point-to-point bulk cable .407.2.2.1 Sample preparation for point to point bulk cable .407.2.2.2 Test fixtures for point to point bulk cable .407.2.2.3 Measurement equipment and setup for point to point bulk cable 407.2.2.4 Calibration and verification procedure for point to point
25、bulk cable .407.2.2.5 Test procedure and data output format .417.2.2.6 Acceptable values for point to point bulk cable .427.2.3 Multi-drop bulk cable 427.2.3.1 Sample preparation for multi-drop bulk cable .427.2.3.2 Test fixtures for multi-drop bulk cable .437.2.3.3 Measurement equipment and setup f
26、or multi-drop bulk cable 437.2.3.4 Calibration and verification procedure for multi-drop bulk cable .437.2.3.5 Test procedure and data output format for multi-drop bulk cable .437.2.3.6 Acceptable values for multi-drop bulk cable 447.2.4 Unpopulated printed circuit board (PCB) .447.3 Differential pr
27、opagation time and propagation time skew .447.3.1 Overview 44iii7.3.2 Point-to-point bulk cable .447.3.2.1 Sample preparation for point to point bulk cable .447.3.2.2 Test fixtures for point to point bulk cable .447.3.2.3 Measurement equipment and setup for point to point bulk cable 457.3.2.4 Calibr
28、ation and verification procedure for point to point bulk cable .457.3.2.5 Test procedure and data output format for point to point bulk cable .457.3.2.6 Acceptable values for point to point bulk cable .467.3.3 Multi-drop bulk cable 467.3.3.1 Sample preparation for multi-drop bulk cable .467.3.3.2 Te
29、st fixtures for multi-drop bulk cable .467.3.3.3 Measurement equipment and setup for multi-drop bulk cable 477.3.3.4 Calibration and verification procedure for multi-drop bulk cable .477.3.3.5 Test procedure and data output format for multi-drop bulk cable .477.3.3.6 Acceptable values for multi-drop
30、 bulk cable 477.3.4 Unpopulated PCB 477.4 Differential capacitance by calculation 477.4.1 Overview 477.4.2 Differential capacitance by calculation for all constructions of bulk cable 477.4.3 Acceptable differential capacitance values for all constructions of bulk cable .487.5 Differential capacitanc
31、e by frequency domain measurement .497.5.1 Point-to-point bulk cable .497.5.1.1 Sample preparation for point to point bulk cable .497.5.1.2 Test fixtures for point to point bulk cable .497.5.1.3 Measurement equipment and setup for point to point bulk cable 497.5.1.4 Calibration and verification proc
32、edure for point to point bulk cable .497.5.1.5 Test procedure and data output format for point to point bulk cable .497.5.2 Multi-drop bulk cable 497.5.3 Unpopulated PCB 497.5.4 Acceptable differential capacitance values for all constructions of bulk cable .507.6 Differential insertion loss .507.6.1
33、 Overview 507.6.2 Point-to-point bulk cable .507.6.2.1 Sample preparation for point to point bulk cable .507.6.2.2 Test fixtures for point to point bulk cable .507.6.2.3 Measurement equipment and setup for point to point bulk cable 507.6.2.4 Calibration, verification and measurement procedure for po
34、int to point bulk cable .507.6.2.5 Acceptable values for point to point bulk cable .517.6.3 Multi-drop bulk cable 517.6.3.1 Overview .517.6.3.2 Sample preparation for multi-drop bulk cable .527.6.3.3 Test fixtures for multi-drop bulk cable .527.6.3.4 Measurement equipment and setup for multi-drop bu
35、lk cable 527.6.3.5 Calibration, verification and measurement procedure for multi-drop bulk cable .527.6.3.6 Acceptable values for multi-drop bulk cable 527.6.4 Unpopulated PCB 527.7 Near end cross talk (NEXT) 527.7.1 Overview 527.7.2 Point-to-point bulk cable .547.7.2.1 Sample preparation for point
36、to point bulk cable .547.7.2.2 Test fixtures for point to point bulk cable .547.7.2.3 Measurement equipment and setup for point to point bulk cable 547.7.2.4 Calibration and verification procedure for point to point bulk cable .547.7.2.5 Test procedure and data output format for point to point bulk
37、cable .567.7.2.6 Acceptable values for point to point bulk cable .567.7.3 Multi-drop bulk cable 56iv7.7.3.1 Sample preparation for multi-drop bulk cable .577.7.3.2 Test fixtures for multi-drop bulk cable .577.7.3.3 Measurement equipment and setup for multi-drop bulk cable 577.7.3.4 Calibration and v
