1、INCH-POUNDMIL-PRF- 49168C(CR)27 AUGUST 1997SUPERSEDINGMIL-S- 49168B(CR)6 November 1987PERFORMANCE SPECIFICATIONSCAN-INTERLACE, PL-1403/UA, PL-1403A/UAThis performance specification is approved for use by USACECOM, Department of theArmy, and is available for use by all Departments and Agencies of the
2、 Department of Defense.1. SCOPE1.1 Scope . This performance specification covers one type of common module with twointerchangeable models ; Scan-Interlace (30Hz) PL-1403/UA and PL-1403A/UA.2. APPLICABLE DOCUMENTS2.1 General . The documents listed in this section are specified in sections 3 and 4 of
3、thisspecification. This section does not include documents in other sections of this specification orrecommended for additional information or as examples. While every effort has been made toensure the completeness of this list, document users are cautioned that they must meet allspecified requireme
4、nts documents cited in sections 3 and 4 of this specification, whether or notthey are listed.2.2 Government documents .2.2.1 Specifications, standards and handbooks . The following specifications, standards,and handbooks form a part of this document to the extent specified herein. Unless otherwisesp
5、ecified, the issues of these documents are those listed in the Department of Defense Index ofSpecifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2).Handbooks are for guidance only and therefore are not mandatory.Beneficial comments (recommendations, additio
6、ns, deletions) and any pertinent data which maybe of use in improving this document should be addressed to : HQ, USA Communications-Electronics Command, ATTN: AMSEL-LC-LEO-E-EP, Fort Monmouth, NJ 07703 by using theStandardization Document Improvement Proposal (DD Form 1426) appearing at the end of t
7、hisdocument or by letter.AMSC N/A FSC 5855DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF- 49168C(CR)2HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-338/1 - Electron ic
8、 Design ReliabilityMIL-HDBK-454 - Standard General Requirements for ElectronicEquipment.MIL-HDBK-742 - Waste Disposal Methods for Military PackagingMaterialsMIL-HDBK-781 - Reliability Testing for Engineering Developmentand Production Qualification(Unless otherwise indicated, copies of the above spec
9、ifications, standards and handbooksare available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,Philadelphia, PA 19111-5094).2.2.2 Other Government documents, drawings and publications . The following othergovernment documents, drawings and publications form a part of
10、this specification to the extentspecified herein. Unless otherwise specified, the issues are those cited in the solicitation (see 6.2).The drawings listed below are to be used to ensure accurate interface of the item produced underthis performance specification with existing hardware.DRAWINGSUSA CEC
11、OMSM-D-657596 - ESD, Scan-Interlace PL-1403A/UASM-D-657597 - PWB, Scan-Interlace PL-1403A/UASM-D-657598 - Scan-Interlace PL-1403A/UASM-D-657599 - Scan-Interlace PL-1403A/UA Outline Dimensions and InstallationSM-C-772134 - Jack, TipSM-C-772278 - Connector, Receptacle, ElectricalSM-C-773501 - Connecto
12、r, Receptacle, Electr icalSM-D-773948 - Schematic Diagram, Scan and InterlaceSM-D-773949 - Printed Wiring Board, Scan and Interlace 30 HzSM-D-773950 - Scan-Interlace (30Hz) PL-1403/UA(Copies of documents, drawings, and publications required by contractors in connectionwith specific procurement funct
13、ions should be obtained from the procuring activity or as directedby the contracting officer).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF- 49168C(CR)32.3 Non-Government publications . The following documents form a part of this documentto
14、 the extent specified herein. Unless otherwise specified, the issues of the documents which areDoD adopted are those listed in the issue of the DoDISS cited in the solicitation. Unlessotherwise specified, the issues of documents not listed in the DoDISS are the issues of thedocuments cited in the so
15、licitation (see 6.2).AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)ASTM E 122-89 - Sample Size to Estimate a Measure of Quality for a Lot or Process(Application for copies should be addressed to the American Society for Test ing andMaterials, 1916 Race Street, Philadelphia, PA 19103-1187).AMERICA
16、N NATIONAL STANDARDS INSTITUTE (ANSI)ANSI/IPC S-815A - General Requirements for Soldering ElectronicInter-Connections(Application for copies should be addressed to the American National Standards InstituteInc., 1430 Broadway, N.Y., N.Y. 10018).AMERICAN SOCIETY FOR QUALITY CONTROL (ASQC)ANSI/ASQC Z 1
17、.4 - Sampling Procedures; Tables for Inspection byAttributes(Application for copies should be addressed to the Ameri can society for Quality Control,Inc. P.O. box 3005, 611 East Wisconsin Avenue, Milwaukee, WI, 53202).2.4 Order of precedence . In the event of a conflict between the text of this docu
