1、Designation: C1130 17Standard Practice forCalibration of Thin Heat Flux Transducers1This standard is issued under the fixed designation C1130; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number in p
2、arentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice, in conjunction with either Test MethodC177, C518, C1114,orC1363, establishes procedures for thecalibration of heat flux transducers
3、 that are dimensionally thinin comparison to their planar dimensions.1.1.1 The thickness of the heat flux transducer shall be lessthan 30 % of the narrowest planar dimension of the heat fluxtransducer.1.2 This practice describes techniques for determining thesensitivity, S, of a heat flux transducer
4、 when subjected to onedimensional heat flow normal to the planar surface or wheninstalled in a building application.1.3 This practice shall be used in conjunction with PracticeC1046 and Practice C1155 when performing in-situ measure-ments of heat flux on opaque building components. Thispractice is c
5、omparable, but not identical, to the calibrationtechniques described in ISO 9869-1.1.4 This practice is not intended to determine the sensitivityof heat flux transducers used as components of heat flow meterapparatus, as in Test Method C518, or used for in-situindustrial applications, as covered in
6、Practice C1041.1.5 The text of this standard references notes and footnoteswhich provide explanatory material. These notes and footnotes(excluding those in tables and figures) shall not be consideredas requirements of the standard.1.6 UnitsThe values stated in SI units are to be regardedas standard.
7、 The values given in parentheses are provided forinformation only and are not considered standard.1.7 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety, health, a
8、nd environmental practices and deter-mine the applicability of regulatory limitations prior to use.1.8 This international standard was developed in accor-dance with internationally recognized principles on standard-ization established in the Decision on Principles for theDevelopment of International
9、 Standards, Guides and Recom-mendations issued by the World Trade Organization TechnicalBarriers to Trade (TBT) Committee.2. Referenced Documents2.1 ASTM Standards:2C168 Terminology Relating to Thermal InsulationC177 Test Method for Steady-State Heat Flux Measure-ments and Thermal Transmission Prope
10、rties by Means ofthe Guarded-Hot-Plate ApparatusC518 Test Method for Steady-State Thermal TransmissionProperties by Means of the Heat Flow Meter ApparatusC1041 Practice for In-Situ Measurements of Heat Flux inIndustrial Thermal Insulation Using Heat Flux Transduc-ersC1044 Practice for Using a Guarde
11、d-Hot-Plate Apparatus orThin-Heater Apparatus in the Single-Sided ModeC1046 Practice for In-Situ Measurement of Heat Flux andTemperature on Building Envelope ComponentsC1114 Test Method for Steady-State Thermal TransmissionProperties by Means of the Thin-Heater ApparatusC1155 Practice for Determinin
12、g Thermal Resistance ofBuilding Envelope Components from the In-Situ DataC1363 Test Method for Thermal Performance of BuildingMaterials and Envelope Assemblies by Means of a HotBox Apparatus2.2 ISO Standards:3ISO 9869-1 Thermal insulation Building elements In-situmeasurement of thermal resistance an
13、d thermal transmit-tance Part 1: Heat flow meter method3. Terminology3.1 DefinitionsFor definitions of terms relating to thermalinsulating materials, see Terminology C168.3.2 Definitions of Terms Specific to This Standard:1This practice is under the jurisdiction of ASTM Committee C16 on ThermalInsul
14、ation and is the direct responsibility of Subcommittee C16.30 on ThermalMeasurement.Current edition approved Sept. 1, 2017. Published October 2017. Originallyapproved in 1989. Last previous edition approved in 2012 as C1130 07 (2012).DOI: 10.1520/C1130-17.2For referenced ASTM standards, visit the AS
15、TM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from International Organization for Standardization (ISO), ISOCentral Secretariat, BIBC II, Ch
16、emin de Blandonnet 8, CP 401, 1214 Vernier,Geneva, Switzerland, http:/www.iso.org.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United StatesThis international standard was developed in accordance with internationally recognized principles on sta
17、ndardization established in the Decision on Principles for theDevelopment of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.13.2.1 maskmaterial (or materials) having the same, ornearly the same, thermal propertie
18、s and thickness surroundingthe heat flux transducer thereby promoting one-dimensionalheat flow through the heat flux transducer.3.2.2 R-squared (R2)coefficient of determination (alsoknown as “goodness of fit”) is a statistical measure of howclose the data are to the fitted line.3.2.3 sensitivitythe
