1、BRITISH STANDARD BS IEC 60748-5:1997 Semiconductor devices Integrated circuits Part 5: Semicustom integrated circuits ICS 31.200BS IEC60748-5:1997 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards
2、Board and comes into effect on 15 August 1997 BSI 09-1999 ISBN 0 580 28093 4 National foreword This British Standard reproduces verbatim IEC 60748-5:1997 and implements it as the UK national standard. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductors
3、, to Subcommittee EPL/47/5, performance of semiconductors, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor rela
4、ted international and European developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. From 1January1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renu
5、mbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found i
6、n the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are r
7、esponsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the IEC title page, page ii, pages 1 to 19 and a back cover. This sta
8、ndard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBS IEC60748-5:1997 BSI 09-1999 i Contents Page National foreword Inside front cover
9、 Text of IEC 60748-5 1ii blankBS IEC60748-5:1997 ii BSI 09-1999 Contents Page Introduction 1 1 General 2 1.1 Scope 2 1.2 Normative references 3 2 Terminology and graphical symbols 3 2.1 General remark 3 2.2 Terms related to semicustom integrated circuits 3 2.3 Graphical symbols for semicustom integr
10、ated circuits 4 3 Essential data of semicustom integrated circuits from supplier 5 3.1 General remark 5 3.2 Circuit identification and types 5 3.3 Application related description 5 3.4 Specification of the functional description of library elements 5 3.5 Limiting values (absolute maximum rating syst
11、em) 6 3.6 Recommended operating conditions (within the specified operating temperature range) 6 3.7 Electrical characteristics of library elements 7 3.8 Additional information 8 4 Measuring methods 8 4.1 General remark 8 4.2 Specific requirements 8 4.3 Static characteristics 9 4.4 Dynamic characteri
12、stics 9 5 Acceptance and reliability 9 5.1 Electrical endurance tests 9 5.2 Environment tests 9 5.3 Failure analysis procedure 9 6 Design aspects 9 6.1 General remarks 9 6.2 Library (approved by supplier) 9 6.3 Computer aided engineering (CAE) design hardware 9 6.4 CAE design software 9 7 User/suppl
13、ier interface 11 7.1 Concept of user/supplier design interface 11 7.2 User/supplier typical interface documents 12 8 Essential data of semicustom integrated circuits released for production 13 8.1 General remark 13 8.2 Application related description 13 8.3 Design aspects 13 Annex A (informative) Fo
14、rms used for the activity in user/supplier interface 15 Figure 1 Family tree of integrated circuits 2 Figure 2 Example of timing diagram 8 Table 1 Examples of limiting values 6 Table 2 Examples of recommended operating conditions 6 Table 3 Examples of static characteristics 7 Table 4 Examples of cap
15、acitances 8 Table 5 Typical interface levels between user and supplier 11 Table 6 User/supplier typical interface documents for semicustom ICs 12 Table 7 Example of the type of terminals 13BS IEC60748-5:1997 BSI 09-1999 1 Introduction As a rule, it will be necessary to use IEC60747-1 and IEC60748-1
16、in conjunction with this part of IEC60748. In this part of IEC60748 the user will find all basic information on: terminology; graphical symbols; essential ratings and characteristics; functional specification; measuring method; acceptance and reliability; design aspects; user/supplier interface. The
17、 sequence of the clauses is in accordance with IEC60747-1, Chapter III, subclause2.1.BS IEC60748-5:1997 2 BSI 09-1999 1 General 1.1 Scope This part of IEC60748 specifies standards on the subcategories of semicustom integrated circuits that appear in the following classification family tree of ICs(se
18、eFigure 1). NOTEThis family tree is not exhaustive and may be completed when necessary. Figure 1 Family tree of integrated circuitsBS IEC60748-5:1997 BSI 09-1999 3 1.2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisio
19、ns of this part of IEC60748. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC60748 are encouraged to investigate the possibility of applying the most recent editions of the normative do
20、cuments indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60617-12:1991, Graphical symbols for diagrams Part 12: Binary logic elements. Amendment 1:1992 Amendment 2:1994 IEC 60617-13:1993, Graphical symbols for diagrams Part 13: Analogue eleme
