1、fliL-I-qbqb 13 9999906 0322784 7 MIL-M-48646(AR) 20 October 1986 MILITARY SPECIFICATION MICROCIRCUIT, DIGITAL, SCO/DLA MULTICHIP CMOS This specification is approved for use within the U.S. Army Armament, Munitions and Chemical Command, and is available for use by all Departments and Agencies of the
2、Department of Defense. 1. SCOPE 1.1 Scope. This specification establishes the detailed n requirements for a monolithic CMOS, integrated circuit. 1 2. APPLICABLE DOCUMENTS -1 1 2.1 Government documents. 2.1.1 Specifications and standards. Unless otherwise specified, the following specifications and s
3、tandards of the issue listed in that issue of Department of Defense Index of Specifications and Standards (DODSIS) specifi-ed in the solicitation, form a part of this specification to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-3 8510 - Microcircuits, General Specification For. MIL-M-
4、55565 - Microcircuits, Packaging of MIL-A-4 8 O 7 8 - Ammunition, Standard Quality Assurance Provisions, General Specification for STANDARDS MILITARY MIL-STD-105 - Sampling Procedures and Tables For Inspection by Attributes MIL-STD-883 - Test Methods and Procedures for Microelectronics Beneficial co
5、mments (recommendations, additions, deletions) and any pertinent data which may be of use in improv- ing this document should be addressed to: Commander, U.S. Army Armament Research, Development and Engineer- ing Center, Attn: AMSMC-QA, Dover, New Jersey 07801-5001 by using the self-addressed Standa
6、rdization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. THIS DOCUMENT CONTAINS /A PAGES. FSC 1345 Approved for public release; distribution is unlimited. - AMSC N/A DISTRIBUTION STATEMENI A. Provided by IHSNot for ResaleNo reproduction or networking
7、 permitted without license from IHS-,-,-2.1.2 Other Government documents, drawinqs, and publications. The following other Government documents form a part of this specification to the extent herein. DRAWINGS U.S. ARMY ARMAMENT RESEARCH, DEVELOPMENT AND ENGINEERING CENTER ( ARDEC) 9333744 - Microcirc
8、uit, Digital, SCO/DLA Multichip 9355162 - Microcircuit, Digital, SCO/DLA Test h Spec i f icat ion ! 2 2.1.2 Other publications. The following documents form a part i of this specification to the extent specified herein. The issues of the documents which are indicated as DOD and the supplement theret
9、o, if applicable. (Copies of specifications, standards, drawings and publications required by the suppliers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the contracting officer). 2.1.3 Order of precedence. In the event of a confli
10、ct between the text of this specification and the references cited herein, the text of this specification shall take precedence. 0 3. REQUIREMENTS 3.1 Design and Construction. Microcircuit design and construction shall be in accordance with all the requirements specified herein and in the detail spe
11、cification drawing 9333744. 3.1,l Physical dimensions. The package dimension shall conform to drawing 9333744. 3.1.2 Package. The finished component shall be a 22 pin hermetically sealed package as shown in drawing 9333744. The lead finish shall be in accordance with MIL-M-38510, Finish A, B, or C.
12、3.1.3 Lead or terminal material and finish. Lead or terminal material and finish shall conform to the applicable requirements of MIL-M-38510 paragraph 3.5.6. 3.1.4 Pin assiqnment. The pin assignment shall be in accordance with figure 1. 2 Provided by IHSNot for ResaleNo reproduction or networking pe
13、rmitted without license from IHS-,-,-MIL-M-48b4b 13 m 7979706 0322786 2 m MIL-M-48646 (AR)- DC THRESH - TWDEP TWIN SLCLK 1 MECHARM RF - LVDIN PSD -3 RT FIGURE 1. PIN ASSIGNMENT 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-4 8646 (AR) 3.2 F
14、unctional description. The functional output of the microcircuit shall be in accordance with all the requirements specified herein and in the test specification 9355162. 3.2.1 General. This component is designed to be used in conjunction with a bipolar R.F. amplifier to provide a miniature, micropow
15、er, high frequency, dual conversion superhetrodyne secured data link FM radio reciever. The component shall function primarily as a timer and a special purpose digital pattern decoder. The pattern to be decoded shall hereafter be referred to as the message and shall be in a frequency shift keyed (FS
16、K) Manchester format. The component shall also be electrically programmable. The digital pattern used to program the component shall hereafter be referred to as the field set data. A specified message shall be processed through each of the component electrical circuit functions without A operational