18、ment andthe references cited herein, the text of this document takes precedence. Nothing in thisdocument, however, supersedes applicable laws and regulations unless a specific exemption hasbeen obtained.3. REQUIREMENTS3.1 First article . Where specified in the contract (see 6.2), the contractor shal
19、l furnish firstarticle units for inspection (see 4.2).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF- 49168C(CR)43.2 Materials . The contractor shall select the materials, but the materials and parts usedshall be fully capable of meeting all
20、 of the operational and environmental requirements specifiedherein. The materials specified in the applicable drawings are recommended, but are notmandatory. Selection criteria of the class, grade or type part shall be that the material will beable to perform its intended function when it is assembl
21、ed. Verification of the supplier meetingthe overall performance requirements shall be the governing acceptance standard. Recoveredmaterials shall be used to the maximum extent possible.3.3 Description . The Scan-Interlace PL-1403/UA and PL-1403A/UA, consists of aprinted wiring board (PWB) and circui
22、try to drive a mechanical scanner at 30Hz scan rate in lowpower infrared systems. The two models differ in their internal configuration but are identical inperformance and external configuration. In system usage, they are, and must be, completelyinterchangeable.3.3.1 Design . The Scan-Interlace shal
23、l meet form, fit, function and interface requirementsas specified herein.3.3.2 Weight . The weight of the Scan-Interlace shall be equal to or less than 0.26 pound(4.16 ounces) when weighed with a balance or scale having an accuracy of 1% or better.3.3.3 Dimensions . The Scan-Interlace Printed Wiring
24、 Board (PWB) shall be of appropriatematerial with a nominal thickness of 0.062 inches and shall have dimensions of 3.02 inches x 3.48inches, + 0.02 inches. When mounted, components shall not extend more than a maximum of0.414 inches from the surface of the PWB. Two corners of the board on the 3.02 i
25、nch side awayfrom the two large connectors shall be trimmed at a 45 o angle between two points 0.25 inchesvertical and horizontal of the corners, removing a triangle of board material 0.25 by 0.25 on eitherside of the right angle (corner). The x-axis datum line shall be located parallel to the 3.48
26、inchedge of the board and 0.125 inches above that edge, with the two large connectors above it. Itshall pass through the two 0.094 inch diameter holes located 0.125 inches above the edge and0.290 inches and 3.190 inches in from the square edge. The y-axis datum line shall be located0.290 inches in f
27、rom the left-hand edge of the board. It shall pass through the two left-hand 0 .094inch diameter holes located 0.290 inches in from the left edge and shall be perpendicular to the x-axis datum line. Four mounting holes 0.140 inches in diameter shall be located 0.025 inches and2.750 inches above the
28、x-axis datum line and 0.245 inches and 2.370 inches to the right of the y-axis datum line as shown on Drawing SM-D-773949 or SM-D-657597. Two connectors shall beattached to the non-component side of the board for the purpose of interfacing with existinghardware. These connectors shall have the dimen
29、sions of Part Numbers SM-C-772278-3 and -4as shown on Drawing SM-C-772278, while the third connector, which is on the component sideof the board, shall have the dimensions of Part Number SM-C-773501-2 as shown on DrawingSM-C-773501. These connectors shall be located approximately as shown on Drawing
30、 SM-D-773950 or SM-D-657598 for P1, P2 and J1. Two tip jacks shall also be attached to thecomponent side of the board. These tip jacks shall mount approximately where shown onDrawing SM-D-773950 or SM-D-657598. The tip jacks shallProvided by IHSNot for ResaleNo reproduction or networking permitted w
31、ithout license from IHS-,-,-MIL-PRF- 49168C(CR)5meet the physical and electrical parameters of part numbers SM-C-772134-1 and -2 in accordancewith Drawing SM-C-772134 for the PL-1403/UA and part numbers SM-C-772134-2 and -6 inaccordance with Drawing SM-C-772134 for the PL-1403A/UA. They shall be loc
32、ated as shownon SM-D-773950 or Drawing SM-D-657598. The pinout assignments for the connectors shall bein accordance with Drawing SM-D-773948 or Drawing SM-D-657596 to ensure proper interfacewith existing hardware.3.4 Components . The Scan- Interlace shall contain manufactured components selected byt
33、he contractor as required to meet the performance specifications contained herein.3.5 Performance Characteristics .3.5.1 * Power consumption . The Scan-Interlace shall operate with the following voltages(see Figure 1), and total power shall not be greater than 2.2 watts:a. + 4.8, 0.1 Vdcb. - 4.8, 0.
