ANSI TIA EIA 455-56B-1995 Evaluating Fungus Resistance of Optical Waveguide Fibers and Cables Test Method for《评价光导纤维和光缆的抗菌能力》.pdf

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1、 TIA STANDARD FOTP-56 Test Method for Evaluating FungusResistance of Optical Fiber and Cable TIA-455-56-B(Revision of EIA/TIA-455-56-A)January 1995 TELECOMMUNICATIONS INDUSTRY ASSOCIATION Representing the telecommunications industry in association with the Electronic Industries Alliance ANSI/TIA/EIA

2、-455-56-B-1995Approved: January 12, 1995Reaffirmed: February 8, 1999Reaffirmed: May 10, 2005Copyright Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE TIA Engineering Standards and

3、Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for their parti

4、cular need. The existence of such Standards and Publications shall not in any respect preclude any member or non-member of TIA from manufacturing or selling products not conforming to such Standards and Publications. Neither shall the existence of such Standards and Publications preclude their volun

5、tary use by Non-TIA members, either domestically or internationally. Standards and Publications are adopted by TIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, TIA does not assume any liability to any patent owner, nor does it assume any obligati

6、on whatever to parties adopting the Standard or Publication. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and

7、 to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 3-4221-RF1, formulated under the cognizance of the TIA FO-4.2 Subcommittee on Optical Fibers and Cables). Published by TELECOMMUNICATIONS INDUSTRY ASSOCIATION Standards and Technology Department 25

8、00 Wilson Boulevard Arlington, VA 22201 U.S.A. PRICE: Please refer to current Catalog of TIA TELECOMMUNICATIONS INDUSTRY ASSOCIATION STANDARDS AND ENGINEERING PUBLICATIONS or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) or search online at http:/www

9、.tiaonline.org/standards/search_n_order.cfm All rights reserved Printed in U.S.A. Copyright Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE OF COPYRIGHT This document is copyrighte

10、d by the TIA. Reproduction of these documents either in hard copy or soft copy (including posting on the web) is prohibited without copyright permission. For copyright permission to reproduce portions of this document, please contact TIA Standards Department or go to the TIA website (www.tiaonline.o

11、rg) for details on how to request permission. Details are located at: http:/www.tiaonline.org/about/faqDetail.cfm?id=18 OR Telecommunications Industry Association Standards (b) there is no assurance that the Document will be approved by any Committee of TIA or any other body in its present or any ot

12、her form; (c) the Document may be amended, modified or changed in the standards development or any editing process. The use or practice of contents of this Document may involve the use of intellectual property rights (“IPR”), including pending or issued patents, or copyrights, owned by one or more p

13、arties. TIA makes no search or investigation for IPR. When IPR consisting of patents and published pending patent applications are claimed and called to TIAs attention, a statement from the holder thereof is requested, all in accordance with the Manual. TIA takes no position with reference to, and d

14、isclaims any obligation to investigate or inquire into, the scope or validity of any claims of IPR. TIA will neither be a party to discussions of any licensing terms or conditions, which are instead left to the parties involved, nor will TIA opine or judge whether proposed licensing terms or conditi

15、ons are reasonable or non-discriminatory. TIA does not warrant or represent that procedures or practices suggested or provided in the Manual have been complied with as respects the Document or its contents. TIA does not enforce or monitor compliance with the contents of the Document. TIA does not ce

16、rtify, inspect, test or otherwise investigate products, designs or services or any claims of compliance with the contents of the Document. ALL WARRANTIES, EXPRESS OR IMPLIED, ARE DISCLAIMED, INCLUDING WITHOUT LIMITATION, ANY AND ALL WARRANTIES CONCERNING THE ACCURACY OF THE CONTENTS, ITS FITNESS OR

17、APPROPRIATENESS FOR A PARTICULAR PURPOSE OR USE, ITS MERCHANTABILITY AND ITS NON-INFRINGEMENT OF ANY THIRD PARTYS INTELLECTUAL PROPERTY RIGHTS. TIA EXPRESSLY DISCLAIMS ANY AND ALL RESPONSIBILITIES FOR THE ACCURACY OF THE CONTENTS AND MAKES NO REPRESENTATIONS OR WARRANTIES REGARDING THE CONTENTS COMP

