1、 MIL-HDBK-115B(ARMY) 27 APRIL 2011 SUPERSEDING MIL-HDBK-115A(ARMY) 1 JUNE 2006 DEPARTMENT OF DEFENSE HANDBOOK US ARMY REVERSE ENGINEERING HANDBOOK (GUIDELINES AND PROCEDURES) This handbook is for guidance only. Do not cite this document as a requirement. AMSC N/A AREA MISCNOT MEASUREMENT SENSITIVE P
2、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) ii FOREWORD 1. This handbook is approved for use by the Department of the Army and is available for use by all Departments and Agencies of the Department of Defense. 2. This handbook
3、provides guidelines and procedures for reverse engineering, and can be employed by in-house personnel, engineering services contractors, and manufacturing contractors performing reverse engineering. 3. Comments, suggestions, or questions on this document should be addressed to Commander, US Army Avi
4、ation and Missile Command, ATTN: AMSRD-AMR-SE-TD-ST, Redstone Arsenal, AL 35898-5000 or emailed to malinda.allcorn1us.army.mil. Since contact information may change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.daps.dla.mil/. Provi
5、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) iii CONTENTS PARAGARAPH PAGE 1. SCOPE 1.1 Scope 1 2. APPLICABLE DOCUMENTS 2.1 General. 1 2.2 Government documents. 1 2.2.1 Specifications, standards, and handbooks 1 2.3 Non-Government pu
6、blications. 2 2.4 Order of precedence. 5 3. DEFINITIONS 3.1 Applicable definitions. 5 4. GENERAL GUIDANCE 4.1 Background. 5 4.2 Rationale. 5 4.3 DoD replenishment parts breakout program DAR-S6. 6 4.4 Data rights. 6 4.4.1 Proper use. 6 4.4.2 Data screening. 7 4.4.3 Formal authorization. 7 4.4.4 Paten
7、t restrictions 7 5. DETAILED GUIDANCE 5.1 The reverse engineering process 8 5.1.1 Primary objective 8 5.1.2 Recommended changes. 9 5.2 Functional/economics analysis 9 5.3 Data collection. 9 5.3.1 Documentation 9 5.3.2 Data collection phase. 9 5.4 Alternate data sources 10 5.4.1 Typical documentation
8、 10 5.4.2 Verbal input. 10 5.4.3 Technical manuals. 10 5.4.4 Command sources of information. 11 5.5 Screening of requested documentation 11 5.6 Candidate file. 11 5.7 Data evaluation 12 5.8 Missing data required 12 5.8.1 Identify missing data. 12 5.8.2 Technical documentation 12 Provided by IHSNot f
9、or ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) iv PARAGARAPH PAGE 5.8.3 Data evaluation considerations 13 5.8.4 Data call sheet 14 5.9 Hardware required. 14 5.10 Test requirements 14 5.10.1 Initial inspection 14 5.10.2 Test plan objective. 14 5.10.3
10、 Worse-case analysis. 15 5.11 Reverse engineering cost-estimate and schedule. 15 5.11.1 Review. 15 5.11.2 Development 15 5.11.3 Sample cost-estimate. 15 5.11.4 Prototype values 15 5.11.5 Dollar values 15 5.12 Disassembly procedures. 15 5.13 Initial inspection and testing. 16 5.13.1 Post-shipment ins
11、pection 16 5.13.2 Pre-disassembly photographs 16 5.14 Physical configuration audit (PCA) 16 5.14.1 Formal examination 16 5.14.2 Hardware/documentation comparison 16 5.15 Initial measurements. 16 5.16 Disassembly 17 5.16.1 Record keeping. 17 5.16.2 Parts control 17 5.16.3 Terminal/pin markings 17 5.1
