1、I M IL-B-63 5 1 2 i AR) 8 MARCH 1988 MILITARY SPECIFICATION BOD Y AS SE MB LY FOR MINE, ANTI-PEKSONNEL : BLU-92/B This specification is approved for use by the US Army Armament Research and Development Command and is available for use by all Departments and Agencies of the Department of Defense. 1.
2、SCOPE 1.1 This specification contains quality assurance provisions for the fabrication and inspection of parts, assembly and packing of an electronic body assembly for Mine, Anti-Personnel: BLU-92/13. 2. APPLICABLE DOCUMENTS 2.1 Issues of documents. The following documents of the issue in effect on
3、date of invitation for bids or request for proposal, form a part of this specification to the extent specified herein. SPECIFICATIONS FE DE HAL , PPP-B-621 - Boxe MILITARY , W d, Nailed and L k-Corner. ML -B- 11 7 - Bags, Sleeves and Tubing - Interior Packaging MIL-P-14232 - Parts, Equipnent and Too
4、ls for Army Materiel, Packaging of MIL-E-17555 - Electronic and Electrical Equipment Accessories, and Repair Parts, . Packaging and Packing of THIS DOCUMENT CONTAINS lob PAGES. _- FSC: 1345 Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in impr
5、ovin this document should be addressed to: Commander, US Army Armament desearch and Develo ment Command, Attn. DRDAR-QA, Dover, New Jersey 07801 by using tRe self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter, - I -=-_-_ I P
6、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- - MIL-B-63512 13 = 7799706 O351287 8 W MIL-8-63SlZ(AR) M IL-S- 1 9500 / 240 - MIL-S-19500/255 - M LL-S-19500/29 1 - M IL-S-19500 /406 - M IL-R-3 9008 /4 - M IL-C-3 9014/5 - MIL-G-45204 - MIL -A-480 7 8
7、- M IL-P-50884 - Semi-conductor Device, Diode, Silicon, Rectifier, Types N645, IN647, IN649, IN645-1, IN647-1, IN649-1, TX and Non-TX Types. Semiconductor Device, Transistor, NPN, Silicon, Switching Types 2N2221, 2N2221A, 2N2222, and 2N2222A JAN, JANTX, JANTXV, A and JANS Semi conduct or Devi ce, Tr
8、ans i 8 tor, PNP , Sil icon Switching Types 2N2906, 2N2906A, 2N2907 and 2N2907A JAN, JAMIX, JANTXV, and JANS Semiconductor Device, Diode Silicon, Voltage Regulator Types JAN An JANTX IN4460 thru IN4496 Resistor, Fixed, Composition ( Ins u1 at ed ) E s t ab1 is he d Re 1 i abi 1 it y Style RCR05 Capa
9、citor, Fixed, Ceramic Dielectric (General Purpose), Established Reliability, Style Cm12 Soldering, Manual Type, High Re1 i abi 1 it y, Electrical and E lect ronic Equi pent Solder Bath Soldering of Printed Wiring Assemblies Go Id P 1 ating (E 1 ec tro deposi ted Amunition, Standard Quality Assurance
10、 Provisions, General Specification for Printed Wiring, Flexible General Specification For L j 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-B-63512 13 m 7779706 0351288 T m STANDARDS MILITARY M IL -S TD- 105 - MIL-STD.129 - MIL -STD-202 - MIL
11、-STD-275 - MIL-STD-33 1 - MIL-STD-750 - MU -STD- 11 88 - Sampling Procedures and Tables for Ins pec ti on by At t r i but es Marking for Shipment and Storage Test Methods For Electronic and Electrical Component Parts Printed Wiring for Electronic Equipent Fuze and Fuze Components, Environmental and
12、Performance Tests for Test Methods for Semiconductor Devices Commercial Packing of Supplies and Equipent DRAWINGS (see 6.10) US ARMY ARMAME“ RESEARCH AND DEVELOPMEM: COMMAND PRODUCT AND PACKAGING DRAWING 92927 13 - Body Assembly 9347080 - Test Mine, BLU 92/B (AP-40) INSPECTION EQUIPMENT DRAWINGS 11
13、83AS616 - Standard Wave Forms 2.2 Other Publications. The following documents form a part of this specification to the extent specified herein. Unless otherwise indicated, the issue in effect on the date of invitation for bids or request for proposal shall apply. CODE OF FEDERAL REGULATIONS TITLE 49