38、erification procedure for multi-drop bulk cable .577.7.3.5 Test procedure and data output format for multi-drop bulk cable .587.7.3.6 Acceptable values for multi-drop bulk cable 597.7.4 Unpopulated PCB 598 Summary - interconnect assemblies 609 Interconnect assemblies samples, test fixtures, and setu
39、ps 619.1 Interconnect assembly samples and sample preparation .619.2 Test fixtures for interconnect assemblies 619.2.1 Overview 619.2.2 Summary 619.2.3 Test fixture (FIX_ASY_1) .629.2.4 Test fixture (FIX_ASY_2) .639.2.5 Test fixture (FIX_ASY_3) .649.2.6 Test fixture (FIX_ASY_4) .649.3 Interconnect a
40、ssembly measurement equipment and setups .659.3.1 Summary 659.3.2 Set up (SET_ASY_1) .669.3.3 Set up (SET_ASY_2) .669.3.4 Set up (SET_ASY_3) .679.3.5 Set up (SET_ASY_4) .679.4 STD Calibration .6810 Level 1 interconnect assembly tests .6910.1 Differential impedance 6910.1.1 Overview 6910.1.2 Point-to
41、-point interconnect assemblies 6910.1.2.1 Test fixtures for point to point interconnect assemblies 6910.1.2.2 Measurement equipment and setup for point to point interconnect assemblies .6910.1.2.3 Calibration and verification procedure for point to point interconnect assemblies 6910.1.2.4 Test proce
42、dure and data output format for point to point interconnect assemblies 6910.1.3 Multi-drop interconnect assemblies 6910.1.3.1 Test fixtures for multi-drop interconnect assemblies .6910.1.3.2 Measurement equipment and setup for multi-drop interconnect assemblies 6910.1.3.3 Calibration and verificatio
43、n procedure for multi-drop interconnect assemblies .7010.1.3.4 Test procedure and data output format for multi-drop interconnect assemblies .7010.1.4 Connectorized backplanes .7010.1.5 Acceptable values for all constructions of interconnect assemblies 7010.2 Differential propagation time and propaga
44、tion time skew .7010.2.1 Overview 7010.2.2 Point-to-point interconnect assemblies 7010.2.2.1 Test fixtures for point to point interconnect assemblies 7010.2.2.2 Measurement equipment and setup for point to point interconnect assemblies .7010.2.2.3 Calibration and verification procedure for point to
45、point interconnect assemblies 7010.2.2.4 Test procedure and data output format for point to point interconnect assemblies 7010.2.3 Multi-drop interconnect assemblies 7110.2.4 Connectorized backplanes .7110.2.5 Acceptable values for all constructions of interconnect assemblies 7110.3 Signal integrity
46、 diagrams .7110.3.1 Overview 7110.3.2 Requirements for all constructions of interconnect assemblies .73v10.3.2.1 Test fixtures for all constructions of interconnect assemblies .7310.3.2.2 Measurement equipment and setup for all constructions of interconnect assemblies 7310.3.2.3 Calibration and veri
47、fication procedure for all constructions of interconnect assemblies .7410.3.2.3.1 Overview 7410.3.2.3.2 Non-precomp driver requirements .7410.3.2.3.3 Precomp driver requirements .7410.3.2.4 Test procedure and data output format for all constructions of interconnect assemblies .7510.3.2.5 Acceptable
48、values for all constructions of interconnect assemblies .7610.4 Differential to common mode conversion 7710.4.1 Overview 7710.4.2 Requirements for all constructions of interconnect assemblies .7710.4.2.1 Test fixtures for all constructions of interconnect assemblies .7710.4.2.2 Measurement equipment
49、 and setup for all constructions of interconnect assemblies 7710.4.2.3 Calibration and verification procedure for all constructions of interconnect assemblies .7710.4.2.4 Test procedure and data output format for all constructions of interconnect assemblies .7710.4.2.5 Acceptable values for all constructions of interconnect assemblies .7710.5 Differential insertion loss .7710.5.1 Overview 7710.5.2 Requirements for all constructions of interconnect assemblies .7810.5.2.1 Test fixtures for all constructions of interconnect assemblies .7810.5.2.2 Measurement equipment and setup for all const
