1、ANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008(ISO/IEC 10373-6:2001/Amd.4:2006, IDTIdentification cards Test methods Part 6: Proximity cards Amendment 4: Additional test methodsfor PCD RFANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008(ISO/IEC 10373-6:2001/Amd.4:2006,IDT)ANSI/INCITS/ISO/IEC 10373-6:
2、2001/Amd.4:20062008 ii ITIC 2008 All rights reserved PDF disclaimer This PDF file may contain embedded typefaces. In accordance with Adobes licensing policy, this file may be printed or viewed but shall not be edited unless the typefaces which are embedded are licensed to and installed on the comput
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5、entral Secretariat at the address given below. Adopted by INCITS (InterNational Committee for Information Technology Standards) as an American National Standard. Date of ANSI Approval: 7/2/2008 Published by American National Standards Institute, 25 West 43rd Street, New York, New York 10036 Copyrigh
6、t 2008 by Information Technology Industry Council (ITI). All rights reserved. These materials are subject to copyright claims of International Standardization Organization (ISO), International Electrotechnical Commission (IEC), American National Standards Institute (ANSI), and Information Technology
7、 Industry Council (ITI). Not for resale. No part of this publication may be reproduced in any form, including an electronic retrieval system, without the prior written permission of ITI. All requests pertaining to this standard should be submitted to ITI, 1250 Eye Street NW, Washington, DC 20005. Pr
8、inted in the United States of America iiiForeword ISO (the International Organization for Standardization) and IEC (the International Electrotechnical Commission) form the specialized system for worldwide standardization. National bodies that are members of ISO or IEC participate in the development
9、of International Standards through technical committees established by the respective organization to deal with particular fields of technical activity. ISO and IEC technical committees collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in
10、 liaison with ISO and IEC, also take part in the work. In the field of information technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1. International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2. The main task of the joint
11、 technical committee is to prepare International Standards. Draft International Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as an International Standard requires approval by at least 75 % of the national bodies casting a vote. Attentio
12、n is drawn to the possibility that some of the elements of this document may be the subject of patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights. Amendment 4 to ISO/IEC 10373-6:2001 was prepared by Joint Technical Committee ISO/IEC JTC 1, Informat
13、ion technology, Subcommittee SC 17, Cards and personal identification. ANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008 ITIC 2008 All rights reserved1Identification cards Test methods Part 6: Proximity cards AMENDMENT 4: Additional test methods for PCD RF interface and PICC alternating field exposure
14、 Page 2, 3.1.2 Replace the term, definition and associated footnote with the following: “Class 1 PICC PICC whose antenna is located within a zone defined by two rectangles: external rectangle: 81 mm 49 mm; internal rectangle: 64 mm 34 mm, centred in the external rectangle, with 3 mm radius, except f
15、or its connection endings. PICC antenna zone WARNING The “Class 1“ PICC shall also pass the “Class 1“ PICC maximum loading effect test defined in 7.4.“ ANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008 ITIC 2008 All rights reserved2 Pages 3 and 4, Clause 5 Replace Clause 5 and subclauses 5.1, 5.2 and
16、5.3 with the following: 5 Physical characteristics tests 5.1 Alternating magnetic field test The purpose of this test is to check the behaviour of the PICC in relation to alternating magnetic field exposure. Alternating magnetic field shall be tested only at 13,56 MHz. No test is required at other f
17、requencies. 5.1.1 Apparatus The test PCD assembly shall be used to produce the alternating magnetic field. 5.1.2 Test procedure The procedure is as follows. a) Adjust the RF power delivered by the signal generator to the test PCD antenna to a field strength of 10 A/m rms as measured by the calibrati
18、on coil. b) Place the PICC under test in the DUT position and readjust immediately the RF drive into the test PCD antenna to the required field strength if necessary. c) After 5 min, remove the PICC from the DUT position for at least 5 s. d) Adjust the RF power delivered by the signal generator to t
