1、Designation: D2861 87 (Reapproved 2009)An American National StandardStandard Test Methods forFlexible Composites of Copper Foil with Dielectric Film orTreated Fabrics1This standard is issued under the fixed designation D2861; the number immediately following the designation indicates the year oforig
2、inal adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 These test methods cover procedures for testing flexiblemateria
3、ls consisting of copper foil combined with eitherdielectric film or with treated or impregnated fabric to formflexible composites used in the manufacture of flexible ormultilayer circuitry, or both.1.2 The procedures appear as follows:ASTMReferenceProcedure Section MethodConditioning 5Flex Life of t
4、he Composite 20-25Peel Strength of the Composite 11-19Specimen Preparation 6 D1825Strain Relief Due to Etching 26-32Testing of the Dielectric Portion ofthe Composite 7-10 D1825,D2305,D9021.3 The values stated in inch-pound units are to be regardedas standard. The values given in parentheses are math
5、ematicalconversions to SI units that are provided for information onlyand are not considered standard.1.4 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and he
6、alth practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D902 Test Methods for Flexible Resin-Coated Glass Fab-rics and Glass Fabric Tapes Used for Electrical InsulationD1711 Terminology Relating to Electrical InsulationD1825 P
7、ractice for Etching and Cleaning Copper-CladElectrical Insulating Materials and Thermosetting Lami-nates for Electrical TestingD2305 Test Methods for Polymeric Films Used for Electri-cal InsulationD6054 Practice for Conditioning Electrical Insulating Ma-terials for Testing3. Terminology3.1 Definitio
8、ns: For definitions of terms used in this stan-dard, refer to Terminology D1711.4. Selection of Test Specimens4.1 Select specimens for test from portions of material thatare free of obvious defects, unless the purpose of the test is toevaluate these defects.5. Conditioning5.1 Unless otherwise specif
9、ied, conduct all conditioning andtesting in the standard laboratory atmosphere specified inPractice D6054. Condition specimens at least 18 h beforetesting.6. Specimen Preparation6.1 Prepare specimens by etching without scrubbing, usingPractice D1825. The etching reagents described in PracticeD1825 m
10、ay be incompatible with some composite materials.The use of other reagents should be noted in the report for thetest involved.TESTING OF THE DIELECTRIC PORTION OF THECOMPOSITE7. Significance and Use7.1 The electrical and mechanical characteristics of circuitsproduced from flexible composites of copp
11、er foil with dielec-tric materials will to a large extent depend on the properties ofthe dielectric portion of the composite. Measurement of theseproperties is essential for predicting performance of the circuit.1These test methods are under the jurisdiction of ASTM Committee D09 onElectrical and El
12、ectronic Insulating Materials and are the direct responsibility ofSubcommittee D09.07 on Flexible and Rigid Insulating Materials.Current edition approved Oct. 1, 2009. Published February 2010. Originallyapproved in 1970. Last previous edition approved in 2004 as D2861 87(2004).DOI: 10.1520/D2861-87R
13、09.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM International, 100 Barr Harbor Drive, PO B
14、ox C700, West Conshohocken, PA 19428-2959, United States.8. Test Specimen8.1 Take specimens as required from a sample that has beenetched free of copper foil in accordance with Section 6. Takethe thickness from the material that remains after etching.9. Procedure9.1 If the dielectric portion of the
15、composite is a film, usethe procedures described in Test Methods D2305.9.2 If the dielectric portion of the composite is a treatedfabric, use the procedures described in Test Methods D902.10. Precision and Bias10.1 This test method has been in use for many years, but nostatement of precision has bee
16、n available and no activity isplanned to develop such a statement. A statement of bias is notapplicable in view of the lack of a standard reference materialfor this property.PEEL STRENGTH OF THE COMPOSITE11. Significance and Use11.1 The peel strength between copper foil and the dielectricmaterial de
17、termines to what degree the composite can with-stand processing and remain intact during service.11.2 Flexible composites generally require more elaboratemeans for proper support during peel testing than do rigid,copper-clad laminates. The selection of the proper procedurewill depend on the nature o
18、f the composite being tested, asshown by the following methods:11.2.1 Method A, Clamped Between Plates This testmethod is generally used when the material tested is not soflexible or slippery that it allows the substrate to deflect duringthe test.11.2.2 Method B, Using Adhesive Tape This test method