14、 - Transportation, Parts 100-199 (The Code of Federal Regulations is available from the Superintendent of Documents, US Government Printing Office, Washington, DC 20402. specify, “49 CFK 100-199 (latest revision)“). Orders should 3 Provided by IHSNot for ResaleNo reproduction or networking permitted
15、 without license from IHS-,-,-MIL -B-63 5 1 2 ( AR) AMERICAN SOCIETY FOR TESTING AND MATERIALS ASTM E 18 - Standard Method of Test for Rockwell Hardness (Application for copies should be addressed to : and Materials, 1916 Race Street, Philadelphia, PA 19103.) American Society for Testing (Copies of
16、specifications, standards , drawings, and publications required by contractors in connection with specification procurement functions should be obtained from the procuring activity or as directed by the Contracting Officer .) 3. REQUIREMENTS 3.1 Materials, Materials shall be in accordance with the a
17、pplicable drawings, specifications and standards 3.2 Components and assemblies. The components and assemblies shall comply with all requirements specified on Drawing (Dwg) 9292713, all associated drawings , and with all requirements specified in applicable specifications and standards. 3.3 Environme
18、ntal conditioning. 3.3.1 Transportation vibration. The Body Assemblies shall be safe to handle and transport and shall Shaw no evidence of internal or external damage that Will affect the intended functions following transportation vibration Test No. 119, Procedure 2 of MIL-STD-331. 3.3.2 Temperatur
19、e conditioning of Body Assemblies. The Body Assemblies shall function as specified in 3.4 after temperature conditioning as follows: a. Cold, minus 40-50F for four (4) hours minimum (min). b. Ambient, for four (4) hours min. c. Hot, 145O+50F for four (4) hours min. 3.4 Functioning. After being condi
20、tioned as specified in 3.3.1 and 3.3.2, the Body Assembly, assembled in a test mine, shall be capable of arming and functioning hi that is, a transition from an open to closed switch condition. This requirement shall be tested as specified in 4.5.7.13 (applies after electronic arm). 3.6.12 Tripline.
21、 The tripline-sensor interface circuit shall initiate the function of the detonator firing circuit for the conditions specified in 3.6.12.1; however, it shall not function the detonator firing circuit for the conditions specified in 3.6.12.2. interface circuit shall be tested for as specified in 4.5
22、.7.7. (Applies after electronic arm). The sensitivity of the tripline-sensor 3.6.12.1 Turn on conditions. A resistance change from 3.9 x lo3 ohms + 5% to 10 x lo3 ohms f 5% that occurs after electronic arm at any one of the- four inputs of the t of 3.6.14.3 has turned off, and remain on as long as t
23、he electronics is functionally operable or is intentionally reset. 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-B-63532 33 = 7777706 0353272 3 W 3.6.14.2 Pressure cartridge firing circuit. When functioned, the pressure cartridge firing circu
24、it shall remain on for only one PTB clock count. 3.6.14.3 Detonator firing circuit. When functioned, the detonator firing circuit shall remain on for 64 minimum and 128 maximum PTB clock counts. Thereafter, it shall remain off as long as the electronics is functionally operable or is intentionally r
25、eset. 3.7 Low temperature operation. The electronic assembly shall meet the performance characteristics specified in 3.6 at minus 40 -5OF when tested as specified in 4.5.7.17. 3.8 High temperat Ure operation. The electronic assembly shall meet the performance characteristics specified in 3.6 at 1450
26、 + 5OF when tested as specified in 4.5.7.16. 3.9 Soldering. Soldering procedures and acceptance criteria for the soldered components shall be in accordance with MIL-S-45743 and MIL-S-46844, except as specified in Appendix A herein. 3.9.1 Solderability. Electronic assembly parts that are to be solder