34、1 Vdcc. +10.0, 0.1 Vdc and -10.0, 0.1 Vdc* Power shall be measured as the sum of the products of the power supply voltage andtheir average currents.3.5.2 Identification resistor verification . The Scan-Interlace shall contain twoidentification resistors as shown on SM-D-773948 or SM-D-657596.3.5.3 R
35、egulator voltage . The Scan-interlace shall contain a positive voltage regulatoradjustable to +3.40, 0.05 Vdc and a negative voltage regulator adjustable to -3.40, 0.05 Vdc.3.5.4 Transducer bridge voltage . The Scan-Interlace shall provide a transducer bridgevoltage which is adjustable to +1.25, 0.0
36、5 Vdc (NOTE : When this voltage is indicated, theactual bridge voltage, i.e., voltage applied across the bridge, is +2.15 Vdc). An average voltageshall be measured at this test point as per 4.5.4.3.5.5 Scan motor drive circuitry . The Scan-Interlace shall provide for adjustment of thescan drive wave
37、form to an amplitude of 1.5, 0.5 volts peak-to-peak (P-P) during the activeportion (see Figure 2).3.5.6 Interlace position amplifier . The Interlace Position Amplifier shall provide a gain of100, 10 volts per volt for signals generated by the Scanner Interlace Position Transducer.Provided by IHSNot
38、for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF- 49168C(CR)63.5.7 Position reference circuitry . The Scan-Interlace shall provide circuitry forgenerating a position reference waveform adjustable to an amplitude of 0.6, 0.2 volts P-P (seeFigure 3).3.5.8 Position
39、 error circuitry . The Scan-Interlace shall provide circuitry for generating aposition error waveform adjustable to 0.40, 0.15 volts P-P (see Figure 4).3.5.9 Rate reference circuitry . The Scan-Interlace shall provide circuitry that will producea rate reference waveform adjustable to an amplitude of
40、 0.6, 0.2 volts P-P( see Figure 5).3.5.10 Solenoid drive circuitry . The Scan-Interlace shall provide circuitry to develop andto equalize the scanner solenoid drive waveforms, with an amplitude of 0.10, 0.05 volts (seeFigure 6).3.5.11 Video gate . The Scan-Interface shall provide video gate electron
41、ics capable ofgenerating a video gate pulse width adjustable to 2.0, 0.2 milliseconds.3.5.12 Side/rear phasing . The Scan-Interlace shall accept and process the tachometer andinterlace position signals in both side and rear phase relationships when properly interconnected(see Figures 6, 7, 8, 9 and
42、10).3.6 Environmental conditions .3.6.1 Temperature shock . The Scan-Interlace shall not be damaged (see 6.4.1) by suddenchanges in temperature between -54 C and +95 C.3.6.2 High temperature . The Scan-Interlace shall not be damaged by storage to +95 C orcontinuous operation to +71 C and shall opera
43、te for 30 minutes at +95 C. The Scan Drivewaveform amplitude (Figure 2) shall not change more than 40% from the initial setup atambient temperature over the specified operating temperature range (+71 C). The SolenoidDrive waveform amplitude (Figure 6) shall not change more than 25% from the initial
44、setup atambient temperature over the specified operating temperature range (+71 C).3.6.3 Low temperature . The Scan-Interlace shall not be damaged by operation to -54 C,or storage to -62 C. The Scan Motor Drive waveform amplitude (Figure 2) shall not changemore than 40% from the initial setup at amb
45、ient temperature over the specified operatingtemperature range (-54 C). The Solenoid Drive waveform amplitude (Figure 6) shall not changemore than 25% from the initial setup at ambient temperature over the specified operatingtemperature range (-54 C).3.6.4 Shock . The Scan-Interlace shall not be dam
46、aged by high intensity shock of 100 gspeak amplitude with 11 milliseconds duration and by bench handling test.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF- 49168C(CR)73.6.5 Vibration . The Scan-Interlace shall not be damaged by vibration o
47、ver the frequencyspectrum at the specified “g” levels and amplitudes shown in Figure 11.3.7 Reliability . The Scan-Interlace shall have a mean time between failure (MTBF) of atleast 17,500 hours ( 0 ). Use of the procedures described in MIL-HDBK-338/1 and evaluationmethods per MIL-HDBK-781 are recom
48、mended (see 4.7).3.8 Coating . Unless otherwise specified, the assembly and its components and parts, shallbe cleaned and shall be protected by a conformal insulating coating.3.9 Preconditioning . Each Scan-Interlace shall be subjected to at least a 20-cyclepreconditioning environment as specified i
49、n Figure 12 prior to group A inspection. For anexception to this requirement, see 6.2.3.10 Soldering . Unless otherwise specified, electronic soldering shall conform toANSI/IPC-S-815A.3.11 Nameplates and product marking . The assembly, parts, components, subassembliesand assemblies, thereof, shall be marked for identification and reference designation.Requirement 67 of MIL-HDBK-454 may be