19、he test PCD antenna to a field strength of 12 A/m rms as measured by the calibration coil. e) Place the PICC under test in the DUT position and readjust immediately the RF drive into the test PCD antenna to the required field strength if necessary. f) Apply for 5 min an ASK 100 % modulation to this
20、field with the following duty cycle: 5 s at 0 A/m rms; 25 s at 12 A/m rms. g) Check that the PICC operates as intended. 5.1.3 Test report The test report shall state whether or not the PICC operates as intended. 5.2 Alternating electric field test No test is required. 5.3 Static electricity test The
21、 purpose of this test is to check the behaviour of the card IC in relation to electrostatic discharge (ESD) exposure in the test sample. The PICC under test is exposed to a simulated electrostatic discharge (ESD, human body model) and its basic operation checked following the exposure. ANSI/INCITS/I
22、SO/IEC 10373-6:2001/Amd.4:20062008 ITIC 2008 All rights reserved30,5 mm thick insulating support PICC Discharge tip ESD gun Horizontal coupling conductive plane on wooden table, standing on ground reference plane 470 kOhm 470 kOhm Figure 1 ESD test circuit 5.3.1 Apparatus Refer to IEC 61000-4-2:1995
23、. a) Main specifications of the ESD generator: energy storage capacitance: 150 pF 10 %; discharge resistance: 330 10 %; charging resistance: between 50 M and 100 M; rise time: 0,7 ns to 1 ns. b) Selected specifications from the optional items: type of equipment: table top equipment; discharge method
24、: direct application of air discharge to the equipment under test; discharge electrodes of the ESD generator: round tip probe of 8 mm diameter. 5.3.2 Test procedure Connect the ground pin of the apparatus to the conductive plate upon which the PICC is placed. Apply the discharge successively in norm
25、al polarity to each of the 20 test zones shown in Figure 2. Then repeat the same procedure with reversed polarity. Allow a cool-down period between successive pulses of at least 10 s. WARNING If the PICC includes contacts, the contacts should face up and the zone which includes contacts should not b
26、e exposed to this discharge. Check that the PICC operates as intended at the end of the test. ANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008 ITIC 2008 All rights reserved4 12 34567 8 91011 12 13 14 1516 17 18 19 20Figure 2 Test zones on PICC for ESD test 5.3.3 Test report The test report shall stat
27、e whether or not the PICC operates as intended. 5.4 Static magnetic field test No test is required. Page 7, 6.3 Add a new subclause after 6.3.1 and renumber all subsequent subclauses: “6.3.2 Reference PICC for modulation index and waveform test The schematic of this Reference PICC is shown in Annex
28、I. This Reference PICC includes a pick up coil with low coupling with the main coil. The pick up coil shall be connected to a high impedance oscilloscope probe. The main coil shall be calibrated with the following procedure. a) Calibrate the Test PCD assembly to produce the Hmaxoperating condition o
29、n the calibration coil. b) Tune the Reference PICC (Annex I) to 19 MHz: 1) set jumper J1 to position a; 2) drive the calibration coil directly from a signal generator set at 19 MHz; 3) locate the calibration coil and the Reference PICC as close as possible with the axes of the two coils (calibration
30、 coil and Reference PICC main coil) being congruent; 4) adjust the Reference PICC capacitor C2 to maximum d.c. voltage at C4; 5) assure final reading of about 6 V (d.c.) at C4 of the Reference PICC by adjusting the generator drive level; 6) re-adjust the Reference PICC capacitor C2 to maximum d.c. v
31、oltage at C4, if necessary. ANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008 ITIC 2008 All rights reserved5c) Place the Reference PICC into the DUT position on the Test PCD assembly. Set jumper J1 to position b and adjust R2 to obtain 6 V (d.c.) at C4 measured with a high impedance voltmeter. Verify
32、the operating field condition by monitoring the voltage on the calibration coil. WARNING R2 value should be between 140 and 180 . NOTE 1 The high impedance voltmeter wires should be twisted. NOTE 2 The high impedance oscilloscope probe ground connection should be as short as possible, less than 20 m
33、m or coaxial connection.“ Page 3 of ISO/IEC 10373-6:2001/Amd.2:2003, 7.1.2 Add a warning before step 2: “WARNING The PICC load modulation amplitude test should be done by increasing the field strength from 0 A/m, thus checking correct PICC operation starting from Hmin.“ Page 5 of ISO/IEC 10373-6:200
34、1/Amd.2:2003, 7.3.1 Add a warning at the end of the subclause: “WARNING The resonance frequency may depend on the field strength used during the measurement.“ Page 5 of ISO/IEC 10373-6:2001/Amd.2:2003, Clause 7 Add a new subclause 7.4: “7.4 “Class 1“ PICC maximum loading effect 7.4.1 Purpose The fol