21、nts. IEC 60747-1:1983, Semiconductor devices Discrete devices and integrated circuits Part 1: General. Amendment 1:1991 Amendment 2:1993 IEC 60748-1:1984, Semiconductor devices Integrated circuits Part 1: General. Amendment 1:1991 Amendment 2:1993 IEC 60748-2:1985, Semiconductor devices Integrated c
22、ircuits Part 2: Digital integrated circuits. Amendment 1:1991 Amendment 2:1993 IEC 60748-3:1986, Semiconductor devices Integrated circuits Part 3: Analogue integrated circuits. Amendment 1:1991 Amendment 2:1994 IEC 60748-4:1987, Semiconductor devices Integrated circuits Part 4: Interface integrated
23、circuits. Amendment 1:1991 Amendment 2:1994 IEC 60748-11:1990, Semiconductor devices Integrated circuits Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Amendment 1:1995 2 Terminology and graphical symbols 2.1 General remark See IEC60748-2, chapterII
24、I. 2.2 Terms related to semicustom integrated circuits 2.2.1 ASIC an integrated circuit designed for specific applications 2.2.2 cell-based integrated circuits an integrated circuit having one or more pre-characterized cells or macros selectively placed on a chip that can subsequently be connected w
25、ith other on-chip circuit elements in an automated chip-layout process to produce an electrical function NOTEThis definition covers both traditional standard-cell design as well as evolving cell-based designs. 2.2.3 semicustom integrated circuit an integrated circuit consisting of pre-characterized
26、circuits, cells and macros that can be electronically captured in an automated chip-layout process to produce a circuit for a specific applicationBS IEC60748-5:1997 4 BSI 09-1999 2.2.4 full custom integrated circuit a full custom IC may be designed for only one user or it may be designed for only on
27、e application (e.g. some special telecommunication circuits) 2.2.5 gate array An integrated circuit containing a fixed topology of circuit elements used to form macro cells and macro functions that are or may be interconnected to implement a logic function. 2.2.5.1 channelled gate array a gate array
28、 consisting of pre-characterized circuit elements (cells and/or macros) that are in chip regions separated from the regions intended to be used for interconnection 2.2.5.2 sea of gates a gate array consisting of pre-characterized circuit elements (cells and/or macros) that can be covered by intercon
29、nection circuitry. In a sea of gates layout, the interconnect region is created by sacrificing rows of gates 2.2.5.3 circuit element a basic constituent part of a circuit, exclusive of interconnections. Examples include resistors, capacitors and transistors 2.2.6 cell A pre-characterized circuit ele
30、ment with specific layout and interconnection terminals to implement an electrical function. 2.2.6.1 standard cell a cell with fixed physical and electrical characteristics established by the supplier 2.2.6.2 basic cell a cell that consists of several transistors and passive elements to facilitate i
31、ntegration 2.2.7 macro A collection of cells with specific electrical connectivity whose characteristics are derived from the characteristics of its composing cells. NOTEThis definition includes super integration, which comprises one or more pre-characterized huge type of cells or macros. 2.2.7.1 ha
32、rd macro a characterized fixed layout and interconnection of primitives that implement an electrical function NOTECharacterization may be made either by measurement of fabricated devices or by computer simulation or by both. Characterization may include the following aspects: physical dimensions, lo
33、gic functionality, testability, layout rule compliance and reliability. 2.2.7.2 soft macro an interconnection of primitives and/or macro cells that implements an electrical function but has no predetermined physical layout 2.2.7.3 users macro a macro that is provided by the user 2.3 Graphical symbol
34、s for semicustom integrated circuits Under consideration.BS IEC60748-5:1997 BSI 09-1999 5 3 Essential data of semicustom integrated circuits from supplier 3.1 General remark This clause gives the minimum data for semicustom integrated circuits established by the supplier, such as gate arrays or stan
35、dard cells. 3.2 Circuit identification and types 3.2.1 Designation and types If the device belongs to a functional or electrical category, that shall be stated. Functional and electrical categories can be digital, analogue, mixed digital and analogue or digital interface circuits. 3.2.2 General func