18、LIANCE WITH ANY APPLICABLE STATUTE, RULE OR REGULATION, OR THE SAFETY OR HEALTH EFFECTS OF THE CONTENTS OR ANY PRODUCT OR SERVICE REFERRED TO IN THE DOCUMENT OR PRODUCED OR RENDERED TO COMPLY WITH THE CONTENTS. TIA SHALL NOT BE LIABLE FOR ANY AND ALL DAMAGES, DIRECT OR INDIRECT, ARISING FROM OR RELA

19、TING TO ANY USE OF THE CONTENTS CONTAINED HEREIN, INCLUDING WITHOUT LIMITATION ANY AND ALL INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF BUSINESS, LOSS OF PROFITS, LITIGATION, OR THE LIKE), WHETHER BASED UPON BREACH OF CONTRACT, BREACH OF WARRANTY, TORT (INCLU

20、DING NEGLIGENCE), PRODUCT LIABILITY OR OTHERWISE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. THE FOREGOING NEGATION OF DAMAGES IS A FUNDAMENTAL ELEMENT OF THE USE OF THE CONTENTS HEREOF, AND THESE CONTENTS WOULD NOT BE PUBLISHED BY TIA WITHOUT SUCH LIMITATIONS. Copyright Telecommunications

21、Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Test method for evaluating fungus resistance of optical fiber and cable Contents 1 Introduction 3 2 Applicable documents 4 3 Apparatus . 4 4 Samplingandspecim

22、ens 5 5 Procedure . 6 . 6 Calculations or interpretation of results 7 7 Documentation 7 8 Specification information 8 Annex A . Comparison between this FOTP and IEC or ITU/S requirements 9 Copyright Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reprod

23、uction or networking permitted without license from IHS-,-,-This page left blank. Copyright Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Test method for evaluating fungus resistance of

24、 optical fiber and cable (From TIA Standards Proposal Number 3272, formulated under the cognizance of TIA FO-6.6, Subcommittee on Optical Fibers and Materials.) This FOTP forms a part of the latest revision of Recommended Standard EIAITIA-455. NOTE - This FOTP was previously published in EIA-455-56A

25、 as FOTP-56. 1 Introduction 1.1 Intent This method is intended to evaluate the adequacy of optical fibers and cables to retain their structural integrity and performance level under environmental conditions favorable for the development of fungal growth. These conditions are: high humidity, a warm a

26、tmosphere, and the presence of inorganic salts. 1.2 General effects 1.2.1 Organic materials commonly form an integral part of optical fiber: for plastic cladding, for protecting the surface of a glass fiber, and for buffering. Some fibers are fabricated entirely from various plastic materials. Organ

27、ic materials are also commonly used in fabricating optical cable: bufferings, filling materials, strength members, and jacketing. 1.2.2 Micro-organisms digest certain organic materials as a normal metabolic process, thus degrading them and causing porosity and loss of structural integrity, even to t

28、he point of catastrophic failure. Basic resins do not usually serve as carbon sources for growth of fungi. Rather it is generally other components such as plasticizers, stabilizers, colorants, lubricants, and cellulosics that are responsible for the actual fungus attack. 1.2.3 Enzymes and organic ac

29、ids produced during metabolism diffuse out of their cells and on to the plastic to cause such possible phenomena as cracking; corrosion; glass etching; hardening of cable filling compounds; increased modulus; weight changes; dimensional changes; and microbending of the fiber, with a resultant increa

30、se in attenuation. Copyright Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1.3 Hazards 1.3.1 Because of safety and toxicity considerations detailed in 1.3.3, conduct testing at a site s

31、pecifically equipped for the purpose. This generally means a separate, isolated facility with the ability to keep the test specimens within a confined area during the entire testing and incubation period. 1.3.2 Similarly, all testing shall be performed by personnel trained in microbiological laborat

32、ory techniques, sterile routmes, and proper disposal of all waste solutions at the close of testing. 1.3.3 The reason for specifying the testing site and personnel qualifications is the potentially toxic nature of fungal spores. They have been implicated in pneumonia-like respiratory infections, ulc

33、ers of the skin, and digestive problems. 2 Applicable documents ANSIIASTM G 2 1 -90, Standard Practice for Determining Resistance of Synthetic Polymeric Materials to Fungi (1 990) EIATTIA-455-A, Standard Test Procedures for Fiber Optic Fibers, Cables, Transducers, Sensors, Connecting and Terminating

