1、UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL UL 796F Flexible Materials Interconnect Constructions STANDARD FOR SAFETYUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM ULUL COPYRIGHTED
2、 MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL UL Standard for Safety for Flexible Materials Interconnect Constructions, UL 796F Third Edition, Dated August 28, 2015 Summary of Topics This revision of UL 796F was issued to include the following changes i
3、n requirements: 1. Addition of Requirements for Sample Thickness Tolerance to Table 5.1.1 and Paragraphs 5.1.3.4 and 5.1.3.6 2. Clarication of Requirements for Dissimilar Material Test Method Specied in Section 5.14 3. Removal of References to Paragraphs in Various Requirements in UL 796F That Are I
4、naccurate The new and revised requirements are substantially in accordance with Proposal(s) on this subject dated January 22, 2016. Text that has been changed in any manner or impacted by ULs electronic publishing system is marked with a vertical line in the margin. All rights reserved. No part of t
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9、puter system. MARCH 16, 2016 UL 796F tr1UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL MARCH 16, 2016 UL 796F tr2 No Text on This PageUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL
10、 AUGUST 28, 2015 (Title Page Reprinted: March 16, 2016) 1 UL 796F Standard for Flexible Materials Interconnect Constructions First Edition September, 2000 Second Edition October, 2010 Third Edition August 28, 2015 This ANSI/UL Standard for Safety consists of the Third Edition including revisions thr
11、ough March 16, 2016. The most recent designation of ANSI/UL 796F as an American National Standard (ANSI) occurred on March 16, 2016. ANSI approval for a standard does not include the Cover Page, Transmittal Pages and Title Page. Comments or proposals for revisions on any part of the Standard may be
12、submitted to UL at any time. Proposals should be submitted via a Proposal Request in ULs On-Line Collaborative Standards Development System (CSDS) at http:/. ULs Standards for Safety are copyrighted by UL. Neither a printed nor electronic copy of a Standard should be altered in any way. All of ULs S
13、tandards and all copyrights, ownerships, and rights regarding those Standards shall remain the sole and exclusive property of UL. COPYRIGHT 2016 UNDERWRITERS LABORATORIES INC. ANSI/UL 796F-2016UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL
14、AUGUST 28, 2015 FLEXIBLE MATERIALS INTERCONNECT CONSTRUCTIONS - UL 796F 2 No Text on This PageUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL CONTENTS 1 Introduction 5 1.1 Scope .5 1.2 Units of measurement .5 1.3 Supplementary test procedure
15、s 5 1.4 References 6 1.5 General .6 1.6 Glossary 7 1.7 Abbreviations .17 2 Materials 18 2.1 General .18 2.2 Base materials 20 2.3 Conductors and conductor adhesives 23 2.4 Bonding lm (supported and unsupported) and internal bonding materials 27 2.5 Cover material (coverlay, coverlm and covercoat) 30
16、 2.6 Solder resist, solder mask, and permanent coatings .32 2.7 Plugged-hole materials .33 2.8 High density interconnect (HDI) dielectric materials 35 2.9 Stiffener and adhesive (external bonding) materials 37 3 FMIC Constructions 40 3.1 General .40 3.2 Singlelayer (dielectrics) .43 3.3 Multilayer (
17、dielectrics) 45 3.4 Flexible 48 3.5 Flex-to-install .49 3.6 Rigid .50 3.7 Multilayer rigid ex composite .50 3.8 Flammability classication only 56 3.9 Glossary of construction and FMIC titles .56 4 Processes 58 4.1 General .58 4.2 Process description 58 4.3 Variations in processes 59 5 Tests .60 5.1
18、General .60 5.2 Microsection analysis 72 5.3 Thermal stress test 74 5.4 Delamination test 77 5.5 Plating adhesion test 79 5.6 Bond strength test .82 5.7 Conductive paste adhesion test .90 5.8 Coverlay test 96 5.9 (Ambient) bend test 98 5.10 Cold-bend test 103 5.11 Repeated exing test 106 5.12 Stiffe
19、ner bond strength test .111 5.13 Silver migration test .120 5.14 Dissimilar Dielectric Materials Thermal Cycling Test .127 5.15 Flammability tests .130 5.16 Direct support requirements (DSR) tests .132 6 Parameter Prole Indices 134 6.1 General 134 AUGUST 28, 2015 FLEXIBLE MATERIALS INTERCONNECT CONS
20、TRUCTIONS - UL 796F 3UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 6.2 Maximum operating temperature (MOT) .135 6.3 Flammability classication .136 6.4 Solder limits .136 6.5 Thickness .137 6.6 Conductor weight 138 6.7 Conductor width 138 6