35、lowing additional PICC test is necessary for interoperability between PCDs and “Class 1“ PICCs. NOTE This test improves interoperability only if the “Class 1“ PICCs antenna size and location are similar to the Reference PICC (Annex D) antenna size and location. For PICCs with different antenna size
36、and/or location other classes may be created with, for each class, a corresponding reference PICC. Next revision of ISO/IEC 14443-1 will include the class(es) definition. 7.4.2 Test procedure The PICC loading effect at Hminshall be measured using the test PCD assembly. It shall not exceed the loadin
37、g effect of the reference PICC (Annex D) tuned to 13,56 MHz and calibrated to obtain 6 V (d.c.) at Hmin. The procedure of this substitution method is as follows. a) Calibrate the Test PCD assembly to produce the Hminoperating condition on the calibration coil. b) Tune the Reference PICC (Annex D) to
38、 13,56 MHz: 1) set jumper J1 to position a; 2) drive the calibration coil directly from a signal generator set at 13,56 MHz; 3) locate the calibration coil and the Reference PICC as close as possible with the axes of the two coils being congruent; ANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008 ITIC
39、 2008 All rights reserved6 4) adjust the Reference PICC capacitor C2 to maximum d.c. voltage at R1; 5) assure final reading of about 6 V (d.c.) at R1 of the Reference PICC by adjusting the generator drive level; 6) re-adjust the Reference PICC capacitor C2 to maximum d.c. voltage at R1, if necessary
40、. c) Place the Reference PICC into the DUT position on the Test PCD assembly. Switch the jumper to R2 and adjust R2 to obtain 6 V (d.c.) across it measured with a high impedance voltmeter. Verify the operating field condition by monitoring the voltage on the calibration coil and readjust Hminif nece
41、ssary. WARNING R2 value should be between 900 and 1000 . NOTE The high impedance voltmeter wires should be twisted. d) Remove the Reference PICC then measure the field strength HRmonitored by the calibration coil. e) Place the PICC under test into the DUT position on the Test PCD assembly and readju
42、st Hminif necessary. f) Remove the PICC under test then measure the field strength HPmonitored by the calibration coil. The field strength HPshall be less than the field strength HR. 7.4.3 Test report The test report shall give the values HRand HP.“ Page 9, 8.1.2 Add a warning after step 3 of proced
43、ure for Hmaxtest: “WARNING R2 value should be between 75 and 85 .“ Page 10, 8.1.2 Add a warning after step 3 of procedure for Hmintest: “WARNING R2 value should be between 400 and 550 .“ Page 10, 8.1.3 Replace the paragraph with the following: “The test report shall give the d.c. voltage measured ac
44、ross R2 adjusted for Hminand Hmaxfield strength under the conditions applied.“ ANSI/INCITS/ISO/IEC 10373-6:2001/Amd.4:20062008 ITIC 2008 All rights reserved7Page 10, 8.3.2 Add the following paragraph and note after the note added by ISO/IEC 10373-6:2001/Amd.2:2003: “Repeat the test with the Referenc
45、e PICC for modulation index and waveform test (Annex I) located at various locations in the operating volume. Determine the worst case deviations of the modulation index and waveform characteristics. NOTE The load does not represent the worst case loading effect of a PICC. Higher loading effects may
46、 be achieved with higher values of R2 and/or resonance frequency closer to carrier frequency.“ Page 11, 8.4.2 Replace the paragraph with the following: “Annex E describes a Reference PICC and calibration procedure which allows the sensitivity of a PCD to load modulation to be assessed. This Referenc
47、e PICC does not emulate the shunt action of all types of PICC, therefore it shall be calibrated at a given field strength H in the Test PCD assembly. It shall be used in the PCD field at a position where the field has the same value of H. The measurement of C3 (d.c.) voltage shall be exactly the sam
48、e for both Reference PICC calibration and PCD load modulation test. The test procedure is as follows. a) Place the Reference PICC at a particular position in the PCD operating volume. b) Adjust the Reference PICC components to produce the minimum load modulation detected by the PCD (ATQ sent in resp
49、onse to every REQ). NOTE The change in load modulation level may be performed by changing by steps the values of the resistors (Rmod1, Rmod2) or capacitors (Cmod1, Cmod2) for coarse modifications, and trimming of the resistor R6 for fine adjustment. c) Measure the voltage (d.c.) at C3. d) Place the Reference PICC in the DUT position on the Test PCD assembly. e) Adjust the Test PCD assembly to produce a field strength H which gives the same voltag