36、tion description When the semicustom integrated circuit makes use of a series, it shall be stated. The main functional features including the maximum number of available gates, RAM, ROM, MPU and/or functional blocks shall be stated. In addition, the die size and the number of available bonding pads
37、shall be given. 3.2.3 Process technology The process technology of monolithic integrated circuits shall be stated such as CMOS, bipolar, BICMOS etc., also type and number of interconnection layers, as well as for CMOS the (drawn) gate length, and optionally, the (effective) channel length. 3.3 Appli
38、cation related description 3.3.1 Main application If necessary, the main application shall be stated. Any restrictions for application shall be stated. 3.3.2 Package identification The IEC and/or national reference number of the outline drawing or drawing of a nonstandard package, including terminal
39、 numbering and the principal package material, for example, ceramic, plastic, etc., shall be stated. A minimum and maximum chip size range shall be stated for each package. If necessary, the thermal resistance shall be specified. 3.4 Specification of the functional description of library elements 3.
40、4.1 Detailed block diagram of basic cells (cell features) The function of the basic cells may be referenced to applicable data books or design manuals, including their revisions. A detailed block diagram or equivalent circuit information of the basic cells shall be given. Depending on the function,
41、the description shall be given in accordance with chapter III of each of the following publications: IEC60748-2, IEC60748-3, and IEC60748-4. The graphical symbols for the function shall be given. This may be obtained from a catalogue of standardized graphical symbols or designed according to the rul
42、es of IEC60617-12 or IEC60617-13. 3.4.1.1 Hard macros The main function of the hard macros shall be described. All hard macros shall be listed, including the physical dimensions. All additional information, such as available number and possible locations of the hard macros, shall be given. 3.4.1.2 S
43、oft macros The main function of the soft macros shall be described, and the number of the different basic cells shall be given. 3.4.2 Identification and function of terminals Each predefined terminal shall be identified, and the restriction of its use shall be indicated.BS IEC60748-5:1997 6 BSI 09-1
44、999 3.5 Limiting values (absolute maximum rating system) These values apply over the operating temperature range, unless otherwise specified. Limiting values are not for inspection purposes. Unless otherwise specified, limiting values shall be given as follows: Any cautionary statement unique to the
45、 integrated circuit shall be included. It shall be specified if any interdependence of limiting values exist. All conditions for which the limiting values apply shall be stated. If externally connected and/or attached elements, for example heat-sinks, have an influence on the values of the ratings,
46、the ratings shall be prescribed for the integrated circuit with the elements connected and/or attached. If minimum and/or maximum values are quoted, it shall be indicated whether they are absolute or algebraic. If transient overloads are permitted, their magnitude and duration shall be specified. Al
47、l voltages are referenced to a specified reference terminal (V SS , GND, etc.). Table 1 Examples of limiting values 3.6 Recommended operating conditions (within the specified operating temperature range) These conditions are not to be inspected, but may be used for quality assessment purposes. All v
48、oltages are referenced to a specified reference terminal (V SS , GND, etc.). Table 2 Examples of recommended operating conditions Parameters (note 1) Symbols Min. Max. Unit Supply voltage V CC , V DD , V SS , V EE X X V Supply current, where appropriate I CC , I DD , I SS , I EE X mA input voltage V
49、 I X X V Input current I I X X mA Forced output voltage V O , forced X X V Output current I O X X mA Power dissipation P D X W Storage temperature T STG X X C Junction temperature, where appropriate T j X C Soldering temperature, where appropriate T SLD X C Soldering duration, where appropriate (note 2) t SLD X s NOTE 1Any other limiting conditions such as current duration, frequency, mounting method, temperature dependence of the ratings, etc., shall be stated, where appropriate. NOTE 2Max