21、.8 Maximum area conductor diameter .138 6.9 Direct support requirements (DSR) .138 7 Markings .139 7.1 General 139 7.2 Type designation .139 7.3 Trademark 139 7.4 Manufacturer identication .140 7.5 FMIC category constructions .140 7.6 Flammability classication .140 7.7 Flammability classication only
22、 constructions 141 7.8 Direct support requirements (DSR) .141 7.9 Comparative tracking index (CTI) .141 7.10 System component symbol (SCS) .141 7.11 Size class number (SCN) 142 7.12 Additional stiffener and adhesive (external bonding) materials 143 AUGUST 28, 2015 FLEXIBLE MATERIALS INTERCONNECT CON
23、STRUCTIONS - UL 796F 4UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 1 Introduction 1.1 Scope 1.1.1 These requirements apply to exible material printed wiring board constructions (FMICs) for use as components in exible, ex-to-install, rigid
24、, and multilayer rigid-ex composite applications with and without stiffener and adhesive materials in devices or appliances. 1.1.2 Together with the Standards mentioned in the Supplementary Test Procedures, 1.3, these requirements provide data with respect to the physical, electrical, ammability, th
25、ermal, and other properties of the FMIC under consideration and are intended to provide guidance to the fabricator, end product manufacturer, safety engineers and other interested parties. 1.1.3 Compliance with these requirements does not indicate the product is acceptable for use as a component of
26、an end product without further investigation. 1.1.4 The singlelayer and multilayer exible, ex-to-install, and multilayer rigid-ex composite constructions addressed by these requirements consist of conductors affixed to base material, with mid-board interconnections, and cover materials. 1.1.5 The su
27、itability of additional stiffener and adhesive materials, not evaluated in accordance with Stiffener and adhesive (external bonding) materials, 2.9, the Stiffener bond strength test, 5.12, and Flammability tests, 5.15, are subject to the applicable end-use product construction and performance requir
28、ements. See Additional stiffener and adhesive (external bonding) materials, 7.12, for marking requirements for FMICs provided with additional stiffener and adhesive materials not investigated. 1.1.6 The requirements for rigid printed wiring boards are in the Standard for Printed Wiring Boards, UL 79
29、6. 1.2 Units of measurement 1.2.1 Values stated without parentheses are the requirement. Values in parentheses are explanatory or approximate information. 1.3 Supplementary test procedures 1.3.1 These requirements are intended to be used in conjunction with the following requirements or standards: a
30、) The Standard for Polymeric Materials Short Term Property Evaluations, UL 746A, the Standard for Polymeric Materials Long Term Property Evaluations, UL 746B, the Standard for Polymeric Materials Industrial Laminates, Filament Wound Tubing, Vulcanized Fibre, and Materials Used in Printed Wiring Boar
31、ds, UL 746E, and the Standard for Polymeric Materials Flexible Dielectric Film Materials for Use in Printed Wiring Boards and Flexible Materials Interconnect Constructions, UL 746F, contain programs for investigating polymeric materials and industrial laminates. b) The Standard for Tests for Flammab
32、ility of Plastic Materials for Parts in Devices and Appliances, UL 94, contains methods for evaluating the ammability of polymeric materials that are intended to be used in electrical equipment. c) The Standard for Printed Wiring Boards, UL 796, covers the minimum performance requirements for rigid
33、printed-wiring boards. AUGUST 28, 2015 FLEXIBLE MATERIALS INTERCONNECT CONSTRUCTIONS - UL 796F 5UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 1.4 References 1.4.1 Any undated reference to a code or standard appearing in the requirements of
34、 this standard shall be interpreted as referring to the latest edition of that code or standard. 1.4.2 The following is a list of ASTM test procedures referenced in this standard: a) ASTM D 149 Standard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulati
35、ng Materials at Commercial Power Frequencies. b) ASTM D 374 Standard Test Methods for Thickness of Solid Electrical Insulation. c) ASTM D 1000 Standard Test Methods for Pressure-Sensitive Adhesive-Coated Tapes Used for Electrical and Electronic Applications. d) ASTM D 5374 Standard Test Methods for