19、is used principally for its convenience, but is limited to caseswhere the peel strength of the material is not so great as toallow lifting of the substrate from the plate during removal ofthe copper.11.2.3 Method C, Free-turning DrumThis test method isalso primarily used for its convenience, and is
20、applicable whereit is desired to prevent lifting of the dielectric material from theplate during removal of the copper.12. Apparatus12.1 Force-Measuring InstrumentA strain gage, dial-typeforce meter, or similar instrument sensitive to 0.05 lbf (0.2 N).12.2 Chart Recorder (optional)recording instrume
21、nt ca-pable of converting the force measured in 12.1 to a graphicalrecord.12.3 Peeling MechanismA device capable of peeling thecopper from the dielectric at an angle of 90 to the specimen ata rate of 2 6 0.1 in. (50 6 3 mm)/min.12.4 Specimen HolderA device for clamping the speci-men flat and in the
22、correct position for testing with a minimumof the dielectric left unsupported. A device equivalent to thatshown in Fig. 1 is required.13. Test Specimen13.1 Unless otherwise specified, prepare the test specimensto be a 2.5-in. (62-mm) square of the composite on which thepattern shown in Fig. 2 is etc
23、hed in accordance with Section 6.The dielectric portion may be trimmed to conveniently fit theapparatus being used.13.2 Orient the pattern so that the long direction of thecopper strips is either machine direction or cross-machinedirection as required.14. Method AClamped Between Plates14.1 Clamp the
24、 test specimen between the plates as shownin Fig. 1. Mount the plate horizontally.14.2 Carefully initiate the removal of each of the copperstrips by lifting the12-in. (13-mm) land and peeling back toabout 1 in. (25 mm).14.3 Attach the free end of the strip to the force indicator bymeans of a clamp e
25、quipped with knurled jaws and a chain. Peelthe strip the remaining 1-in. (25-mm) length at a rate of 2.0 60.1 in. (50 6 3 mm)/min. Repeat for each copper strip.14.4 Determine the average peel force for each strip asfollows:14.4.1 If a recording instrument is used, determine theaverage peel force by
26、the midpoint of a straight line that bestfits the chart record.14.4.2 If no recording instrument is used, take a visualreading every 5 s during the peeling and average the readings.FIG. 1 Device for Holding Peel Specimen for Method AD2861 87 (2009)215. Method BUsing Adhesive Tape15.1 Attach the test
27、 specimen to a flat surface using asuitably backed pressure-sensitive adhesive tape. Mount thesurface horizontally. Apply the tape in such manner it extendsat least 0.2 in. (5 mm) beyond the edges of the copper strip,taking care to avoid the inclusion of dirt or air bubbles.15.2 Initiate removal of
28、the copper strip and peel in accor-dance with the procedure of 14.3 and determine the averagepeel force in accordance with 14.4.16. Method CFree-Turning Drum16.1 Select a test specimen 2.5 in. (62 mm) wide by 10 in.(250 mm) long. Wrap the specimen around a 3-in. (75-mm)diameter drum as shown in Fig.
29、 3, with the longer dimensionin the direction of winding. Position the tension bars andsprings as indicated.16.2 Initiate the removal of the copper strip and peel inaccordance with the procedure of 14.3 and determine theaverage peel force in accordance with 14.4.17. Calculation17.1 Divide the averag
30、e peel force in pounds-force (new-tons) by the width of the peeled strip in inches (millimetres) toobtain the average peel strength for the strip in pounds-forceper inch (newtons per millimetre) width.18. Report18.1 Report the following information:18.1.1 Material identification and specimen orienta
31、tion,whether machine- or cross-machine direction,18.1.2 The nature of the etching material, if different thanthat specified in Practice D1825,18.1.3 Conditioning, if different from that specified inSection 5,18.1.4 Method of recording the average peel force,18.1.5 Test method used, (A, B, or C), and
32、18.1.6 Peel strength values for each specimen.19. Precision and Bias19.1 This test method has been in use for many years, but nostatement of precision has been available and no activity isplanned to develop such a statement. A statement of bias is notapplicable in view of the lack of a standard refe
33、rence materialfor this property.FIG. 2 Peel Strength Test SpecimenFIG. 3 Drum-Type Peel Strength Jig for Method CD2861 87 (2009)3FLEX LIFE OF THE COMPOSITE20. Significance and Use20.1 Flexible copper foil composites are frequently used inapplications where repeated flexing occurs during assembly, or
34、during normal use, or both. The occurrence of a break in thecopper foil would render the material useless.21. Apparatus21.1 Flat Plates, two parallel nonconducting, with clampsso arranged that a motor-driven crank and connecting rod willoscillate one of the plates parallel to the other at no more th