17、 degradation. 3.3 Environmental and mechanical. Devices to be delivered under this specification shall be capable of meeting the following MIL-STD-883 environmental and mechanical tests when the devices are subjected to these tests in accordance with this specification. Environmental Tests Method Co
18、nditions Mo ist Ure. res ist ance Steady state life 1005 D, 1000 hrs 125OC Temperature cycling 1010 C, 10 cycles (A or B ti C) Seal (Fine and Gross) 1014 Burn- in 1015 D, 168 hours L25OC 1004 High temperature storage iooa C respectively Mechanical Tests Method Conditions Constant acceleration Mechan
19、ical shock Solderability Lead integrity Resistance to solvents Vibration, variable frequency External visual Internal visual Bond strength Physical dimensions 2001 E, Y1 orientation only 2002 B 2003 2004 B2 2015 2007 A 2009 2010 B 2011 D 2016 4 Provided by IHSNot for ResaleNo reproduction or network
20、ing permitted without license from IHS-,-,-3.4 Performance charcteristics. 3.4.1 Absolute maximum ratings. The component absolute maximum ratings shall be in accordance with values specified in Table I herein. TABLE I. Maximum Ratings CHARACTERISITICS s !am OL RATING UNITS Power Supply Voltage VDD 8
21、. O Input Voltage Range VI -0.5 to VDD +O. 5 V V Operating Range - l/ TA(OP) -370 to +57oC OC Storage Temp. Range TA(ST) -55 to +125 OC input Current Pins 12 and 13 II +1 o - A - 1/ Component shall be capable of burn-in at +125oC 3.4.2 Operatinq characteristics. The component shall be operable in th
22、e conditions specified in Table II of dwg. 9355162. 3.4.3 Electrical performance characteristics. The component shall meet the electrical performance characteristics specified in Table III of Dwg. 9355162. electroplated. or solder dipped per MIL-M-38510, paragraph 3.5.6.2 (a) or (b) and if acid tin
23、electroplated, the minimum plating must be 150 microinches. Parts must also be solderable per MIL-STD-883, method 2003. 3.4.4 Solderability. External leads must be acid tin 3.5 Screeninq. All devices shall be 100% screened in full accordance with MIL-STD-883, method 5004, class B. Final electrical t
24、ests shall include all parameters specified in Tables II and III of Dwg 9355162. Burn-in circuit shall be as shown in figure 2 herein, or equivalent . 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. MIL-M-4b4b 13 E 999990b 0322789 MIL-M-48646 (AR
25、) +V FIGURE 2. BURN-IN CIRCUIT OR EQUIVALENT 3.6 Part marking. Only parts having met ail requirements herein shall be marked with the following information in accordance with MIL-M-38510: (A) manufacturers name or symbol, (B) manufacturers date code (traceable to the wafer manufacturerls diffusion r
26、un) , (C) the source control number “1920050CN9333744“. Note: Once the part has been marked, the part is classifed confidential and shall be handled as such. his own use, on the bottom surface of the package provided that these markings do not interfere with the required markings. 3.6.1 Other marks.
27、 The vendor may add additional markings, for 3.6.2 Resistance to solvent. The marking shall remain legible when subjected to the resistance to solvents testing of MIL-STD-883, Method 2015. manufacturing of microcircuits to assure a reliable end item shall be submitted to the designated agency specif
28、ied in 6.3 herein prior to the start of fabrication. 3.7 Process control. All process controls essential for the 3.8 Workmanship. (See MIL-M-38510). 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-48646(AR) 4. QUALITY ASSURANCE PROVISIONS 4.1
29、 Responsibility for inspection and standard quality assurance provisions. Unless otherwise specified herein or in the contract, the provisions of MIL-M-38510 shall apply and are hereby made part of this detail specification. The supplier is responsible for the performance of all inspection requireme
30、nts as specified herein, and the supplier may use his own or any other facilities suitable for the performance of the tests and inspection requirements specified herein, unless disapproved by the Government. In addition, the Government reserves the right to witness or to perform any of these tests a
31、nd inpections set forth in this specification where such test and inspections are .deemed necessary to assure that supplies and services conform to prescribed requirements. The Government reserves the right to audit the data resulting from the manufacturers performance of these tests and inspections
32、. 4.2 Classification of inspections. The following types of inspection shall be conducted on this item. a. First Article Inspection b. Quality Conformance Inspection c. Screening 4.3 First article inspection. 4.3.1 Submission. The contractor shall submit a first article sample as designated by the C
33、ontracting Officer for evaluation in accordance with the provisions of 4.3.2 The first article inspection lot size after screening shall consist of fifty (50) devices , minimum. 4.3.2 Inspection to be performed. First article inspection shall be in accordance with the applicable requirements of MIL-