19、ratio of the electrical output of the heatflux transducer to the heat flux passing through the devicewhen measured under steady-state heat flow.3.2.4 test stacka layer or a series of layers of material puttogether to comprise a test sample (for example, a roof systemcontaining a membrane, an insulat
20、ion, and a roof deck).3.3 Symbols:3.3.1 Emeasured HFT output voltage, V.3.3.2 qsteady-state heat flux, W/m2(Btu/hft2).3.3.3 Ssensitivity, V/(W/m2) (V/(Btu/hft2).3.3.4 uccombined standard uncertainty, V.3.3.5 u1standard uncertainty of the regression coefficients,V.3.3.6 u2standard uncertainty for rep
21、licate measurements,V.3.3.7 u3standard uncertainty for the measurement, V.4. Summary of Practice4.1 This practice presents three techniques for the labora-tory calibration of heat flux transducers (1)4: (1) ideallyguarded; (2) embedded; and, (3) surface mounted. Thesetechniques establish a hierarchy
22、 defined by the extent that theassumption of one-dimensional heat flow is satisfied (1).4.1.1 The ideally-guarded technique places the heat fluxtransducer (HFT) in a test stack consisting of homogeneous,thermally characterized materials that promotes one-dimensional heat flow normal to the planar di
23、mensions of theHFT. The results of this technique provide a baseline calibra-tion for the HFT.4.1.2 The embedded technique places the HFT within a teststack consisting of material layers identical, or comparable to,the building construction to be studied under application.4.1.3 The surface mounted c
24、alibration, which is the mostcomplex, places the HFT on the external surface of a test stackand incorporates environmental effects that cause lateral heatflow in the locality of the HFT.4.2 The calibration results are intended for use with PracticeC1046 to measure in-situ the heat flux through opaqu
25、e buildingcomponents and with Practice C1155 for the subsequentanalysis of the measurement data. The intended application ofthe HFT is used to determine the appropriate calibrationtechnique (2).4.2.1 If the HFT is to be embedded in the building envelope,the HFT shall be calibrated in a test stack of
26、 materials thatsimulate the surrounding construction materials.4.2.2 If the HFT is to be surface mounted on the buildingenvelope construction, the HFT shall be calibrated using a hotbox that is oriented similarly (horizontal, vertical, or inclined)as the measurement site.5. Significance and Use5.1 T
27、he application of HFTs and temperature sensors tobuilding envelopes provide in-situ data for evaluating thethermal performance of an opaque building component underactual environmental conditions, as described in PracticesC1046 and C1155. These applications require calibration of theHFTs at levels o
28、f heat flux and temperature consistent withend-use conditions.5.2 This practice provides calibration procedures for thedetermination of the heat flux transducer sensitivity, S, thatrelates the HFT voltage output, E, to a known input value ofheat flux, q.5.2.1 The applied heat flux, q, shall be obtai
29、ned fromsteady-state tests conducted in accordance with either TestMethod C177, C518, C1363,orC1114.5.2.2 The resulting voltage output, E, of the heat fluxtransducer is measured directly using (auxiliary) readout in-strumentation connected to the electrical output leads of thesensor.NOTE 1A heat flu
30、x transducer (see also Terminology C168) is a thinstable substrate having a low mass in which a temperature differenceacross the thickness of the device is measured with thermocouplesconnected electrically in series (that is, a thermopile). Commercial HFTstypically have a central sensing region, a s
31、urrounding guard, and anintegral temperature sensor that are contained in a thin durable enclosure.Practice C1046, Appendix X2 includes detailed descriptions of theinternal constructions of two types of HFTs.5.3 The HFT sensitivity depends on several factorsincluding, but not limited to, size, thick
32、ness, construction,temperature, applied heat flux, and application conditionsincluding adjacent material characteristics and environmentaleffects.5.4 The subsequent conversion of the HFT voltage output toheat flux under application conditions requires (1) a standard-ized technique for determining th
33、e HFT sensitivity for theapplication of interest; and, (2) a comprehensive understandingof the factors affecting its output as described in PracticeC1046.5.5 The installation of a HFT potentially changes the localthermal resistance of the test artifact and the resulting heat flowdiffers from that fo
34、r the undisturbed building component. Thefollowing techniques have been used to compensate for thiseffect.5.5.1 Ensure that the installation is adequately guarded (3).In some cases, an assumption is made that the change inthermal resistance is negligible, particularly for very thin HFTswith a large