12、6.4 Inseparable assemblies 17 5.17 Parts identification/screening 17 5.17.1 Identification. 17 5.17.2 Economic analysis 17 5.17.3 Document research 18 5.17.4 Master Cross-Reference List (MCRL) 18 5.17.5 Government-Industry Data Exchange Program (GIDEP). 18 5.17.5.1 Identify sources 18 5.17.5.2 GIDEP
13、 representatives/membership. 19 5.17.5.3 Additional sources of data. 19 5.18 Technical data package requirements 19 5.19 Reverse engineering management plan. 19 5.19.1 Reverse engineering management plan objective 19 5.19.2 Management plan development. 19 5.19.3 Tasking plan. 19 5.19.4 Program Evalu
14、ation and Review Technique (PERT) Chart 20 5.19.5 Identify lead times. 20 5.20 Hardware analysis. 20 5.20.1 Hardware analysis objective 20 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) v PARAGARAPH PAGE 5.20.2 Accuracy 20 5.21 D
15、imensional analysis. 20 5.21.1 Dimensional analysis objective. 20 5.21.2 Considerations. 21 5.21.3 Process variation 22 5.21.4 Establish tolerances. 22 5.21.5 Lot determination 23 5.22 Material analysis. 23 5.22.1 Material analysis objective. 23 5.22.2 Sample size 23 5.23 Electrical/electronic analy
16、sis. 23 5.23.1 Electrical/electronic analysis objective 23 5.23.2 Validate documentation. 23 5.23.3 Complete documentation. 24 5.23.4 Incomplete documentation 24 5.23.5 Design validation. 24 5.23.6 Environmental requirements. 25 5.23.7 Performance characteristics. 25 5.24 Engineering sketches and sp
17、ecifications. 25 5.24.1 Engineering sketches and specifications objective 25 5.24.2 Technical data requirements 26 5.24.3 Test requirement specifications. 26 5.25 Level 3 drawings. 26 5.25.1 Level 3 drawings objective. 26 5.25.2 Preparation. 26 5.25.3 Content. 26 5.25.4 Considerations. 27 5.25.5 Dra
18、wing media 28 5.25.6 Completeness of drawings. 28 5.25.7 Computer-generated drawings. 28 5.25.8 Library files. 28 5.25.9 Drawing references 28 5.25.10 Quality control review. 28 5.25.11 Candidate file inclusions 28 5.26 Producibility study 29 5.26.1 Purpose 29 5.26.2 Areas of consideration. 29 5.26.
19、2.1 Dimensions/tolerances. 29 5.26.2.2 Materials 29 5.26.2.3 Heat treatment. 30 5.26.2.4 Finishes 30 5.26.2.5 Clean and joining methods 30 5.26.2.6 Coatings. 30 5.26.2.7 Selection of standard parts/components 30 Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
20、m IHS-,-,-MIL-HDBK-115B(ARMY) vi PARAGARAPH PAGE 5.26.2.8 Quality assurance provisions. 30 5.26.3 Drawing maintenance 31 5.27 Quality control (QC) 31 5.27.1 QC study 31 5.27.2 QC plan 31 5.27.3 QC inspections 31 5.27.4 QC program. 32 5.28 Quality assurance provisions (QAPS). 32 5.28.1 QAPs objective
21、. 32 5.28.2 QAPs required. 32 5.28.3 QAPs not required. 32 5.28.4 Characteristic classification. 32 5.29 Documentation quality control 33 5.29.1 QC review. 33 5.29.2 Inspection of drawings 33 5.29.3 Limited physical configuration audit (PCA). 33 5.29.4 Rejection criteria 33 5.30 Certificate of compl
22、iance. 33 5.31 Production review. 33 5.32 Estimates. 33 5.33 Make-or-buy. 34 5.34 Schedules. 34 5.35 Should-cost. 34 5.35.1 Data development 34 5.35.2 Actual costs and schedules 34 5.35.3 Results 34 5.36 Prototype production. 34 5.36.1 Prototype production objective. 34 5.36.2 Sub-contracting. 34 5.