34、M-38510 and as modified by this specification, excepth that the procuring agency shall be the qualifying activity. First article requirements shall consist of inspections specified in subgroups “a“ through “f“ listed in Table IV herein. First article items may be subjected by the qualifying activity
35、 (Government) to all of the examinations and tests specificed in this specification and to any requirements af the applicable drawings. 4.3.3 Rejection. If any device fails to comply with any of the applicable requirements, the first article sample shall be rejected. The Goverment reserves the right
36、 to terminate its inspection upon any failure of a device in the sample to comply with any of the stated requirements. 7 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-L MIL-M-Ybqb 13 I$BI 9997906 0322771 b 4.3.4 Requalification. The device shall
37、be subjected to another First Article as stipulated in the contract if: .a. The contractors manufacturing techniques or process affect the form, fit, function or .internal geometry of the device by either the contractor.or one of his sub-contractors supplying parts as sembl ies . b. c. The contracto
38、r relocated his assembly facilities. The contractor uses a new sub-contractor for material, parts, or assembly. d. assembly. A change occurs in devices material, performance, or 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-c O -4 U u a, .4 .rl 1
39、 U m Li *Fi . H 2 w 4 E E B MIL-M-4b46 13 7779706 0322772 . mm -. mm w-m mmmmmmw mm mmm mmmmmmm m- m o. 0.0 00 . . o . . I h c In m In N m IN Y m- o c al 1 tF d) G iu a, u % +I u % m 4J c a, 3 rl O m O 4J um Pul 5a, 4 VlF: ! 9 Provided by IHSNot for ResaleNo reproduction or networking permitted with
40、out license from IHS-,-,-I MIL-M-48646 13 7777906 0322793 T U - I- I W . 3 5 O a, u c a, o( a, m a, a 5 c c .d 10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-4b4b I3 777770b 032277L1 I MIL-M-48646 (AR) 4.4 Quality conformance inspection. 4.
41、4.1 Inspection lot fgrmation. Inspection lots formation 4.4.2 Examination, shall be as defined in MIL-Mi38510 for Class B devices. a. Quality conformance inspection requirements shall be in accordance with Tables I, II, III and specified herein. b. Inspection requirements. Inspection requirements fo
42、r this device shall be in accordance with the requirements of MIL-M-38510 and MIL-STD-883Bf Method 5005 (Class B). c. Conformance testinq. Groups A, BI C, and D test procedures shall be in accordance with MIL-STD-883, Method 5005, Class B. Group A electrical tests shall include al1 parameters specif
43、ied in Tables II: and III of Dwg 9355162. Groups C and D end point parameters shall include all parameters specified in Table herein. Sampling plan shall be in accordance with applicable paragraphs of MIL-M-38510 , Appendix B. d. General inspection conditions. Disposition of failed lots and lot resu
44、bmission procedures shall be in accordance with applicable paragraphs of MIL-M-38510. 4.5 Test methods, circuits and procedures. 4.5.1 Alternate methods, circuits and procedures. Unl-ess otherwise stated in the specific test method, the methods and circuits shown are given as the basic measurement m
45、ethod. For alternate methods, circuits and procedures the manufacturer shall demonstrate to the procuring activity that alternates which he may desire and propose to use are equivalent and give results within the desired accuracy of measurement (See 6.3). 4.5.2 Test conditions. Unless otherwise spec
46、ified all examinations and tests shall be made under the following conditions: Temperature - 250 f 3OC Humid i ty - 10 to 70 percent RH - 29 + 3 inches of Hg Pressure - 5. PACKAGING 5.1 Packaqinq. Requirements for packaging shall be in accordance with MIL-M-38510, including provisions for electrosta
47、tic protection and MIL-M-55565. Shipping of classified materials shall conform to the requirements established by the Department of Defense for confidential materials using the signature security service. 11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
48、S-,-,-6. NOTES 6.1 Intended use. This microcircuit is part of the MOPMS Mine 6.2 Orderinq data. Procurement documents shall specifiy the Electronics Assembly. , following: a. Title, number and date of this specification. b. Provisions for submission of first article samples. c. Provisions of MIL-A-4
49、8078. 6.3 Submission of inspection equipment desiqns for approval. (See MIL-A-48078) Submit equipment designs as required to Commander, US Army Armament Research, Development and Engineering Center, AMSMC-QAT-I (D) , Dover, New Jersey 07801-5001. 6.4 Distribution of ammunition data cards. Distribution of data cards shall include the
