1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor devicesPart 14-1: Semiconductor sensors Generic specification for sensorsBS IEC 60747-14-1:2010National forewordThis British Standard is the UK implementation of IE
2、C 60747-14-1:2010. Itsupersedes BS IEC 60747-14-1:2000 which is withdrawn.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purp
3、ort to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 62900 6ICS 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the Stand
4、ardsPolicy and Strategy Committee on 30 April 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS IEC 60747-14-1:2010IEC 60747-14-1Edition 2.0 2010-01INTERNATIONAL STANDARD NORME INTERNATIONALESemiconductor devices Part 14-1: Semiconductor sensors Generic specificat
5、ion for sensors Dispositifs semiconducteurs Partie 14-1: Capteurs semiconducteurs Spcification gnrique pour les capteurs INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE SICS 31.080.01 PRICE CODECODE PRIXISBN 2-8318-1073-0 Registered trademark of the International
6、 Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale BS IEC 60747-14-1:2010 2 60747-14-1 IEC:2010 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terminology, units, letter symbols, terms and definitions 6 3.1 Terminology, units and letter symbols6 3.2
7、 Terms and definitions 8 4 Standard environmental conditions.12 5 Marking 12 6 Quality assessment procedures12 6.1 General .12 6.2 Eligibility .12 6.3 Qualification approval procedure .13 7 Test and measurement procedures.18 7.1 Standard conditions and general precautions 18 7.2 Physical examination
8、.18 7.3 Climatic and mechanical tests .19 7.4 Alternative test methods19 Annex A (normative) Sampling procedures 20 Bibliography21 Figure 1 Output-measurand relationship of a linear-output sensor with an offset9 Figure 2 Hysteresis and repeatability. 11 Table 1 Measurands 6 BS IEC 60747-14-1:2010607
9、47-14-1 IEC:2010 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES Part 14-1: Semiconductor sensors Generic specification for sensors FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechn
10、ical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
11、 Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, gov
12、ernmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions
13、 or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for internatio
14、nal use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order t
15、o promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly
16、 indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodi
17、es. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property
18、 damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this
19、 publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or
20、all such patent rights. International Standard IEC 60747-14-1 has been prepared by subcommittee 47E: Discrete semiconductor devices, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition, published in 2000, and constitutes a technical revisi
21、on. The major changes with regard to the previous edition are as follows: a) Title change from “Semiconductor sensors - General and classification“ to “Semiconductor sensors - Generic specification for sensors“; b) Clause 3 has been divided into three Clauses 3, 4 and 5; c) Added new terms from IEC
22、60747-14-5; d) Added a new Clause relating to Quality assessment procedures; e) Added a Bibliography; f) Added a new Annex for the sampling procedure. BS IEC 60747-14-1:2010 4 60747-14-1 IEC:2010 The text of this standard is based on the following documents: FDIS Report on voting 47E/387/FDIS 47E/39
23、1/RVDFull information on the voting for the approval on this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The list of all parts of the IEC 60747 series, under the general title Semicon
24、ductor devices Discrete devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At th
25、is date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS IEC 60747-14-1:201060747-14-1 IEC:2010 5 SEMICONDUCTOR DEVICES Part 14-1: Semiconductor sensors Generic specification for sensors 1 Scope This part of IEC 60147-14 describes general items concernin
26、g the specifications for sensors, which are the basis for specifications given in other parts of this series for various types of sensors. Sensors described in this standard are basically made of semiconductor materials, however, the statements made in this standard are also applicable to sensors us
27、ing materials other than semiconductor, for example dielectric and ferroelectric materials. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest editi
28、on of the referenced document (including any amendments) applies. IEC 60027 (all parts), Letter symbols to be used in electrical technology IEC 60068-2 (all parts), Environmental testing Part 2: Tests IEC 60410, Sampling plans and procedures for inspection by attributes IEC 60617-DB, Graphical symbo
29、ls for diagrams IEC 60747-1:2006, Semiconductor devices Part 1: General IEC 60749 (all parts), Semiconductor device Test method of mechanical and environment test IEC 62047-1, Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions ISO 1000, SI units and recommendations f
30、or the use of their multiples and of certain other units ISO 2859-1, Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection IEC 61193-2, Quality assessment systems Part 2: Selection and use of sampling plans for i
31、nspection of electronic components and packages IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval procedures BS IEC 60747-14-1:2010 6 60747-14-1 IEC:2010 3 Terminology, units, letter symbols, terms and definitions 3.1 Terminology