27、ed shall comply with the solderability requirements of MIL-S-45743, MIL-S-46844 and Appendix A herein. 3.10 Verification of safe condition of S however, a few light scratches not exposing base material may be permitted. and sharply defined. They shall be The cleaning method used shall not be injurio
28、us to any parts, nor All required marking and stamping shall be neat 3.16.2 Electrical workmanship. All soldered electrical connections shall comply with MIL-S-45743, MU.,-S-46844, Appendix A herein, and requirements of applicable drawings. 9 Provided by IHSNot for ResaleNo reproduction or networkin
29、g permitted without license from IHS-,-,-4. QUALITY ASSURANCE PROVISIONS 4.1 Responsibility for inspection and standard quality assurance provisions. Unless otherwise specified herein or in the contract, the provisions of MIL-A-48078 shall apply and are hereby made a part of this detail specificatio
30、n. 4.2 Classification of inspections. The following types of inspection shall be conducted on this item. a. First Article Inspection b. Quality Conformance Inspection 4.3 First article inspection. 4.3.1 Submission. The contractor shall submit a first article sample, as designated by the Contracting
31、Officer, for evaluation in accordance with the provisions of 4.3.2 and 4.3.3. The first article sample shall consist of the items and sample quantities listed in Table I. 4.3.2 Inspections to be performed. 4.3.2.1 Components and subassemblies. See MU-A-48078 and Table I spec if i ed here in. 4.3.2.2
32、 Electronic assemblies. The electronic assemblies listed in Table I (48 with AD switches and 48 without AD switches) shall be subjected to the folluwing tests prior to assembly into body assemblies. The Electronic Assemblies shall be serialized to identify the units with AD switches from the units w
33、ithout AD switches. Further, the serial numbers shall also be used for the Body Assemblies and Test Mines containing the electronics. 4.3.2.2.1 Temperature cycle. Subject the electronic assemblies to temperature cycle per MIL-STD-202, Method 107D, Condition Al, except that the temperature range shal
34、l be -65OF to 16O0F. (Non-destructive test) 4.3.2.2.2 Mechanical shock. Following temperature cycle, subject the electronic assemblies to mechanical shock per MIL-STD-202, Method 213B, Condition E with a 1OOOg peak and 2ms max duration. (Non-destructive test). 4.3.2.2.3 Performance test. Following m
35、echanical shock, the electronic assemblies perf ormance characteristics shall be verified by testing as specified in 4.4.2.14, ambient condition only. The test sample shall be rejected if, during test, a defect occurs. (Non-destructive test) 4.3.2.3 Body assemblies. The body assemblies listed in Tab
36、le Is manufactured using electronic assemblies from 4.3.2.2.3 and complying with 4.4.2.52 shall be assembled in to test mines (4.4.5) and subjected to the function tests of 4.3.2.4. 10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-13-63 5 1 2 (
37、 AR) 4.3.2.4 Function tests. The test mine assemblies shall be function tested in the mode and temperature noted in figure 1. preconditioned at only one temperature for a minimum of four (4) hours without borerider clips installed. Within five (5) minutes after being removed from the conditioning ch
38、amber, the test mines shall have borerider clips installed and shall be launcned to enable the S i i I , i 28 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-d 8 t 4 CIh kk alal 3 O .rl 3 50 als a kkhiJ al o ou al a u bo7 dal76CO Ea, .rlP 8 .rl U cd
39、G .rl B (d C u ou al k .rl 3 -8 c, C .rl k a al 4 P al d E! 8 .rl u u al a O C .rl a v) .I4 3 2 .rl k 7 a a O rcI w .rl u u al VI al a LI 5 . L) 8 8 8 2 B H a .rl u .rl X w w O v1 a u QI c B 29 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-! d 8 t d a 4 4 N . G G - ow $s mm Na-2 No“ O0 O00 * ?$? o- O0 O00 a o) o nrl CCI o, z 8 h In rn O P k .I4 m u Q) k a 4 2 2 8 B w Q) .?I c M ow Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