35、an10 cpm with a 2-in. (50-mm) stroke.21.2 Mechanical Counter, arranged to record total numberof cycles.21.3 Low-Voltage Relay Circuit that will shut off the motorwhen a break occurs.22. Test Specimen22.1 Prepare rectangular specimens 2 by 5 in. (50 by 125mm) then etch the pattern shown in Fig. 4 in
36、accordance withSection 6. Cut the etched specimen lengthwise to provide a pairof specimens, each with 8 conductors.23. Procedure23.1 Attach leads to the lands in the test specimen andclamp the ends to opposite surfaces so that the conductors runparallel to the oscillation and a rolling loop is produ
37、ced on thespecimen without flexing it at the clamps. Adjust the apparatusso that the inside diameter of the rolling loop is14 6116 in.(6.4 6 1.6 mm). Connect the leads into the lowvoltage circuitso that a break in the pattern will stop the test. Run the test untila discontinuity occurs. Unless other
38、wise specified, the copperpattern shall be on the concave side of one specimen and on theconvex side of the other one in the pair. See Fig. 5.24. Report24.1 Report the following information:24.1.1 Material identification and specimen orientation,whether machine- or cross-machine direction,24.1.2 The
39、 nature of the etching material, if different thanthat specified in Practice D1825,24.1.3 Conditioning, if different than that specified in Sec-tion 5,24.1.4 The number of cycles until a break occurs, and24.1.5 Whether the copper pattern was on the concave orconvex side.25. Precision and Bias25.1 Th
40、is test method has been in use for many years, but nostatement of precision has been available and no activity isplanned to develop such a statement. A statement of bias is notapplicable in view of the lack of a standard reference materialfor this property.STRAIN RELIEF DUE TO ETCHING26. Significanc
41、e and Use26.1 Strains in the composite caused by shrinkage of thedielectric or by mechanical or thermal stresses during manu-facture of the composite may be relieved during etching awayof the copper or during subsequent drying, solvent washing, orsoldering steps. Such strain relief could lead to dis
42、tortion andmisregistration of etched circuit patterns, as well as wrinklingof the dielectric areas where the foil was removed.27. Apparatus27.1 Apparatus suitable for measuring distances of about 6in. (150 mm) between markings without application of distort-ing force on a specimen that is held flat.
43、 An optical comparatoris recommended. The degree of resolution of dimensionalreadings will largely determine the precision possible with thistest method.27.2 Ameans for maintaining the specimen in a flat positionwithout interfering with the dimensional reading, and withoutapplying distorting forces
44、parallel to the plane of the specimen.A perforated vacuum plate or a pair of transparent plates maybe used with success when an optical comparator is employed.28. Test Specimens28.1 Prepare 7-in. (175-mm) square test specimens of thecomposite to be tested.NOTE 1The dimensional tolerances apply to th
45、e negative or silkscreen used to generate the pattern.FIG. 4 Flexibility Test PatternFIG. 5 Diagram of Specimen Arrangement for Flexibility TestD2861 87 (2009)429. Procedure29.1 On the copper side of the specimen make four marks,numbered 1 to 4 clockwise at the four corners of a 6-in.(150-mm) square
46、 pattern centered on the specimen, using a felttip pen.29.2 Use a sharp-needle point to make a pin prick about0.005 in. (0.13 mm) in diameter at about the center of each ofthe marks in 29.1.29.3 Mount the specimen using the apparatus of 27.2 andobtain distance measurements with the apparatus of 27.1
47、.Record the distances between pin prick marks 1 and 2, 2 and 3,3 and 4, and 4 and 1.29.4 Use14-in. (6.4-mm) square pieces of etchant-resistantpressure-sensitive tape to mask the areas marked with the pinpricks. Add an extra square on the corner nearest the No. 1position to identify this position aft
48、er etching.29.5 Etch the specimen free of copper except wheremasked, using the procedure in Section 5. Remove the maskingmaterials without disturbing the pin prick marks.29.6 Repeat the measurements described in 29.3, using themasked corner to identify Position 1.29.7 Additional measurements may be
49、obtained after vari-ous other conditionings of the specimen as desired.30. Calculation30.1 Calculate the strain relief coefficient for each pair ofpoints as follows:S 5 D22 D1!/D1(1)where:S = strain relief, in./in. (mm/mm),D1= distance measured before etching, andD2= distance measured after etching and conditioning.31. Report31.1 Report the following information:31.1.1 Material identification,31.1.2 Conditioning, if other than specified in Section 4,31.1.3 Strain relief coefficients obtained from each pair ofpoints, and31.1.4 Material direction in which each coe