35、surrounding guard, or is incalculable (1).5.5.2 For the embedded configuration, analytical and nu-merical methods have been used to account for the disturbanceof the heat flux due to the presence of the HFT. Such analysesare outside the scope of this practice but details are available inRefs (4-8).4
36、The boldface numbers in parentheses refer to the references at the end of thisstandard.C1130 1725.5.3 For the surface-mounted configuration, measurementerrors have been quantified by Trethowen (9). Empiricalcalibrations have also been determined by conducting a seriesof field calibrations or measure
37、ments. Such procedures areoutside the scope of this practice but details are available inOrlandi et al. (10) and Desjarlais and Tye (11).6. Specimen Preparation6.1 Preparation of the HFT, Test Stack, and Surface-Mounted Installation:6.1.1 HFTVerify the electrical continuity of the HFT andtemperature
38、 sensor. Where auxiliary readout instrumentation,that is, voltmeter, recorder, or data acquisition system, isneeded, the user shall provide appropriate provision for cali-bration. The instrumentation shall have a resolution capabilityof2V.6.1.2 Test StackPlace the HFT and temperature sensor inthe te
39、st stack located within the central metering area of theapparatus plates (Test Methods C177, C518,orC1114).6.1.3 Surface-MountedPlace the HFT and temperaturesensor in the central location of the metered area of the hot box(Test Method C1363).6.1.4 Sensor LeadsThe sensor output leads shall be placedi
40、n grooves or covered to minimize the presence of air gaps inthe test stack or surface mounted installation. The HFT neednot be physically adhered to the mask or embedding material.Thermally conductive gel or paste is applied, if necessary, toone or both faces of the heat flux transducer to improve t
41、hethermal contact.6.2 Ideally Guarded Configuration (One-dimensional HeatFlow):6.2.1 Refer to Fig. 1 for an illustration of the ideally-guarded stack configuration.6.2.2 Calibration of One HFTPlace the HFT and tempera-ture sensor in the center of a guard mask have the samethickness and thermal resis
42、tance as the HFT. The outerdimensions of the guard mask shall be the same size as theapparatus plates. Place the HFT/guard assembly between twolayers of high-density fibrous glass insulation board or otherhomogenous semirigid insulating material. It is recommendedthat the test stack have the smalles
43、t acceptable thickness andthermal resistance to minimize edge effects during testing.6.2.3 Calibration of multiple HFTsTo determine the sen-sitivity of multiple small heat flux transducers, replace theHFT/mask layer shown in Fig. 1 with a layer containing anarrangement of HFTs located within the met
44、ered area of theapparatus as illustrated in Fig. 2.NOTE 2The plate designs of some apparatus utilize a circulargeometry.6.3 Embedded Configuration:6.3.1 Consult Practice C1046 for details on the installationof the HFT within the building envelope component of interest.Construct the test stack to hav
45、e the same, or comparable,physical properties as the end-use application replicating thebuilding construction under evaluation. Place the HFT andtemperature sensor within the test stack in the same arrange-ment as intended in the end-use application.6.3.2 Refer to Fig. 3 for an illustration of an em
46、bedded stackconfiguration placed between the hot and cold apparatus plates.The example in Fig. 3 depicts a case where an HFT isembedded in gypsum wallboard and faces an insulated wallcavity. It is recommended that, when compressible materialsare present, rigid spacer stops or other means be utilized
47、 tomaintain a fixed plate separation during testing.6.4 Surface-Mounted Configuration:6.4.1 Consult Practice C1046 for details on the installationof the HFT to the surface of the building envelope componentof interest. Attach the HFT and temperature sensor to thesurface of a test panel having the sa
48、me, or comparable,physical properties as the building construction under evalua-tion replicating the end-use conditions. The test panel shallhave the same orientation (horizontal, vertical, or inclined) asthe building construction under evaluation.NOTE 3Trethowen (12) recommends mounting of the HFT
49、on interiorbuilding surfaces. Exterior mounting of the HFT need only be consideredFIG. 1 Ideally Guarded Test Configuration for One HFT (Side View)C1130 173if inside mounting is impossible.6.4.2 It is recommended that a guard mask be placed aroundthe HFT to compensate for local heat flux perturbations causedby the presence of the HFT. The guard mask shall have thesame emittance as the HFT. Guidance on the determination ofthe size of the guard mask is available in Burch et al. (3), vander Graaf (8), and Trethowen (9).6.4.3 Refer to Fig. 4 for an ill