23、36.3 Record maintenance 34 5.37 Procurement 34 5.38 Parts fabrication. 34 5.39 Inspection and quality control. 35 5.39.1 Inspection 35 5.39.2 Quality control plan 35 5.40 Assembly. 35 5.41 Test. 35 5.41.1 Validate concepts 35 5.41.2 Focus on conformance 35 5.42 Certificate of compliance 35 5.43 Fina
24、lize TDP. 35 5.43.1 Formulate/deliver TDP. 35 5.43.2 Include changes. 35 5.43.3 Procedures. 36 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) vii PARAGARAPH PAGE 5.44 Additional engineering/logistical considerations 36 5.44.1 Re-
25、evaluate design. 36 5.44.2 Follow-on considerations. 36 5.44.2.1 End-item TDP update 36 5.44.2.2 Integrated logistics support (ILS) 36 5.45 Engineering recommendations 36 5.45.1 Product improvement. 36 5.45.1.1 Inadequate data. 36 5.45.1.2 Engineering evaluation. 36 5.45.1.3 Product reliability 36 5
26、.46 Value engineering 37 5.46.1 Value engineering objective 37 5.46.2 Documented results. 37 5.46.3 Logistics support analysis/record 38 5.46.4 Manual reviews. 38 6. NOTES 6.1 Intended use. 38 6.2 Subject term (key words) listing 38 6.3 Changes from previous issue. 38 APPENDICES Appendix A Acquisiti
27、on method code/acquisition method suffix code, definitions. 39 Appendix B Data rights, definitions and valid legends 43 Appendix C Engineering drawings (levels/types/content) 50 Appendix D Reference documents. 56 FIGURES 1. The reverse engineering process (5.1). 59 2. Sample data call sheet (5.8.4).
28、 60 3. Sample test plan format (5.10). 61 4. Cost-estimating guide No. 1 (5.11.3). 64 5. Value engineering study and value engineering proposal (5.46.1). 69 CONCLUDING MATERIAL. 71 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) 1
29、 1. SCOPE 1.1 Scope. This HANDBOOK, which provides the guidelines and procedures for performing reverse engineering, was created using current applicable laws and knowledge gained during a trial program from July 1985 to April 1987, and is based on experiences obtained from military and industry par
30、ticipants. This handbook is for guidance only and cannot be cited as a requirement. . APPLICABLE DOCUMENTS 2.1 General. The documents listed below are not necessarily all of the documents referenced herein, but are those needed to understand the information provided by this handbook. 2.2 Government
31、documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. MILITARY SPECIFICATIONS MIL-E-2036 Enclosure for Electrical and Electronic Equipment, Naval Shipboard MIL-STD-31000 Technical
32、 Data Packages, Standard Practice for FEDERAL STANDARDS Screw-thread Standards for Federal Services Section 18 Photographic Equipment Threads MILITARY STANDARDS MIL-STD-22 Welded Joint Design MIL-STD-171 Finishing of Metal and Wood Surfaces Provided by IHSNot for ResaleNo reproduction or networking
33、permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) 2 MIL-STD-1916 DoD Preferred Methods for Acceptance of Product MILITARY HANDBOOKS MIL-HDBK-1264 Radiographic Inspection for Soundness of Welds in Steel by Comparison to Graded ASTM E390 Reference Radiographs MIL-HDBK-1265 Radiographic Inspec
34、tion Classification and Soundness Requirements for Steel Castings (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications.
35、 The following documents form a part of this document to the extent specified herein. INDUSTRY STANDARDS American National Standards Institute (ANSI) ANSI B4.1 Preferred Limits and Fits for Cylindrical Parts AWS A2.4 Standard Symbols for Welding, Brazing, and Non-destructive Examination AWS A3.0 Wel
36、ding Terms source control; or annual buy value (ABV) less than $10,000 or a dollar amount set by current requirements. Upon completion of the breakout screening and coding process, candidates for reverse engineering are identified as items which have been assigned a competition-restrictive AMC/AMSC
37、code based on unavailable technical data. Spare parts with AMC/AMSC codes which are in a suspended status (pending further investigation, resolution, or recoding) should not be considered as candidates for reverse engineering until the breakout process has been completed. Candidates may also be reco
38、mmended for breakout when the item demonstrates a 25% increase in unit price over the previous year. Regardless of AMC/AMSC codes and unit price, when a part cannot be procured but is mission critical, all efforts must be made to obtain the spare part. This may include reverse engineering even when
39、it is uneconomical. Appendix A provides a listing of the AMC/AMSC codes and definitions, and is included for information purposes. 4.4 Data rights. Reverse engineering is a LEGAL and ETHICAL method of design replication 4.4.1 Proper use. Reverse engineering is deemed proper when: a. The procurement contract does not contain any clauses prohibiting reverse engineering, either specifically or by implication; b. The organization performing the reverse engineering effort