34、 Devices, and Other Fiber Optic Components (1 99 1 ) 3 Apparatus 3.1 Chamber A chamber or cabinet is required, with the instrumentation necessary to maintain the specified conditions of temperature and humidity: up to 30C and a minimum of 85% relative humidity. Provide apparatus capable of recording

35、 temperature and humidity. 3.1.1 Make provision to prevent condensation from dripping directly on any of the specimens in their containers. Copyright Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license fr

36、om IHS-,-,-3.1.2 There shall be free circulation of air around each container for the test specimens. When forced air is used, the flow rate shall not exceed 1 mls (3.3 fils) over the surface of the containers. 3.1.3 Make provision so that any heating elements inside the chamber do not directly cont

37、act the test containers. 3.2 Specimen container Provide a glass dish or pan, capable of being sterilized, for each test specimen. The container shall be large enough so that the entire specimen shall be able to lie flat inside it. Provide each container with a glass cover (flat window glass makes a

38、convenient, inexpensive one). 4 Sampling and specimens 4.1 General requirements Generally, only a visual inspection is required for test specimens after they have been exposed to fungi. In this case, 3 test specimens are required for each of 5 test fungi. If the 2 sides of a specimen are different,

39、3 specimens are required for each side (i. e., 3 for face up and 3 for face down). If further tests beyond visual inspection are specified, the number of additional specimens shall also be specified, along with the test(s) to be run. 4.2 Fiber samples 4.2.1 All test specimens shall each be at least

40、5 m (16 ft) long and sampled from regular production runs of optical fiber. 4.2.2 Form the specimens into loose coils with a minimum inside diameter of 200 mm (8 inches). 4.2.3 Test specimens shall have no surface treatment other than that ordinarily applied during production of the fiber. Copyright

41、 Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4.3 Cable samples Test specimens for cable testing shall be specified in the Detail Specification and may be in any or all of the followin

42、g forms: 4.3.1 The simplest forms may be flat squares 50 mm (2 inch) on a side; flat circles 50 mm (2 inch) in diameter; or rods or tubing a minimum of 76 mm (3 inch) long cut from the material to be tested. 4.3.2 Test specimens may be from completely fabricated parts, or sections or subassemblies c

43、ut from completely fabricated parts. 4.3.3 Samples of film-forming materials such as coatings may be in the form of films a minimum of 50 mm (2 inch) square. These films may be prepared by casting on glass, then stripping after cure; or by impregnating filter paper or ignited glass fabric. 5 Procedu

44、re 5.1 General procedure The procedure indicated in ANSIIASTM G 21 -90, clauses 6 (Reagents and materials, paying careful attention to subclause 6.4, Mixed fungus spore suspension) and 7 (Viability control), as well as subclauses 9.1 -9.3 (in Procedure), shall be followed. . 5.2 Test fungi 5.2.1 For

45、 all nonmilitary applications, ASTM G 21-90 requires all 5 of these test fungi: - Aspergillus niger - Penicillium pinophilum (historically known as funiculosm) - Chaetomium globosum - Gliocladium virens - Aureobasidium pullulans 5.2.2 For all military applications, use all 5 of these test fungi: - A

46、spergillus niger - Penicillium pinophilum (historically known as funiculosm) - Chaetomium globosum - Aspergillus flavus - Aspergillus versicolor Copyright Telecommunications Industry Association Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without licen

47、se from IHS-,-,-5.3 Inspection 5.3.1 At the end of the incubation period remove the specimens from the test chamber and visually examine them for the following: 5.3.1.1 The presence of fungal growth on any surface, or at any surface, or at any interface between the various component materials in the

48、 fiber or cable sample. Estimate the percent coverage per 9.3 of ASTM G 21-90. 5.3.1.2 Signs of catastrophic failure in any part of the fiber or cable sample, including protective coatings and buffers. 5.3.1.3 Evidence of cracking, swelling, discoloration, blistering, and other signs of deterioratio

49、n in the test sample. This may also include changes in observed surface reflection or changes in physical properties such as stiffness. 5.3.2 Specify the acceptancelrejection criteria for the above observations in the Detail Specification. 6 Calculations or interpretation of results Not applicable. 7 Documentation 7.1 Test data sheets shall contain the following information: 7.1.1 Dates

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