36、Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation. e) ASTM D 5423 Standard Specication for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation. f )A S T ME3Standard Practice for Preparation of Metallographic Specimens. g) IPC TM-650 2.1.1 Microsectioni
37、ng, Manual Method. h) ISO 291 Plastics Standard Atmospheres for Conditioning and Testing. 1.5 General 1.5.1 Acceptability of an FMIC in a device or appliance depends on the acceptability of the construction for: a) Continued use under actual service conditions, including the maximum operating temper
38、ature (MOT); b) Flammability properties; and c) All other applicable end-product requirements. 1.5.2 The investigation of an FMIC shall include consideration of the conductor properties, such as weight (thickness), minimum midboard and edge width, and maximum ground plane area, and shall include the
39、 conductor forming and materials build-up processes including solder limits. 1.5.3 Except as indicated in 1.5.4, the factors considered in testing the FMIC conductor supporting material in its application shall include mechanical strength, moisture absorption, combustibility, resistance to ignition
40、from electrical sources, dielectric strength, insulation resistance, resistance to arc-tracking, and resistance to creeping and distortion at temperatures to which the material is subjected in the end product. The conductor supporting material shall not display a loss of these properties beyond the
41、minimum acceptable level as a result of aging, and relative temperature indices shall be assigned to the conductor supporting material. AUGUST 28, 2015 FLEXIBLE MATERIALS INTERCONNECT CONSTRUCTIONS - UL 796F 6UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PER
42、MISSION FROM UL 1.5.4 If an FMIC is entitled with ammability classication only, the acceptability of the FMIC shall involve only ammability tests. See Flammability tests, 5.15. 1.5.5 An FMIC entitled exible is intended for use where the construction is subject to dynamic exing applications, yet the
43、exural endurance of the construction has not been evaluated. 1.5.6 An FMIC entitled ex-to-install is intended for use where the construction is exed for installation or service (only) and shall not be subject to dynamic or repeated exing applications, yet the exural endurance of the construction has
44、 not been evaluated. 1.5.7 An FMIC entitled rigid is intended for use where the construction is not exed or subject to dynamic or repeated exing applications. 1.5.8 Multilayer rigid ex composite constructions may include single-sided, double-sided, singlelayer and multilayer exible, ex-to-install, a
45、nd rigid constructions in various sections of an FMIC. 1.6 Glossary 1.6.1 For the purpose of this Standard the following denitions shall apply. 1.6.2 ACCESS HOLE Holes on the same axis through successive layers of materials intended to provide access to the surface of the land on an inner conductor
46、layer of a multilayer category construction. 1.6.3 ADDITIVE PROCESS A selective or non-selective process used to deposit a pattern of conductor material(s) on clad or unclad base material. 1.6.4 ADD-ON COMPONENT Discrete, integrated, packaged, or chip components that are attached to an FMIC to funct
47、ion as part of a complete circuit or assembly. 1.6.5 ADHESIVE A substance such as glue or cement used to join, bond, or fasten materials or objects together. 1.6.6 AS-RECEIVED Specimens or samples in an unconditioned state, prior to being subject to conditioning, or without a history of conditioning
48、. 1.6.7 ASSEMBLY Various parts, subassemblies, and combinations thereof, joined together. 1.6.8 BARE BOARD An unpopulated FMIC without add-on or embedded components or assemblies. 1.6.9 BASE DIELECTRIC MATERIAL An organic or inorganic dielectric barrier material, used to support conductor material.
49、1.6.10 BASE MATERIAL An organic or inorganic insulating material used to support a pattern of conductor material, with or without integral adhesive material, with or without integral conductor material. 1.6.11 BASE MATERIAL THICKNESS The thickness of the base dielectric material excluding conductive foil or material deposited on the surfaces. If an adhesive is used for the base material, the adhesive thickness and number of sides is indicated separately.