32、, units and letter symbols For the purposes of this document, the terms and definitions given in IEC 62047-1 and the following apply. Units, graphical and letter symbols shall, wherever possible, be taken from the following standards: IEC 60027; IEC 60617; ISO 1000. Any other units, symbols or termi
33、nology peculiar to one of the devices covered by this generic specification shall be taken from the relevant IEC or ISO standards (see Clause 2) or derived in accordance with the principles of the standards listed above. Table 1 lists the measurands which are defined as the input quantities, propert
34、ies, or conditions that are to be detected or measured by sensors. For example if the measurand is heat, it is measured by a thermal sensor; if it is pressure, it is measured by a pressure sensor. The measurands, arranged in alphabetical order are: acoustic, biological, chemical, electrical, magneti
35、c, mechanical, optical, radiational, and thermal properties. Each entry in Table 1 not only represents the measurand itself, but also its temporal or spatial distribution. Table 1 Measurands 1 Acoustic 1.1 Wave amplitude, phase, polarization, spectrum 1.2 Wave velocity 1.3 Other (specify) 2 Biologic
36、al 2.1 Biomass (identities, concentrations, states) 2.2 Other (specify) 3 Chemical 3.1 Components (identities, concentrations, states) 3.2 Other (specify) 4 Electrical 4.1 Charge, current 4.2 Potential, potential difference 4.3 Electric field (amplitude, phase, polarization, spectrum) 4.4 Conductivi
37、ty BS IEC 60747-14-1:201060747-14-1 IEC:2010 7 4.5 Permittivity 4.6 Other (specify) 5 Magnetic 5.1 Magnetic field (amplitude, phase, polarization, spectrum) 5.2 Magnetic flux 5.3 Other (specify) 6 Mechanical 6.1 Position (linear, angular) 6.2 Velocity 6.3 Acceleration 6.4 Force 6.5 Stress, pressure
38、6.6 Strain 6.7 Mass, density 6.8 Moment, torque 6.9 Speed or flow, rate of mass transport 6.10 Shape, roughness, orientation 6.11 Stiffness, compliance 6.12 Viscosity 6.13 Crystallinity, structural integrity 6.14 Level (of liquid) 6.15 Other (specify) 7 Optical 7.1 Wave amplitude, phase, polarizatio
39、n, spectrum 7.2 Wave velocity 7.3 Other (specify) 8 Radiation 8.1 Type BS IEC 60747-14-1:2010 8 60747-14-1 IEC:2010 8.2 Energy 8.3 Intensity 8.4 Other (specify) 9 Thermal 9.1 Temperature 9.2 Flux 9.3 Specific heat 9.4 Thermal conductivity 9.5 Other (specify) 10 Humidity 10.1 Humidity, moisture 11 Ot
40、her (specify) 3.2 Terms and definitions 3.2.1 ambient conditions allowed specified tolerance which the sensor can perform, including temperature, acceleration, vibration, shock, ambient pressure (e.g. high altitudes), moisture, corrosive materials, and electromagnetic field IEC 60721-2-1 and IEC60 7
41、21-3-0 shall be referred to for basic conditions. 3.2.2 bias voltage or current that apply to signal electrode, etc., to decide action datum of sensor 3.2.3 full scale output upper limit of sensor output over the measuring range 3.2.4 full scale span FSS algebraic difference between the end points o
42、f the output. The upper limit of sensor output over the measuring range is called the full scale output (FSO), see Figure 1. This signal is the sum of the offset signal plus the full scale span 3.2.5 hysteresis maximum difference in output, at any measurand value, within the measuring range when the
43、 value is approached first with an increasing and then decreasing measurand (Figure 2). Hysteresis is expressed in percent of FSO during one calibration cycle BS IEC 60747-14-1:201060747-14-1 IEC:2010 9 3.2.6 input full scale upper limit of sensor input over the measuring range 3.2.7 linearity close
44、ness between the calibration curve and a specified straight line. There are two basic methods for calculating linearity: end point straight line fit or a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required ar
45、e burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculation are more straightforward for the user. The result is called the end-point or terminal linearity 3.2.8 long term stability ability that can keep feature
46、of sensor during certain period 3.2.9 measuring range set of values for a measurand for which the error of a measuring instrument is intended to lie within specified limits (Figure 1) NOTE 1 The upper and lower limits of the specified measuring range are sometimes called “maximum capacity” and “mini
47、mum capacity”, respectively. NOTE 2 In some other fields of knowledge, “range” is used to mean the difference between the greatest and the smallest values. 3.2.10 measurable temperature range temperature range that sensor can measure 3.2.11 offset output of a sensor, under room-temperature condition
48、 unless otherwise specified, with zero measurand applied (Figure 1) Measuring range 0 % 100 % Full scale output (FSO)Measurand (e.g pressure) Output (e.g. voltage) Fullscale span (FSS) 1 IEC 2462/09 Figure 1 Output-measurand relationship of a linear-output sensor with an offset BS IEC 60747-14-1:201
49、0 10 60747-14-1 IEC:2010 3.2.12 operating life minimum duration over which the sensor will operate, either continuously or over a number of on-off cycles whose duration is specified, without changing performance characteristics beyond specified tolerances 3.2.13 operating temperature range temperature range that sensor can operate in without giving damage in sensor normally 3.2.14 output quantity output is usually the electrical quantity produced
